Abstract: A photopolymerization initiator is provided. The photopolymerization initiator contains at least one unsaturated double bond and at least one oxime ester group in the molecule. The photopolymerization initiator comprises a compound represented by Formula 1 or 2: wherein R1 and R2 are each independently —CH3, —C2H5, —C3H7 or —C6H5; wherein R3, R4 and R5 are each independently —CH3, —C2H5, —C3H7 or —C6H5. Further provided is a photosensitive resin composition comprising the photopolymerization initiator. The use of the photosensitive resin composition in photolithography reduces the formation of volatile residue during post-development baking.

Abstract: The present invention relates to a polymer resin compound including a new polycyclic compound, and a photosensitive resin composition including the polymer resin compound as an effective binder matrix. In particular, the photosensitive resin composition according to the present invention uses a polymer resin compound, which includes a compound having double cyclic structure in one molecule as a monomer, as a binder matrix. Accordingly, the photosensitive resin composition has an excellent photosensitivity and an excellent developing property, and has a low distortion property during plastic processing. For this reason, the photosensitive resin composition has an advantage of curing various transparent photosensitive materials used to manufacture a color filter of a liquid crystal display, for example, a column spacer, an overcoat, a passivation material, and the like.

Abstract: The present invention relates to a photosensitive composition comprising a triazine-based photoactive compound containing oxime ester. The photosensitive composition according to the present invention has good sensitivity, retention rate, mechanical strength, heat resistance, chemical resistance and developing durability since it contains, as photopolymerization initiator, a compound having an oxime ester group and a triazine group in one molecule and thus effectively absorbs UV radiation. Therefore, the photosensitive composition according to the present invention is advantageous not only in curing of materials for color filters, resin black matrixes, column spacers, overcoats and passivation films of liquid crystal displays, but also in high temperature process characteristics.

Abstract: The present invention relates to a triazine based photoactive compound containing an oxime ester group. The compound according to the present invention is a photoactive compound containing both an oxime ester group and a triazine group in one molecule, has excellent radical-generating efficiency due to effective absorption of UV radiation, particularly i-line (365 nm) radiation and can function as an effective initiator for photopolymerization of various compounds containing unsaturated groups, particularly an acryl compound.

Abstract: Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective injection of mold resin through a corner gate controlled by a gate block whereby the flow of the mold resin is neither perpendicular nor parallel to the side surfaces of the semiconductor chips arranged in the chip array. In this manner failures associated with the sweeping effects of the mold resin flowing past the bonding wires on the semiconductor chips may be reduced.

Abstract: In an ink-jet printhead and a method for manufacturing the same, the ink-jet printhead includes a substrate, an ink chamber to be filled with ink to be ejected formed on an upper surface of the substrate, a restrictor, which is a path through which ink is supplied from an ink reservoir to the ink chamber, perforating a bottom surface of the substrate and a bottom surface of the ink chamber, a nozzle plate, which is stacked on the upper surface of the substrate and forms an upper wall of the ink chamber, a nozzle perforating the nozzle plate at a position corresponding to a center of the ink chamber, a heater formed in the nozzle plate to surround the nozzle, and a conductor for applying a current to the heater.

Abstract: A control rod driving simulator has a control rod driving unit having a plurality of coil members vertically mounted therein, a control rod mounted vertically movably through the centers of the coil members, a cart having a reserve tank storing cooling water, a cooling fan for air-cooling the coil members and a control unit for controlling an operation of the cooling fan, a box containing a part of the control rod and a checking unit for checking the vertical movement of the control rod. When the simulator is connected to an actual control rod driving mechanism and a wave profile of current flowing in the coil members of the control rod driving unit is measured, a same wave profile of current as when it is connected to an actual control rod driving mechanism provided to a reactor core can be obtained.

Abstract: A hermetic sealing method, which is capable of preventing oxidation of a micro-electromechanical system (MEMS) and sealing the MEMS at a low temperature. A low temperature hermetic sealing method having a passivation layer includes depositing a junction layer, a wetting layer, and a solder layer on a prepared lid frame, depositing a first protection layer for preventing oxidation on the solder layer and forming a lid, preparing a package base on which a device is disposed, and in which a metal layer and a second protection layer are formed around the device, and assembling the lid and the package base, heating, and sealing them. The protection layer is laminated on the solder layer that is formed by the lid, thereby preventing oxidation without using a flux. The low temperature hermetic sealing method having a passivation layer is suitable for sealing a device, such as the MEMS, which is sensitive to heat, water and other by-products.

Abstract: A device that is hermetically sealed at a wafer level or a method of hermetically sealing a device, which is sensitive to high temperatures or affected by heating cycles. Semiconductor devices are formed on a wafer. A lid wafer is formed. Adhesives are formed in a predetermined position over the wafer and/or the lid wafer. The wafer and the lid wafer are sealed by the adhesives at the wafer level. The sealing may be performed at a low temperature using a solder to protect the devices sensitive to heat. The sealed devices are diced into individual chips. In the wafer level hermetic sealing method, a sawing operation is performed after the devices are sealed. Therefore, the overall processing time is reduced, devices are protected from the effects of moisture or particles, and devices having a moving structure, such as MEMS devices, are more easily handled.

Abstract: A device that is hermetically sealed at a wafer level or a method of hermetically sealing a device, which is sensitive to high temperatures or affected by heating cycles. Semiconductor devices are formed on a wafer. A lid wafer is formed. Adhesives are formed in a predetermined position over the wafer and/or the lid wafer. The wafer and the lid wafer are sealed by the adhesives at the wafer level. The sealing may be performed at a low temperature using a solder to protect the devices sensitive to heat. The sealed devices are diced into individual chips. In the wafer level hermetic sealing method, a sawing operation is performed after the devices are sealed. Therefore, the overall processing time is reduced, devices are protected from the effects of moisture or particles, and devices having a moving structure, such as MEMS devices, are more easily handled.

Abstract: The micro-mechanical structure includes an anti-stiction layer formed by plasma enhanced chemical vapor deposition and plasma etching. The anti-stiction layer is selectively formed on only the area of a substrate other than the top of a movable structure and a part of an electrode that is subsequently bonded to a wire.

Abstract: Disclosed is a control rod driving simulator for verification of a control rod driving mechanism control system of an atomic power plant. The simulator has a control rod driving unit having a plurality of coil members vertically mounted therein, a control rod mounted vertically movably through the centers of the coil members, a cart having a reserve tank storing cooling water, a cooling fan for air-cooling the coil members and a control unit for controlling an operation of the cooling fan, the control rod driving unit being mounted to an upper part of the cart, a box installed in the cart, a part of the control rod being inserted in the box; and a checking unit for checking the vertical movement of the control rod.

Abstract: In an ink-jet printhead and a method for manufacturing the same, the ink-jet printhead includes a substrate, an ink chamber to be filled with ink to be ejected formed on an upper surface of the substrate, a restrictor, which is a path through which ink is supplied from an ink reservoir to the ink chamber, perforating a bottom surface of the substrate and a bottom surface of the ink chamber, a nozzle plate, which is stacked on the upper surface of the substrate and forms an upper wall of the ink chamber, a nozzle perforating the nozzle plate at a position corresponding to a center of the ink chamber, a heater formed in the nozzle plate to surround the nozzle, and a conductor for applying a current to the heater.

Abstract: Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective injection of mold resin through a corner gate controlled by a gate block whereby the flow of the mold resin is neither perpendicular nor parallel to the side surfaces of the semiconductor chips arranged in the chip array. In this manner failures associated with the sweeping effects of the mold resin flowing past the bonding wires on the semiconductor chips may be reduced.

Abstract: The micro-mechanical structure includes an anti-stiction layer formed by plasma enhanced chemical vapor deposition and plasma etching. The anti-stiction layer is selectively formed on only the area of a substrate other than the top of a movable structure and a part of an electrode that is subsequently bonded to a wire.

Abstract: A stand fixing structure of a LCD monitor is disclosed. The stand structure of the LCD monitor according to the present invention includes a rear cover, a VESA cover engaged to a back surface of the rear cover, a rotation plate rotatably engaged at a bottom of a circular groove grooved on a back surface of the VESA cover and having a certain diameter, a rotatable stand having both ends hinged to the rotation plate, and a pair of opposite hooks protruded from both corner portions of a back surface of the VESA cover, whereby the stand is rotated and fixed at the hooks, and when the LCD monitor is hanged on a wall, the stand is supported by the hooks for thereby preventing the LCD monitor from being inclined in a certain direction.

Abstract: A hermetic sealing method, which is capable of preventing oxidation of a micro-electromechanical system (MEMS) and sealing the MEMS at a low temperature. A low temperature hermetic sealing method having a passivation layer includes depositing a junction layer, a wetting layer, and a solder layer on a prepared lid frame, depositing a first protection layer for preventing oxidation on the solder layer and forming a lid, preparing a package base on which a device is disposed, and in which a metal layer and a second protection layer are formed around the device, and assembling the lid and the package base, heating, and sealing them. The protection layer is laminated on the solder layer that is formed by the lid, thereby preventing oxidation without using a flux. The low temperature hermetic sealing method having a passivation layer is suitable for sealing a device, such as the MEMS, which is sensitive to heat, water and other by-products.

Abstract: The micro-mechanical structure includes an anti-stiction layer formed by plasma enhanced chemical vapor deposition. The anti-stiction layer is formed on only the area of a substrate other than the top of a movable structure and a part of an electrode that is subsequently bonded to a wire.

Abstract: An LCD monitor stand having a multistage structure comprises a display unit displaying an image and having a receiving groove part formed at the lower portion of the back side thereof, a stand unit supporting said display unit and having a top stand and a bottom stand, and a hinge connector installed at both end portions of the stand unit which allows the unit to be opened and closed completely when the stand unit is rotated upward and downward, and also to be fixed and released at one step or more between complete opening and closure. Accordingly, the LCD monitor stand having this multistage structure rotates a display unit upward and downward, stopping at each step of the multistage structure and obtaining the best suited view angle. It is also possible to hang the LCD monitor on the wall when the stand unit is folded completely, and it is not necessary to separate the stand unit from the display unit for shipping.

Abstract: A stand fixing structure of a LCD monitor is disclosed.