Patents by Inventor Chang An Chu

Chang An Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THEREOF
    Publication number: 20200135538
    Abstract: In a method of manufacturing a semiconductor device, a first interlayer dielectric (ILD) layer is formed over a substrate, a chemical mechanical polishing (CMP) stop layer is formed over the first ILD layer, a trench is formed by patterning the CMP stop layer and the first ILD layer, a metal layer is formed over the CMP stop layer and in the trench, a sacrificial layer is formed over the metal layer, a CMP operation is performed on the sacrificial layer and the metal layer to remove a portion of the metal layer over the CMP stop layer, and a remaining portion of the sacrificial layer over the trench is removed.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 30, 2020
    Inventors: Tsai-Ming HUANG, Wei-Chieh HUANG, Hsun-Chung KUANG, Yen-Chang CHU, Cheng-Che CHUNG, Chin-Wei LIANG, Ching-Sen KUO, Jieh-Jang CHEN, Feng-Jia SHIU, Sheng-Chau CHEN
  • Shoe buffing system
    Patent number: 10617177
    Abstract: An apparatus for buffing a shoe part includes a housing adapted to be articulated around at least a portion of the footwear part. A rotating spindle is positioned in the housing and has a buffing surface for engagement with the footwear part. A carriage is slideably connected to the housing and holds the spindle such that the buffing surface can be moved closer to and further away from the footwear part. An actuator is in the housing and in contact with the carriage. The actuator applies force to the carriage to increase the force of the buffing surface onto the footwear part. A biasing member is in the housing and in contact with the carriage. The biasing member exerts force onto the carriage in a direction opposite the force exerted by the actuator.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: April 14, 2020
    Assignee: NIKE, Inc.
    Inventors: Dragan Jurkovic, Shih-Yuan Wu, Chia-Wei Chang, Wen-Ruei Chang, Chien-Chun Chen, Chang-Chu Liao, Chia-Hung Lin
  • Heat releasing composite and water cooling battery system including the same
    Patent number: 10622689
    Abstract: A heat releasing composite which is a heat releasing interface material inserted between battery cells and a cooling channel, comprising at least one of an elastomer layer including elastomer and white oil; a filler layer including a thermally conductive filler; and an insulating layer.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: April 14, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: In-Chang Chu
  • Bendable device
    Patent number: 10613592
    Abstract: A bendable device includes a base housing, a first housing, a second housing, a third housing, and a plurality of first resilient members. The base housing has two sides that are symmetrical to each other. The first housing is pivotally connected to one of the two sides of the base housing by a first pivot. The second housing is pivotally connected to the base housing and the first housing by the first pivot. The third housing is pivotally connected to the base housing, the first and second housings by the first pivot. The first resilient members are pivotally connected to any adjacent two of the base housing, the first, second, and third housings respectively. The first, second, and third housings rotate about the first pivot relative to the base housing to have the bendable device into a folded state or an expanded state selectively.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: April 7, 2020
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Pin-Chang Chu, Chin-Yao Hsu, Chia-Chen Chen, Cheng-Tai Ho
  • Image Sensor Device and Method
    Publication number: 20200006408
    Abstract: A system and method for forming pixels in an image sensor is provided. In an embodiment, a semiconductor device includes an image sensor including a first pixel region and a second pixel region in a substrate, the first pixel region being adjacent to the second pixel region. A first anti-reflection coating is over the first pixel region, the first anti-reflection coating reducing reflection for a first wavelength range of incident light. A second anti-reflection coating is over the second pixel region, the second anti-reflection coating reducing reflection for a second wavelength range of incident light that is different from the first wavelength range.
    Type: Application
    Filed: September 12, 2019
    Publication date: January 2, 2020
    Inventors: Yen-Chang Chu, Yeur-Luen Tu, Cheng-Yuan Tsai
  • CHEMICAL MECHANICAL POLISHING SYSTEM AND METHOD
    Publication number: 20190291236
    Abstract: The present disclosure relates to a chemical mechanical polishing (CMP) pad, and an associated method to perform a CMP process. In some embodiments, the CMP pad comprises a polishing layer having a front surface with protruding asperities while a back surface being planar. A film electrode is attached to the back surface of the polishing layer and is isolated from the front surface of the polishing layer.
    Type: Application
    Filed: June 13, 2019
    Publication date: September 26, 2019
    Inventors: Chin-Wei Liang, Hsun-Chung Kuang, Yen-Chang Chu
  • Poly(ester amide) macromers and polymers thereof
    Patent number: 10421843
    Abstract: Amino acid-based poly(ester amide) (PEA) macromers (e.g., functional PEA macromers) and methods for preparing amino acid-based poly(ester amide) (PEA) macromers. The functional PEA macromers can comprise functional groups such as hydroxyl, amine, sulfonic acids, carboxyl, thiol and acryloyl at the two terminuses of the PEA macromers. The content of the terminal functional groups on the macromers can be precisely controlled by adjusting the molar ratio of reactive monomers. The resulting versatility of these new functional PEA macromers can be used to fabricate a wide range of PEAs and PEA hybrid derivatives with very different chemical, physical, mechanical, thermal and biological properties. The functional PEA macromers can also be polycondensed into forming block PEA polymers.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: September 24, 2019
    Assignee: Cornell University
    Inventors: Chih-Chang Chu, Mingxiao Deng
  • Image Sensor Comprising Reflective Guide Layer and Method of Forming the Same
    Publication number: 20190252451
    Abstract: Various structures of image sensors are disclosed, as well as methods of forming the image sensors. According to an embodiment, a structure comprises a substrate comprising photo diodes, an oxide layer on the substrate, recesses in the oxide layer and corresponding to the photo diodes, a reflective guide material on a sidewall of each of the recesses, and color filters each being disposed in a respective one of the recesses. The oxide layer and the reflective guide material form a grid among the color filters, and at least a portion of the oxide layer and a portion of the reflective guide material are disposed between neighboring color filters.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Yen-Chang Chu, Shyh-Fann Ting, Ching-Chun Wang
  • Chemical mechanical polishing system and method
    Patent number: 10350726
    Abstract: The present disclosure relates to a chemical mechanical polishing (CMP) system, and an associated method to perform a CMP process. In some embodiments, the CMP system has a rotatable wafer carrier configured to hold a wafer face down to be processed. The CMP system also has a polishing layer attached to a polishing platen and having a front surface configured to interact with the wafer to be processed, and a CMP dispenser configured to dispense a slurry between an interface of the polishing layer and the wafer. The slurry contains charged abrasive particles therein. The CMP system also has a film electrode attached to a back surface of the polishing layer opposite to the front surface. The film electrode is configured to affect movements of the charged abrasive particles through applying an electrical field during the operation of the CMP system.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: July 16, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin-Wei Liang, Hsun-Chung Kuang, Yen-Chang Chu
  • Automated Identification And Assembly Of Shoe Parts
    Publication number: 20190133258
    Abstract: Manufacturing and assembly of a shoe or a portion of a shoe is enhanced by automated placement and assembly of shoe parts. For example, a part-recognition system analyzes an image of a shoe part to identify the part and determine a location of the part. Once the part is identified and located, the part can be manipulated by an automated manufacturing tool.
    Type: Application
    Filed: January 3, 2019
    Publication date: May 9, 2019
    Inventors: Patrick Conall Regan, Kuo-Hung Lee, Chih-Chi Chang, Ming-Feng Jean, Chang-Chu Liao
  • Image sensor comprising reflective guide layer and method of forming the same
    Patent number: 10269857
    Abstract: Various structures of image sensors are disclosed, as well as methods of forming the image sensors. According to an embodiment, a structure comprises a substrate comprising photo diodes, an oxide layer on the substrate, recesses in the oxide layer and corresponding to the photo diodes, a reflective guide material on a sidewall of each of the recesses, and color filters each being disposed in a respective one of the recesses. The oxide layer and the reflective guide material form a grid among the color filters, and at least a portion of the oxide layer and a portion of the reflective guide material are disposed between neighboring color filters.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: April 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Yen-Chang Chu, Shyh-Fann Ting, Ching-Chun Wang
  • Backside Illuminated Photo-Sensitive Device with Gradated Buffer Layer
    Publication number: 20190058070
    Abstract: A photo-sensitive device includes a uniform layer, a gradated buffer layer over the uniform layer, a silicon layer over the gradated buffer layer, a photo-sensitive light-sensing region in the uniform layer and the silicon layer, a device layer on the silicon layer, and a carrier wafer bonded to the device layer.
    Type: Application
    Filed: October 22, 2018
    Publication date: February 21, 2019
    Inventors: Yu-Hung Cheng, Chia-Shiung Tsai, Cheng-Ta Wu, Xiaomeng Chen, Yen-Chang Chu, Yeur-Luen Tu
  • Automated identification and assembly of shoe parts
    Patent number: 10194716
    Abstract: Manufacturing and assembly of a shoe or a portion of a shoe is enhanced by automated placement and assembly of shoe parts. For example, a part-recognition system analyzes an image of a shoe part to identify the part and determine a location of the part. Once the part is identified and located, the part can be manipulated by an automated manufacturing tool.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: February 5, 2019
    Assignee: NIKE, Inc.
    Inventors: Patrick Conall Regan, Kuo-Hung Lee, Chih-Chi Chang, Ming-Feng Jean, Chang-Chu Liao
  • 3D Integrated Circuit and Methods of Forming the Same
    Publication number: 20190035681
    Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.
    Type: Application
    Filed: October 2, 2018
    Publication date: January 31, 2019
    Inventors: Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen
  • Conductive pad structure for hybrid bonding and methods of forming same
    Patent number: 10177106
    Abstract: A representative device includes a patterned opening through a layer at a surface of a device die. A liner is disposed on sidewalls of the opening and the device die is patterned to extend the opening further into the device die. After patterning, the liner is removed. A conductive pad is formed in the device die by filling the opening with a conductive material.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: January 8, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu
  • CHEMICAL MECHANICAL POLISHING SYSTEM AND METHOD
    Publication number: 20180361529
    Abstract: The present disclosure relates to a chemical mechanical polishing (CMP) system, and an associated method to perform a CMP process. In some embodiments, the CMP system has a rotatable wafer carrier configured to hold a wafer face down to be processed. The CMP system also has a polishing layer attached to a polishing platen and having a front surface configured to interact with the wafer to be processed, and a CMP dispenser configured to dispense a slurry between an interface of the polishing layer and the wafer. The slurry contains charged abrasive particles therein. The CMP system also has a film electrode attached to a back surface of the polishing layer opposite to the front surface. The film electrode is configured to affect movements of the charged abrasive particles through applying an electrical field during the operation of the CMP system.
    Type: Application
    Filed: June 19, 2017
    Publication date: December 20, 2018
    Inventors: Chin-Wei Liang, Hsun-Chung Kuang, Yen-Chang Chu
  • Shoe Buffing System
    Publication number: 20180325219
    Abstract: An apparatus for buffing a shoe part includes a housing adapted to be articulated around at least a portion of the footwear part. A rotating spindle is positioned in the housing and has a buffing surface for engagement with the footwear part. A carriage is slideably connected to the housing and holds the spindle such that the buffing surface can be moved closer to and further away from the footwear part. An actuator is in the housing and in contact with the carriage. The actuator applies force to the carriage to increase the force of the buffing surface onto the footwear part. A biasing member is in the housing and in contact with the carriage. The biasing member exerts force onto the carriage in a direction opposite the force exerted by the actuator.
    Type: Application
    Filed: May 14, 2018
    Publication date: November 15, 2018
    Inventors: Dragan Jurkovic, Shih-Yuan Wu, Chia-Wei Chang, Wen-Ruei Chang, Chien-Chun Chen, Chang-Chu Liao, Chia-Hung Lin
  • METHODS AND SYSTEMS FOR ELECTROADHESION-BASED MANIPULATION IN MANUFACTURING
    Publication number: 20180326596
    Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 15, 2018
    Inventors: Harsha PRAHLAD, Richard J. CASLER, Susan KIM, Matthew LEETTOLA, Jon SMITH, Kenneth TAN, Patrick WANG, John Mathew FARREN, Patrick Conall REGAN, Po Cheng CHEN, Howard FU, Dragan JURKOVIC, Aishwarya VARADHAN, Chang-Chu LIAO, Chih-Chi CHANG, Kuo-Hung LEE, Ming-Feng JEAN
  • METHODS AND SYSTEMS FOR COMBINED NEGATIVE PRESSURE AND ELECTROADHESION-BASED MANIPULATION IN MANUFACTURING
    Publication number: 20180319020
    Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 8, 2018
    Inventors: Harsha PRAHLAD, Richard J. CASLER, Susan KIM, Matthew LEETTOLA, Jon SMITH, Kenneth TAN, Patrick WANG, John Mathew FARREN, Patrick Conall REGAN, Po Cheng CHEN, Honam KO, Dragan JURKOVIC, Aishwarya VARADHAN, Tsung Tai CHIEN, Chang-Chu LIAO, Chih-Chi CHANG, Kuo-Hung LEE, TaeHoun KIM
  • METHODS AND SYSTEMS FOR ELECTROADHESION-BASED MANIPULATION AND MECHANICAL RELEASE IN MANUFACTURING
    Publication number: 20180319019
    Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 8, 2018
    Inventors: Harsha PRAHLAD, Richard J. CASLER, Susan KIM, Matthew LEETTOLA, Jon SMITH, Kenneth TAN, Patrick WANG, John Mathew FARREN, Patrick Conall REGAN, Po Cheng CHEN, Howard FU, Honam KO, Dragan JURKOVIC, Aishwarya VARADHAN, Tsung Tai CHIEN, Chang-Chu LIAO, Chih-Chi CHANG, Kuo-Hung LEE, Ming-Feng JEAN, TaeHoun KIM, Qingde CHEN, Greg MILLER