Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

Abstract: A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. Inkjet-type sprayers are configured to spray cooling fluid down on the chip. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device. The cooling system uses cooling fluid surface tension forces to draw liquid cooling fluid up a porous member from the spray chamber back to the sprayers, to be sprayed again. The cooling system uses gravity and/or pressure within the spray chamber to direct vaporized cooling fluid upward from the spray chamber to a condenser. The condenser is configured to cool and condense the vapor. A reservoir is positioned below the condenser and above the sprayers so as to receive condensed vapor from the condenser and feed it to the sprayers.

Abstract: A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. The cooling system uses thermal inkjet sprayers to spray the chip(s) in the spray chamber with cooling fluid. The cooling system includes a combined reservoir and condenser. Liquid and gaseous cooling fluid travel or are pumped from the spray chamber to the reservoir. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device.

Abstract: A cooling arrangement facilitates the cooler and quieter operation of an electronic system located within an enclosure, wherein the electronic system includes a plurality of circuit boards having a plurality of integrated circuit elements disposed within a lower portion of the enclosure. In one embodiment, the cooling arrangement includes a pump located within the enclosure that has a first and second coolant ports and a heat exchanger that is disposed within a top portion of the enclosure and is coupled to the first coolant port. The cooling arrangement also includes a thermally conductive member having a first surface and a second surface, the first surface being in thermal contact with at least one of the integrated circuit elements. A first cooling plate arrangement having a coolant channel with a first end coupled to the second coolant port and a second end coupled to the heat exchanger.

Abstract: The invention provides a chassis member, which may be made of a cast material such as magnesium, aluminum, or plastic, for mechanically supporting a heat producing electronic device in which the chassis member has a base and a cavity integral to the chassis member. In a preferred embodiment, the cavity is in the form of a channel that is created by boring. The channel may be evacuated and has an evaporator section, a condenser section, and a working fluid confined therein by a seal. The channel receives heat from an electronic device in an evaporator section of the channel and dissipates heat from the condenser section of the channel. Different types of wicks may be employed. In one embodiment, a completely fabricated heat pipe is inserted into the integrated channel. In other embodiments, a cavity in the form of a heat dissipating channel matrix, serpentine shape, flat shape, or in other forms or shapes are provided.

Abstract: A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.

Abstract: A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.

Abstract: Disclosed herein is a cooling device primarily for cooling integrated circuits or other electronic devices during operation. The cooling device may include a heat sink portion having a plurality of cooling vanes and a heat pipe chamber. Both the cooling vanes and the heat pipe chamber may be integrally formed within the heat sink portion. Because the heat pipe chamber is integrally formed with the cooling vanes, no joints exist between the condensing surface of the heat pipe chamber and the cooling vanes. This, in turn, allows extremely rapid and efficient heat transfer between the heat pipe chamber and the cooling vanes. The cooling device may include extensions of the main heat pipe chamber which project into each of the cooling vanes. In this manner, the condensing surface of the heat pipe chamber is actually moved into the vanes at a position very close to the surface of the vanes where heat transfer into the atmosphere occurs.

Abstract: A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.

Abstract: A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roil bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.

Abstract: An improved cooling apparatus and related method are disclosed for air-cooling an array of electronic components mounted on a substrate. The cooling apparatus directs high-speed jets of cooling air directly at special heat sinks bonded to the particular electronic components that generate the most heat (e.g., microprocessors), with the air thereafter being directed to flow tangentially across the remaining components, to air-cool those components, as well. This configuration enables the requisite component cooling to be achieved with substantially reduced air flow rates and with heat sinks of substantially reduced size, as compared to prior cooling apparatus.

Abstract: A low-cost high aspect ratio skived heatsink with high performance ducting in order to optimize airflow over and through the skived fins. The skived heatsink can additionally have formed channels or extruded holes for insertion of a heatsink pipe therein. A thermally enhanced compound is used between the heatsink and heatpipe to provide a low thermal resistance between the parts. The heatpipe is expanded to optimally fill the channel or hole by injecting pressured fluid into the pipe before sealing the pipe with working fluid, or via heating of a sealed pipe and expansion of the working fluid therein. A partitioned cooling system can additionally be used, one partitioned section having high volume airflow with low static pressure, and another partitioned section using higher velocity ducted air over a plurality of skived heatsinks.