Abstract: A light emitting diode (LED) pixel for a display including a first LED stack having a first well layer, a second LED stack disposed on the first LED stack and having a second well layer, a third LED stack disposed on the second LED stack and having a third well layer, a first electrode disposed on the first LED stack and in ohmic contact with the first LED stack, a second electrode disposed on the second LED stack and in ohmic contact with a surface of the second LED stack, and a third electrode in ohmic contact with a surface of the third LED stack, in which the first well layer includes at least one base material different from that of the second well layer.

Abstract: Provided are a method for analyzing quantum vulnerability and a system therefor. The method according to some embodiments may include configuring quantum-vulnerable algorithm detection rule based on a type of encryption algorithm, configuring an analysis level for analyzing a quantum vulnerability of target software, from among a plurality of predefined analysis levels, analyzing the target software based on the configured quantum-vulnerable algorithm detection rule, using an analysis technique corresponding to the configured analysis level, and assessing the quantum vulnerability of the target software based on a result of the analyzing.

Abstract: A light emitting diode, including a first type semiconductor layer, an active layer, and a second type semiconductor layer; an ohmic contact layer disposed on the second type semiconductor layer; a first insulating layer disposed on the semiconductor structure and including a first opening overlapping the first type semiconductor layer and a second opening overlapping the ohmic contact layer; a first connection wiring disposed on the first insulating layer, the first connection wiring having a first portion and a second portion; and a second connection wiring disposed on the first insulating layer and spaced apart from the first connection wiring, the second connection wiring electrically connected to the second type semiconductor layer through the second opening. The second connection wiring surrounds at least a portion of the first portion of the first connection wiring in a plan view.

Abstract: A bio-information processing apparatus may include: a bio-signal measurer configured to measure a bio-signal; a bio-information receiver configured to receive first bio-information; and a processor configured to estimate second bio-information based on the bio-signal, and to correct the second bio-information based on measurement circumstances of the first bio-information and the second bio-information.

Abstract: A coil device capable of minimizing defects and increasing a thickness of a conductor pattern is provided. The coil device includes: a base substrate; a seed pattern formed on the base substrate and including a seed region and a lead-in wiring region; a first conductive pattern formed on the seed region; a second conductive pattern formed on at least a portion of the first conductive pattern; and a protective layer formed to contact at least one or more of the base substrate, the seed pattern, the first conductive pattern, and the second conductive pattern, in which the seed pattern of the lead-in wiring region extends to a cut line.

Abstract: A light emitting diode pixel for a display including a first LED sub-unit, a second LED sub-unit disposed on a portion of the first LED sub-unit, a third LED sub-unit disposed on a portion of the second LED sub-unit, and a reflective electrode disposed adjacent to the first LED sub-unit, in which each of the first to third LED sub-units comprises an n-type semiconductor layer and a p-type semiconductor layer, each of the n-type semiconductor layers of the first, second, and third LED stacks is electrically connected to the reflective electrode, and the first LED sub-unit, the second LED sub-unit, and the third LED sub-unit are configured to be independently driven.

Abstract: Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.

Abstract: Disclosed is a silver powder preparation method including a silver salt reduction step. The silver salt reduction step includes a reaction solution preparation step for preparing a first reaction solution and a second reaction solution and a precipitation step for allowing reaction between the first reaction solution and the second reaction solution to precipitate silver particles. The first reaction solution contains silver ions, ammonia, an alkali metal salt of an organic acid, and a phosphorous compound, and the second reaction solution contains a reducing agent. The content of the phosphorous compound and the reaction temperature of the precipitation step are adjusted so that the shrinkage rate of the silver powder is adjusted within a range of 5% to 20% at 500° C. when the reaction temperature is heated to 800° C. at a heating rate of 50° C./min.

Abstract: The present disclosure is to provide a recombinant botulinum toxin type A light chain, a recombinant botulinum toxin, and a composition, use, and method related thereto, which exhibit improved efficacy and half-life to be easier to use for patients and enable treatment that is customized to indications.

Abstract: An airbag chute-integrated crash pad assembly includes: a main core that includes a door portion expanding when an airbag expands, and a cover portion mounted on a dash board. In particular, the main core is formed with a reinforcement portion extending downward from a lower surface of the cover portion, and the door portion and the cover portion are separated by a hinge groove that is formed in a lower surface of the main core and forms an expansion line. The reinforcement portion is combined with an airbag accommodation body that accommodates a passenger airbag (PAB). Thus, process optimization can be realized by omitting a process of machining a score and fusing a PAB chute, and also a problem of damage to the PAB chute can be solved.

Abstract: This application relates to a modular electrostatic precipitator. In one aspect, the modular electrostatic precipitator includes a housing providing a flow path through which air is moved and a charging module configured to emit electromagnetic waves to the air. The precipitator may also include a first attaching/detaching unit configured to attach and detach the charging module to and from the housing and a particle collecting module configured to collect particles in the air by applying an electrostatic force to the air. The precipitator may further include a second attaching and detaching unit configured to attach and detach the particle collecting module to and from the housing.

Abstract: The purpose of the present invention is to provide a recombinant botulinum toxin type A light chain in which efficacy and half-life are increased to increase patient convenience and allow for customized treatment for indications, a recombinant botulinum toxin, and a composition, use, and method related thereto.

Abstract: A light emitting diode (LED) stack for a display including a first LED stack including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, an intermediate bonding layer disposed between the first LED stack and the second LED stack to bond the second LED stack to the first LED stack, an upper bonding layer disposed between the second LED stack and the third LED stack to couple the third LED stack to the second LED stack, and a first hydrophilic material layer disposed between the first LED stack and the upper bonding layer.

Abstract: A composite insulating material includes two or more blankets, each having a substrate for a blanket and aerogel formed on the inside and a surface of the substrate for the blanket, and a super absorbent polymer layer including super absorbent polymer particles located between the blankets.

Abstract: Provided is a surface-treated steel sheet including: a steel sheet; and a corrosion-resistant film layer formed on at least one surface of the steel sheet. The corrosion-resistant film layer includes a product formed by a hydrolysis reaction of silica and an alkoxy silane and an acrylate-based polymer, comprises 25 to 65 wt % of carbon (C), 20 to 70 wt % of silicon (Si), and 1 to 40 wt % of oxygen (O), and in the corrosion-resistant film layer, a ratio of silicon (Si) to oxygen (O) (Si—O bonding) and silicon (Si) to carbon (C) (Si—C bonding) is 80 to 95 wt %:5 to 20 wt %.