Abstract: A device that is hermetically sealed at a wafer level or a method of hermetically sealing a device, which is sensitive to high temperatures or affected by heating cycles. Semiconductor devices are formed on a wafer. A lid wafer is formed. Adhesives are formed in a predetermined position over the wafer and/or the lid wafer. The wafer and the lid wafer are sealed by the adhesives at the wafer level. The sealing may be performed at a low temperature using a solder to protect the devices sensitive to heat. The sealed devices are diced into individual chips. In the wafer level hermetic sealing method, a sawing operation is performed after the devices are sealed. Therefore, the overall processing time is reduced, devices are protected from the effects of moisture or particles, and devices having a moving structure, such as MEMS devices, are more easily handled.

Abstract: A flat panel display device having a stand cap which is firmly assembling to a hinge member. The flat panel display device includes a display unit for displaying an image and is vertically and horizontally pivotally supported by a stand through a hinge member. The hinge member has a tilting shaft for pivoting the display unit vertically and a rotation member for rotating the display unit horizontally. The stand cap is fixed to the rotation member by a fastener so that the stand cap is rotated with and not released from the rotation member when the display unit is rotated.

Abstract: A flat panel display device having a stand cap which is firmly assembling to a hinge member. The flat panel display device includes a display unit for displaying an image and is vertically and horizontally pivotally supported by a stand through a hinge member. The hinge member has a tilting shaft for pivoting the display unit vertically and a rotation member for rotating the display unit horizontally. The stand cap is fixed to the rotation member by a fastener so that the stand cap is rotated with and not released from the rotation member when the display unit is rotated.

Abstract: The present invention provides a vertical semiconductor device package comprising a semiconductor chip, a heat spreader, a printed circuit board(PCB), a plurality of metal wires, and an encapsulating material. The semiconductor chip is directly attached to the heat spreader, and/or the heat spreader is directly attached to the metal layers in the PCB, which has multiple ground metal layers. A package module has a plurality of the vertical semiconductor device packages, which are vertically mounted on a second circuit board, and a heat sink, which is attached to each heat spreader. The present invention has advantages in that it enhances the heat dissipation properties and the electrical characteristics of the packages.

Abstract: An LCD monitor having a partitioned circuit section is adapted to prevent a failure or malfunction caused by heat generated by the circuit section, and includes: an interface board receptive to video and sync signals generated by a computer; a main printed circuit board (PCB) for processing the video and sync signals received from the interface board, and for displaying the video signals on a liquid crystal panel; a power PCB for rectifying an AC into DC to supply a DC drive voltage to the main PCB and an audio PCB, the power PCB being disposed apart from the main PCB by a specified distance to prevent heat generated in the DC supply from causing a failure or malfunction of components in the main PCB; and an invertor PCB for converting the DC supplied by the power PCB to alternating current (AC), the power PCB separated from the main PCB being disposed on the side of an invertor section in the liquid crystal panel.

Abstract: An LCD monitor includes a stand in which cable plugs are inserted through a recess in a bracket so as to be connected to connectors in the interior of the stand. In this way, the plugs are concealed from view, and are protected from tampering or damage. Moreover, during rotation or tilting of the monitor by the user, the plugs and their cables do not interfere with such rotation or tiling of the monitor by impact with any surface located behind the monitor. A printed circuit board (PCB) is supported on surface inside the stand, and the bracket is mounted on the outer frame of the stand and comprises a lower fitting panel, a top panel and side panels extending from the outer frame.

Abstract: An improved multi-functional stand that uses a swivel device and a hinge to allow a display unit to be adjusted in any angle relative to the stand. The stand has a speaker and has connections on a rear portion of the stand housing for both a power cable and a plurality of signal cables. The cables are connected to an interface circuit board and the power and image signals are then transferred to the main circuit board through a cable that runs through the stand and is inserted into the display device.

Abstract: A swiveling device that can be used in a stand supporting LCD monitors is disclosed. The swiveling device uses combinations of flanges and ribs to prevent the concentration of eccentric load forces on central connectors. This increases the reliability and the corresponding market competitiveness of monitors using this swiveling device as well as preventing the inefficiencies created by monitor failure in the work place.

Abstract: A flat-panel display apparatus including a variable flat-panel display unit for multi-directional display of images in accordance with a supplied video signal; a stand unit for supporting the variable flat-panel display unit; and a balancing element of a predetermined mass in the stand unit, for maintaining stability in the apparatus. The balancing element is mounted to the bottom cover of the stand unit and is made of a metal having a high density.

Abstract: A mold for encapsulating semiconductor device packages provides improved reliability by reducing air traps in the encapsulant. The mold has an upper mold die and a lower mold die which together form a cavity where the package is encapsulated by the molding compound. Air traps are reduced by equipping the lower mold die with projections formed along edges of the cavity extending in the direction of the molding compound flow. The mold allows a reduction of the formation air traps around or at the positions where the lead frame and chip are located so that the reliability of the resulting package is improved.