Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.

Abstract: A method for manufacturing a DRAM includes: forming a hard mask layer on a substrate with an opening therein; forming a dielectric layer on a sidewall of the opening; forming a first barrier layer and a first conductor layer in the opening; performing a first dry etching and a first wet etching processes to respectively partially remove the first barrier layer and the first conductor layer, to expose the dielectric layer on upper sidewall; forming a second barrier layer in the opening; forming a mask layer in the opening to cover the second barrier layer; removing a part of the second barrier layer and the mask layer to expose the dielectric layer on the upper sidewall of the opening; and forming a second conductor layer in the opening.

Abstract: A docking station may include a first communication port to couple the docking station to a target computing device, a rotatable plate, and a fixed plate. The docking station may be rotatably coupled to the target computing device about the first communication port via the rotatable plate and the fixed plate.

Abstract: The disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin. The disclosure also relates to a method for making the liquid cooling heat exchanger.

Abstract: A multi-thermal characteristic heat sink fin, comprising a first heat spreading plate, a second heat spreading plate, and a primary heat spreading plate is provided. A plurality of multi-thermal characteristic heat sink fins is assembled together to form a heat sink, further having at least a heat pipe assembled therethrough, and a base plate, assembled to the at least a heat pipe and in contact with a heat source. The primary heat spreading plate is sandwiched and enclosed within the first and second heat spreading plates, hindering debris, contaminants, and moisture from entering the surface interfaces therebetween. The material of the heat pipes and primary heat spreading plate is different from that of the first and second heat spreading plates. No heat treatment process of two or more different materials is required for assembly of the multi-thermal characteristic heat sink fin and at least a heat pipe assembled thereto.

Abstract: A multi-thermal characteristic heat sink fin, comprising a first heat spreading plate, a second heat spreading plate, and a primary heat spreading plate is provided. A plurality of multi-thermal characteristic heat sink fins is assembled together to form a heat sink, further having at least a heat pipe assembled therethrough, and a base plate, assembled to the at least a heat pipe and in contact with a heat source. The primary heat spreading plate is sandwiched and enclosed within the first and second heat spreading plates, hindering debris, contaminants, and moisture from entering the surface interfaces therebetween. The material of the heat pipes and primary heat spreading plate is different from that of the first and second heat spreading plates. No heat treatment process of two or more different materials is required for assembly of the multi-thermal characteristic heat sink fin and at least a heat pipe assembled thereto.

Abstract: A docking station may include a first communication port to couple the docking station to a target computing device, a rota table plate, and a fixed plate. The docking station may be rotatably coupled to the target computing device about the first communication port via the rota table plate and the fixed plate.

Abstract: The disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin. The disclosure also relates to a method for making the liquid cooling heat exchanger.

Abstract: A liquid cooling heat sink structure includes a thermal conduction module configured to dissipate heat and including a heat exchange unit; a cover coupled to the thermal conduction module and enclosing the heat exchange unit, the cover and the thermal conduction module defining a heat exchange chamber that includes the heat exchange unit, the cover defining a first opening and a second opening, and the cover being coupled to the thermal conduction module such that at least one of the first and second openings is above the heat exchange unit; a flow guidance plate disposed on the cover; and a housing disposed on the flow guidance plate and defining a first cavity and a second cavity fluidly isolated from each other, wherein the housing includes two fluid inlets each in fluid communication with the first cavity, and a fluid outlet in fluid communication with the second cavity.

Abstract: A combined heat sink has multiple dissipation fins serially mounted together. Each one of the dissipation fins has a body and two flanges. The body has at least one through hole formed through the body. The two flanges are respectively formed on one of two surfaces of the body, and have at least one connecting arm. Multiple protrusions protrude on the at least one connecting arm, and a width of the at least one through hole is smaller than a total width of the at least one connecting arm and the multiple protrusions. When the multiple dissipation fins are mounted together, the protrusions of the at least one connecting arm of each dissipation fin pass through the at least one through hole of an adjacent one of the dissipation fins, and abut an area near the at least one through hole to avoid separations of the dissipation fins.

Abstract: An assemblable cooling fin assembly includes a plurality of cooling fins. Each of the cooling fins includes a base plate, a first side plate, a second side plate and a first engaging protrusion. The base plate has a first engaging slot. The first side plate and the second side plate are respectively connected to two opposite sides of the base plate. The first engaging protrusion has a connecting end and a deformable end opposite to each other. The connecting end is connected to the first side plate. In addition, the first engaging protrusion of one of the plurality of cooling fins is disposed through the first engaging slot of another one of the plurality of cooling fins, and the deformable end of the first engaging protrusion is deformed so as to become wider than the first engaging slot.

Abstract: An assemblable cooling fin assembly includes a plurality of cooling fins. Each of the cooling fins includes a base plate, a first side plate, a second side plate and a first engaging protrusion. The base plate has a first engaging slot. The first side plate and the second side plate are respectively connected to two opposite sides of the base plate. The first engaging protrusion has a connecting end and a deformable end opposite to each other. The connecting end is connected to the first side plate. In addition, the first engaging protrusion of one of the plurality of cooling fins is disposed through the first engaging slot of another one of the plurality of cooling fins, and the deformable end of the first engaging protrusion is deformed so as to become wider than the first engaging slot.

Abstract: A liquid cooling heat sink structure and its cooling circulation system include a thermal conduction module, and a liquid supply module, and the liquid supply module is installed on the thermal conduction module and has a containing space for receiving plural fins of the thermal conduction module, and the liquid supply module has a continuous surrounding peripheral wall oriented in a plurality of directions facing towards the outside of the liquid supply module, and the peripheral wall has two first liquid opening and a second liquid opening, and the two first liquid opening are disposed at positions of the peripheral wall in any two facing directions respectively.

Abstract: A liquid cooling system includes a liquid cooling head, a fixing member and a radiator. The fixing member is disposed on the liquid cooling head. The radiator is disposed on the liquid cooling head through the fixing member. The radiator moves with respect to the liquid cooling head between at least two different positions through the fixing member.

Abstract: A combined heat sink has multiple dissipation fins serially mounted together. Each one of the dissipation fins has a body and two flanges. The body has at least one through hole formed through the body. The two flanges are respectively formed on one of two surfaces of the body, and have at least one connecting arm. Multiple protrusions protrude on the at least one connecting arm, and a width of the at least one through hole is smaller than a total width of the at least one connecting arm and the multiple protrusions. When the multiple dissipation fins are mounted together, the protrusions of the at least one connecting arm of each dissipation fin pass through the at least one through hole of an adjacent one of the dissipation fins, and abut an area near the at least one through hole to avoid separations of the dissipation fins.

Abstract: A liquid cooling heat sink structure includes a thermal conduction module configured to dissipate heat and including a heat exchange unit; a cover coupled to the thermal conduction module and enclosing the heat exchange unit, the cover and the thermal conduction module defining a heat exchange chamber that includes the heat exchange unit, the cover defining a first opening and a second opening, and the cover being coupled to the thermal conduction module such that at least one of the first and second openings is above the heat exchange unit; a flow guidance plate disposed on the cover; and a housing disposed on the flow guidance plate and defining a first cavity and a second cavity fluidly isolated from each other, wherein the housing includes two fluid inlets each in fluid communication with the first cavity, and a fluid outlet in fluid communication with the second cavity.

Abstract: The disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin.

Abstract: A liquid cooling system includes a liquid cooling head, a radiator, a first support member and a second support member. The liquid cooling head has at least one first outlet and at least one first inlet. The radiator has a second outlet and a second inlet. The first support member has at least one first end portion connected to the first outlet, a second end portion pivotally connected to the second inlet, and at least one first passage. The second support member has at least one third end portion connected to the first inlet, a fourth end portion pivotally connected to the second outlet, and at least one second passage. The first and second support members support the radiator and the radiator is capable of rotating with respect to the liquid cooling head by the second and fourth end portions.

Abstract: The present application provides a heat dissipating module, a heat dissipating system and a circuit module. The heat dissipating module adapted to be used with a heat element. The heat dissipating module comprises a heat exchanger which has a heat exchanging zone contacted with the heat element; a securing structure; and a fluid driving unit which is communicated with the heat exchanger for guiding a working fluid into the heat exchanger and is secured to the heat exchanger by the securing structure, wherein the fluid driving unit and the second heat exchanger are separately installed and communicated with each other.

Abstract: A liquid cooling system includes a liquid cooling head, a fixing member and a radiator. The fixing member is disposed on the liquid cooling head. The radiator is disposed on the liquid cooling head through the fixing member. The radiator moves with respect to the liquid cooling head between at least two different positions through the fixing member.