Patents by Inventor Chang An Chu

Chang An Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROCESSOR FOR USE IN DYNAMIC REFRESH RATE SWITCHING AND RELATED ELECTRONIC DEVICE
    Publication number: 20160078838
    Abstract: A processor for use in an electronic device capable of displaying, having capability of switching a refresh rate for refreshing a display panel. The processor can dynamically transition between different states/scenarios in response to different triggering events. The processor can include an image stream consumer, configured to receive an input image stream and outputting an output image stream; a refresh rate selection controller, configured to select a refresh rate from a plurality of refresh rates in response to a monitoring of a current state/scenario; and a display controller, configured to receive the output image stream from the image stream consumer and transmit image data in the output image stream to a driving device, and in response to the selection by the refresh rate selection controller, control the driving device to refresh a display panel with the selected refresh rate.
    Type: Application
    Filed: September 10, 2015
    Publication date: March 17, 2016
    Inventors: Hao-Ting Huang, Chien-Chou Ko, Chang-Chu Liu, Shu-Wen Teng, Ta-Lun Huang, Chun-Wei Ku
  • PROCESSOR FOR USE IN DYNAMIC REFRESH RATE SWITCHING AND RELATED ELECTRONIC DEVICE AND METHOD
    Publication number: 20160078846
    Abstract: A processor for use in an electronic device is provided. The electronic device is capable of displaying and the processor has capability of switching a refresh rate for refreshing a display panel of the display device. The processor comprises: a refresh rate selection controller and a display controller. The refresh rate selection controller is configured to dynamically select one from a plurality refresh rates. The display controller is configured to control a driving device to refresh the display panel with the selected refresh rate and determine whether to adjust a data transmission rate over an interface between the processor and the driving device according to the selected refresh rate.
    Type: Application
    Filed: August 21, 2015
    Publication date: March 17, 2016
    Inventors: Chang-Chu Liu, Shu-Wen Teng, Ta-Lun Huang, Chun-Wei Ku, Chien-Chou Ko, Hao-Ting Huang
  • THERMOELECTRIC GENERATION APPARATUS FOR VEHICLE
    Publication number: 20160064636
    Abstract: A thermoelectric generation apparatus for a vehicle using waste heat of an engine is provided. The thermoelectric generation apparatus includes a conduction block that has a high thermal conductivity and is disposed between an engine and an exhaust manifold. A first thermoelectric element module is configured to generate an electromotive force from a difference between temperatures of opposite ends of the first thermo electric element. In addition, the first thermoelectric element is disposed at one side of the conduction block. Accordingly, thermoelectric generation efficiency of the first thermoelectric element module is increased by minimizing heat loss of the waste heat gas discharged from the engine.
    Type: Application
    Filed: April 10, 2015
    Publication date: March 3, 2016
    Inventors: Su Jung Noh, Kyong Hwa Song, Han Saem Lee, In Chang Chu, Gyong Bok Kim, In Woong Lyo, Jin Woo Kwak
  • Heat dissipation device for electronic controllers
    Patent number: 9273912
    Abstract: A heat dissipation device for electronic controllers, is provided and includes a housing that has a hollow portion into which a working fluid for heat transfer and dissipation is filled. The housing of the electronic controller is formed to have the hollow portion using the material containing the heat-conductive filler and the heat transfer working fluid is filled in the hollow portion, to improve the cooling efficiency and achieving the weight reduction. By forming the condensation unit that condenses the vaporized working fluid in the upper end portion relative to the working fluid filled in the hollow portion of the housing, the heat exchange effect of the working fluid may be maximized.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: March 1, 2016
    Assignee: Hyundai Motor Company
    Inventors: Jin Woo Kwak, Kyong Hwa Song, Gyung Bok Kim, In Chang Chu
  • 3D integrated circuit and methods of forming the same
    Patent number: 9257399
    Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: February 9, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen
  • Automated Identification And Assembly Of Shoe Parts
    Publication number: 20150374073
    Abstract: Manufacturing and assembly of a shoe or a portion of a shoe is enhanced by automated placement and assembly of shoe parts. For example, a part-recognition system analyzes an image of a shoe part to identify the part and determine a location of the part. Once the part is identified and located, the part can be manipulated by an automated manufacturing tool.
    Type: Application
    Filed: July 20, 2015
    Publication date: December 31, 2015
    Inventors: Patrick Conall Regan, Kuo-Hung Lee, Chih-Chi Chang, Ming-Feng Jean, Chang-Chu Liao
  • Apparatus and Method for Wafer Level Bonding
    Publication number: 20150357226
    Abstract: A system for and a method of bonding a first wafer to a second wafer are provided. A second wafer chuck has a second surface, a profile of the second surface being adjustable by a profile control layer. The first wafer is placed on a first surface of a first wafer chuck, and the second wafer is placed on the second surface of the second wafer chuck. The first wafer and the second wafer are warped prior to bonding to form a first warped wafer and a second warped wafer, respectively. The first warped wafer is bonded to the second warped wafer.
    Type: Application
    Filed: June 6, 2014
    Publication date: December 10, 2015
    Inventors: Ping-Yin Liu, Yen-Chang Chu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee
  • Backside Illuminated Photo-Sensitive Device With Gradated Buffer Layer
    Publication number: 20150349160
    Abstract: A photo-sensitive device includes a uniform layer, a gradated buffer layer over the uniform layer, a silicon layer over the gradated buffer layer, a photo-sensitive light-sensing region in the uniform layer and the silicon layer, a device layer on the silicon layer, and a carrier wafer bonded to the device layer.
    Type: Application
    Filed: August 12, 2015
    Publication date: December 3, 2015
    Inventors: Yu-Hung Cheng, Chia-Shiung Tsai, Cheng-Ta Wu, Xiaomeng Chen, Yen-Chang Chu, Yeur-Luen Tu
  • Backside illuminated photo-sensitive device with gradated buffer layer
    Patent number: 9153717
    Abstract: A method for forming a backside illuminated photo-sensitive device includes forming a gradated sacrificial buffer layer onto a sacrificial substrate, forming a uniform layer onto the gradated sacrificial buffer layer, forming a second gradated buffer layer onto the uniform layer, forming a silicon layer onto the second gradated buffer layer, bonding a device layer to the silicon layer, and removing the gradated sacrificial buffer layer and the sacrificial substrate.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: October 6, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Hung Cheng, Yen-Chang Chu, Cheng-Ta Wu, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen
  • AUTOMATED ASSEMBLY AND STITCHING OF SHOE PARTS
    Publication number: 20150201711
    Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated manner. For example, shoe parts may be retrieved and temporarily assembled according to preset relative positions to form part stacks. The part stacks may be retrieved with the relative positioning of the shoe parts being maintained and placed at a stitching machine for more permanent attachment via stitching of the parts to form a shoe assembly. Movement during stitching of a conveyance mechanism that transfers the part stack from the stacking surface to the stitching machine and movement of a needle associated with the stitching machine may be controlled by a shared control mechanism such that the movements are synchronized with respect to one another. Vision systems may be leveraged to achieve movement and position information between and at machines and locations.
    Type: Application
    Filed: January 23, 2014
    Publication date: July 23, 2015
    Applicant: NIKE, INC.
    Inventors: DRAGAN JURKOVIC, KUO-HUNG LEE, YEN-HSI LIU, HUNG-YU WU, CHANG-CHU LIAO
  • Automated identification and assembly of shoe parts
    Patent number: 9084451
    Abstract: Manufacturing and assembly of a shoe or a portion of a shoe is enhanced by automated placement and assembly of shoe parts. For example, a part-recognition system analyzes an image of a shoe part to identify the part and determine a location of the part. Once the part is identified and located, the part can be manipulated by an automated manufacturing tool.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: July 21, 2015
    Assignee: NIKE, Inc.
    Inventors: Patrick Conall Regan, Kuo-Hung Lee, Chih-Chi Chang, Ming-Feng Jean, Chang-Chu Liao
  • Pick-Up Tool With Integrated Light Source
    Publication number: 20150176981
    Abstract: Acquisition or pick-up tools that themselves aid in improving the ease with which images of an acquired substrate may be captured are provided. The pick-up tools may include a pick-up surface adapted to interface with a foreign substrate and a light source integrated with the pick-up tool such that light emitted from the light source passes through the pick-up surface to the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface to create a silhouette of the foreign substrate. A vision system may be adapted for capturing the silhouette of the foreign substrate when the foreign substrate is temporarily coupled with the pick-up surface. The substrate pick-up surface may be formed of one of a transparent, a semi-transparent, or a translucent material such that light may at least partially pass there through.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 25, 2015
    Applicant: Nike, Inc.
    Inventors: Patrick Conall Regan, John Matthew Farren, Howard Fu, Dragan Jurkovic, Chih-Chi Chang, Kuo-Hung Lee, Chang-Chu Liao, Harsha Prahlad
  • WEB FOR ABSORBING ELECTROMAGNETIC WAVE AND HOUSING OF ELECTRONIC PARTS USING THE SAME
    Publication number: 20150181775
    Abstract: An electromagnetic wave-absorbing web for controlling interference by electromagnetic wave at a low frequency band generated from various electric and electronic parts and for securing strength without added material and achieving lightweight is provided. The web is manufactured of a mixture solution in the form of a fabric having a mesh structure, wherein the mixture solution is made by mixing a conductive nanomaterial, a magnetic nanofiller, a binder, and a solvent.
    Type: Application
    Filed: August 25, 2014
    Publication date: June 25, 2015
    Inventors: In Chang CHU, Jin Woo KWAK
  • Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
    Publication number: 20150171050
    Abstract: A method embodiment includes patterning an opening through a layer at a surface of a device die. The method further includes forming a liner on sidewalls of the opening, patterning the device die to extend the opening further into the device die. After patterning the device die, the liner is removed. A conductive pad is formed in the device die by filling the opening with a conductive material.
    Type: Application
    Filed: December 18, 2013
    Publication date: June 18, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu
  • Image Sensor Comprising Reflective Guide Layer and Method of Forming the Same
    Publication number: 20150115382
    Abstract: Various structures of image sensors are disclosed, as well as methods of forming the image sensors. According to an embodiment, a structure comprises a substrate comprising photo diodes, an oxide layer on the substrate, recesses in the oxide layer and corresponding to the photo diodes, a reflective guide material on a sidewall of each of the recesses, and color filters each being disposed in a respective one of the recesses. The oxide layer and the reflective guide material form a grid among the color filters, and at least a portion of the oxide layer and a portion of the reflective guide material are disposed between neighboring color filters.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Yen-Chang Chu, Shyh-Fann Ting, Ching-Chun Wang
  • 3D Integrated Circuit and Methods of Forming the Same
    Publication number: 20150108644
    Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.
    Type: Application
    Filed: October 17, 2013
    Publication date: April 23, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen
  • POLYSACCHARIDE-BASED HYDROGELS AND HYBRID HYDROGELS AND PRECURSORS THEREOF, METHODS OF MAKING SAME, AND USES THEREOF
    Publication number: 20150111812
    Abstract: Hydrogels and hybrid hydrogels, methods of making the hydrogels/hybrid hydrogels, and methods of using the hydrogels/hybrid hydrogels. The hydrogels have polysaccharide moieties (e.g., chitosan or hyaluronic acid moieties). The hybrid hydrogels have polysaccharide moieties (e.g., chitosan or hyaluronic acid moieties) and poly(ester amide) moieties. The poly(ester amide) moieties can have one or more arginine moieties. The hydrogels/hybrid hydrogels can be used, for example, in consumer products and as cargo carrier materials (e.g., as therapeutic agent carriers).
    Type: Application
    Filed: May 31, 2013
    Publication date: April 23, 2015
    Inventors: Chih-Chang Chu, DeQun Wu, Mingyu He
  • STRUCTURE FOR POWER ELECTRONIC PARTS HOUSING OF VEHICLE
    Publication number: 20150104678
    Abstract: A structure for a housing of a power electronic part of a vehicle, particularly the battery, having varying thermal conductivity, the housing having insulation properties for solving heat dissipation and heat insulation problems. and controlling thermal conductivity depending on a surrounding environment is disclosed. The housing is manufactured with a hollow portion, configured to be filled with ellipsoidal magnetic particles coated with electrical insulation-type thermal conductive particles on their surfaces, and a containing a liquid fill in a state of being mixed with each other. Thermal conductivity is controlled by changing orientation of magnetic particles according to direction of a magnetic field applied by a magnetic field generating member.
    Type: Application
    Filed: December 13, 2013
    Publication date: April 16, 2015
    Applicant: Hyundai Motor Company
    Inventors: Jin Woo KWAK, Kyong Hwa SONG, In Chang CHU
  • SYSTEM FOR CONTROLLING THERMAL CONDUCTIVITY OF ELECTRONIC PARTS HOUSING
    Publication number: 20150101352
    Abstract: A system for controlling thermal conductivity of a housing of an electronic part is provided. In particular, liquid is disposed within a hollow portion formed between an external wall body and an internal wall body of the housing and a magnetic field generating member is attached to an outer surface of the internal wall body. Insulating magnetic particles are dispersed in the liquid, and an orientation of the insulating magnetic particles is changed according to a direction of a magnetic field applied by the magnetic field generating member. This, as a result, controls the thermal conductivity of the housing.
    Type: Application
    Filed: December 11, 2013
    Publication date: April 16, 2015
    Applicant: HYUNDAI MOTOR COMPANY
    Inventors: Jin Woo Kwak, Kyong Hwa Song, Gyung Bok Kim, In Chang Chu
  • Multiamino acid-based poly(ester amide)s
    Patent number: 8993686
    Abstract: Biodegradable saturated and unsaturated polyester amides (PEA)s made from multiamino acid monomers and methods of making biodegradable saturated and unsaturated PEAs.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: March 31, 2015
    Assignee: Cornell University
    Inventors: Chih-Chang Chu, Mingxiao Deng