LIQUID COOLING HEAT EXCHANGER
The disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin.
This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 201720232080.2 filed in China on Mar. 10, 2017, the entire contents of which are hereby incorporated by reference.
TECHNICAL FIELDThe disclosure relates to a heat dissipation technique and a heat dissipation device, more particularly to a liquid cooling heat exchanger which is able to be produced through a continuous production line.
BACKGROUNDGenerally, electronic devices require a heat dissipation device to remove heat in order to reduce the temperature in the electronic devices thereby extending its lifespan. The heat exchanger is an important part in the heat dissipation device, it is directly in contact with the heat source in the electronic devices, and it can remove the heat by coolant flowing therethrough.
There is a high demand in liquid tightness of the heat exchanger because the coolant flows through the heat exchanger. Usually, a liquid cooling heat exchanger has a top plate, a bottom plate and a fin that are jointed together. In order to do so, these components are connected by a soldering process or brazing process. During the soldering process, a solder material (e.g. tin paste) having a low melting point is coated between the components and to heat the solder material by a temperature higher than its melting point, the heated solder material becomes fluent and will fill the gap between the plates with the help of capillary effect, and then the plates will be bonded to each other when the solder material is solidified. During the brazing process, the plates are preliminary positioned by a jig, and then the plates are put into a vacuum furnace and heated up to their melting point or to a temperature higher than the melting point of the solder material so as to bond the plates.
However, in these processes, the soldering flux is difficult to be removed, and this directly affect the bonding quality. In addition, it requires to repeatedly perform the above processes to bond all of the components of the liquid cooling heat exchanger; that is, the conventional liquid cooling heat exchanger cannot be produced through a continuous production line, result in decrease of yield rate.
SUMMARYAccordingly, the present disclosure provides a liquid cooling heat exchanger which is able to be produced through a continuous production line, all the components of the liquid cooling heat exchanger are bonded together so as to improve the bonding quality, and the components can be bonded through a continuous production line so as to increase the yield of the liquid cooling heat exchanger.
One embodiment of the disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin.
One embodiment of the disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to from a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin.
One embodiment of the disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate comprising a base plate and a bonding layer coated on the base plate, wherein the base plate of the first cover plate is thermally bonded to the second cover plate via the bonding layer, and the bonding layer of the first cover plate has a melting point lower than a melting point of the base plate of the first cover plate.
One embodiment of the disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate comprising a base plate and a bonding layer stacked on the base plate, wherein the base plate and the bonding layer are made of a material selected from a group consisting of a metal and an alloy thereof, the base plate of the first cover plate is thermally bonded to the second cover plate via the bonding layer, and the bonding layer of the first cover plate has a melting point lower than melting points of the base plate of the first cover plate, the second cover plate and the fin.
According to the liquid cooling heat exchanger as discussed in above, the components in the liquid cooling heat exchanger are able to be bonded to each other through a single process because they are coated with the bonding layer, and the bonding layer is very thin, so the components are closely connected to each other so as to improve the bonding quality, and this enables the liquid cooling heat exchanger to be produced through a continuous production line, thereby increasing the yield of the liquid cooling heat exchanger.
The present disclosure will become better understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only and thus are not intending to limit the present disclosure and wherein:
In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known main structures and devices are schematically shown in order to simplify the drawing.
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In some embodiments, the first cover plate 110 has two openings 113A and 113B which can be connected to a coolant piping of the heat dissipation device (not shown in figures) to allow the coolant to flow into the chamber between the first cover plate 110 and the second cover plate 120 through one of the openings to remove heat on the fin 130 and then to exist the chamber through the other opening. For example, the coolant can enter the liquid cooling heat exchanger 100 through the opening 113A and exist the liquid cooling heat exchanger 100 through the opening 113B. It is noted that the shapes of the openings are not restricted. For example,
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As discussed above, the base plate 141 and the bonding layer 142 covering the base plate 141 can be made of a particular metal or the alloy thereof, and the metal is aluminum in the above embodiments. However, the present disclosure is not limited thereto. For example, in some other embodiments, the metal may be gold, silver, or copper.
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Moreover, except the bonding layer of the composite material, the first cover plate 110, the second cover plate 120 or the fin 130 in the figures may be bonded via the composite material and a solder material (e.g. tin paste) at the same time. For example, in some other embodiments, the first cover plate 110 may be made of the composite material, and the bonding layer between the second cover plate 120 and the fin 130 may be formed from the solder material. Alternatively, in another embodiment, the second cover plate 120 may be made of the composite material, and the bonding layer between the first cover plate 110 and the fin 130 may be formed from the solder material.
In other words, the bonding layers of the first cover plate 110, the second cover plate 120 and the fin 130 exist before assembling the first cover plate 110, the second cover plate 120 and the fin 130. When it is attempt to assemble the first cover plate 110, the second cover plate 120 and the fin 130, one can thermally bond the bonding layers of the first cover plate 110 and the second cover plate 120 and thermally bond the bonding layers of the second cover plate 120 and the fin 130.
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It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure. It is intended that the specification and examples be considered as exemplary embodiments only, with a scope of the disclosure being indicated by the following claims and their equivalents.
Claims
1. A liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin.
2. The liquid cooling heat exchanger according to claim 1, wherein the fin is bonded on the second cover plate, and there is a gap between the first cover plate and the fin.
3. The liquid cooling heat exchanger according to claim 1, wherein there is a bonding layer on parts of the first cover plate, the second cover plate and the fin where the first cover plate, the second cover plate and the fin are not in contact with one another.
4. The liquid cooling heat exchanger according to claim 1, wherein at least one of the first cover plate and the second cover plate have a central area protruding outward to form the chamber.
5. The liquid cooling heat exchanger according to claim 1, wherein the first cover plate and the second cover plate each have a plurality of bores along an edge thereof.
6. The liquid cooling heat exchanger according to claim 1, further comprising a fastener near an edge of the first cover plate, the fastener is a rivet nut, and there is a bonding layer between the fastener and the first cover plate.
7. The liquid cooling heat exchanger according to claim 1, wherein the first cover plate has two openings connected to the chamber.
8. A liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to from a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin.
9. The liquid cooling heat exchanger according to claim 8, further comprising a fastener near an edge of the first cover plate, the fastener is a rivet nut, and there is a bonding layer between the fastener and the first cover plate.
10. A liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate comprising a base plate and a bonding layer coated on the base plate, wherein the base plate of the first cover plate is thermally bonded to the second cover plate via the bonding layer, and the bonding layer of the first cover plate has a melting point lower than a melting point of the base plate of the first cover plate.
11. The liquid cooling heat exchanger according to claim 10, wherein there is a gap between the first cover plate and the fin.
12. The liquid cooling heat exchanger according to claim 10, wherein the second cover plate comprises a base plate and a bonding layer coated on the base plate, the bonding layer of the second cover plate has a melting point lower then melting point of the base plate of the first cover plate and the base plate of the second cover plate, the base plate of the first cover plate and the base plate of the second cover plate are thermally bonded to each other via the bonding layer of the first cover plate and the bonding layer of the second cover plate.
13. The liquid cooling heat exchanger according to claim 12, wherein the fin comprises a base plate and a bonding layer coated on the base plate, the bonding layer of the fin has a melting point lower than melting points of the base plate of the first cover plate, the base plate of the second cover plate and the base plate of the fin, and the base plate of the fin and the base plate of the second cover plate are thermally bonded to each other via the bonding layer of the fin and the bonding layer of the second cover plate.
14. The liquid cooling heat exchanger according to claim 10, wherein at least one of the first cover plate and the second cover plate have a central area protruding outward to form the chamber.
15. The liquid cooling heat exchanger according to claim 10, wherein the first cover plate and the second cover plate each have a plurality of bores along an edge thereof.
16. The liquid cooling heat exchanger according to claim 10, further comprising a fastener near an edge of the first cover plate, the fastener is a rivet nut, and there is a bonding layer between the fastener and the first cover plate.
17. The liquid cooling heat exchanger according to claim 10, wherein the first cover plate has two openings connected to the chamber.
18. A liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate comprising a base plate and a bonding layer stacked on the base plate, wherein the base plate and the bonding layer are made of a material selected from a group consisting of a metal and an alloy thereof, the base plate of the first cover plate is thermally bonded to the second cover plate via the bonding layer, and the bonding layer of the first cover plate has a melting point lower than melting points of the base plate of the first cover plate, the second cover plate and the fin.
19. The liquid cooling heat exchanger according to claim 18, wherein the fin is bonded to the second cover plate, and there is a gap between the first cover plate and the fin.
20. The liquid cooling heat exchanger according to claim 18, wherein the base plate is covered by the bonding layer.
21. The liquid cooling heat exchanger according to claim 18, wherein the second cover plate comprises a base plate and a bonding layer coated on the base plate, the bonding layer of the second cover plate has a melting point lower than melting points of the base plate of the first cover plate and the base plate of the second cover plate, the base plate of the second cover plate and the bonding layer of the second cover plate are respectively made of materials selected from a group consisting of a metal and an alloy thereof, the base plate of the first cover plate and the base plate of the second cover plate are thermally bonded to each other via the bonding layer of the first cover plate and the bonding layer of the second cover plate.
22. The liquid cooling heat exchanger according to claim 21, wherein the base plate of the second cover plate is covered by the bonding layer of the second cover plate.
23. The liquid cooling heat exchanger according to claim 21, wherein the fin comprises a base plate and a bonding layer coated on the base plate, the bonding layer of the fin has a melting point lower then melting points of the base plate of the first cover plate, the base plate of the second cover plate and the base plate of the fin, the base plate of the second cover plate and the bonding layer of the second cover plate are respectively made of materials selected from a group consisting of a metal and an alloy thereof, the base plate of the fin and the base plate of the second cover plate are bonded to each other via the bonding layer of the fin and the bonding layer of the second cover plate.
24. The liquid cooling heat exchanger according to claim 23, wherein the base plate of the fin is covered by the bonding layer of the fin.
25. The liquid cooling heat exchanger according to claim 18, wherein at least one of the first cover plate and the second cover plate have a central area protruding outward to form the chamber.
26. The liquid cooling heat exchanger according to claim 18, wherein the first cover plate and the second cover plate each have a plurality of bores along an edge thereof.
27. The liquid cooling heat exchanger according to claim 18, further comprising a fastener near an edge of the first cover plate, the fastener is a rivet nut, and there is a bonding layer between the fastener and the first cover plate.
28. The liquid cooling heat exchanger according to claim 18, wherein the first cover plate has two openings connected to the chamber.
Type: Application
Filed: Mar 9, 2018
Publication Date: Sep 13, 2018
Inventors: Chang-Han Tsai (New Taipei), Shui-Fa Tsai (New Taipei)
Application Number: 15/916,412