Patents by Inventor Chang-Hun Kim

Chang-Hun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220051973
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Application
    Filed: October 14, 2021
    Publication date: February 17, 2022
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Patent number: 11152296
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: October 19, 2021
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD.
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Publication number: 20210301051
    Abstract: Provided is a method of preparing an acrylonitrile-based copolymer for a carbon fiber, which comprises: preparing a reaction solution including a monomer mixture comprising a sulfonate-based monomer represented by Chemical Formula 1, a carboxylic acid-based monomer, and an acrylonitrile-based monomer and an organic solvent; and subjecting the reaction solution to polymerization, wherein the monomer mixture comprises the sulfonate-based monomer represented by Chemical Formula 1 at 0.55 to 1.6 mol %.
    Type: Application
    Filed: November 1, 2019
    Publication date: September 30, 2021
    Inventors: Jong Gil KIM, Chang Hun KIM, Jeong Hun CHO, Hyun Min KIM, Joon Hee CHO, Hyo Yong KIM
  • Publication number: 20210230330
    Abstract: Provided is an acrylonitrile-based copolymer for a carbon fiber which includes a sulfonate-based monomer unit, a carboxylic acid-based monomer unit, and an acrylonitrile-based monomer unit, and the acrylonitrile-based copolymer for a carbon fiber includes the sulfonate-based monomer unit at 0.55 to 1.55 mol %, and the carboxylic acid-based monomer unit at 0.60 to 1.40 mol %.
    Type: Application
    Filed: November 1, 2019
    Publication date: July 29, 2021
    Inventors: Chang Hun Kim, Jong Gil Kim, Hyun Min Kim, Yeon Soo Kim, Jeong Hun Cho, Hye Jin Han, Joon Hee Cho
  • Patent number: 11046792
    Abstract: The present invention relates to a method of preparing a (meth)acrylonitrile-based polymer for preparing a carbon fiber, which comprises adding a reaction solution comprising a (meth)acrylonitrile-based monomer and a reaction solvent to a reactor to perform solution polymerization, performing solution polymerization under a condition in which a power consumption of the reactor is 1 to 5 kW/m3 when the reaction solution in the reactor has a viscosity of 0.1 poise or more and 250 poise or less, and performing solution polymerization under a condition in which a power consumption of the reactor is 8 to 13 kW/m3 when the reaction solution in the reactor has a viscosity of more than 250 poise and 450 poise or less.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: June 29, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Jeong Hun Cho, Young Soo Song, Hyun Min Kim, Chang Hun Kim, Hyo Yong Kim, Joon Hee Cho
  • Publication number: 20200149196
    Abstract: The present invention relates to a method for producing a polyacrylonitrile-based fiber, wherein the method polymerizes a monomer mixture including an acrylonitrile-based monomer, a carboxylic acid-based comonomer, and an acrylate-based comonomer, wherein the acrylate-based comonomer includes the steps of producing a polyacrylonitrile-based copolymer so as to be included in an amount of 4 to 20 parts by weight based on 100 parts by weight of the monomer mixture, fiberizing the polyacrylonitrile-based copolymer, oxidizing and stabilizing the fiberized polyacrylonitrile-based copolymer, which may control the oxidation stabilization reaction, particularly the cyclization reaction. Accordingly, the energy consumption of the oxidation stabilization reaction may be reduced, economical efficiency of the production of polyacrylonitrile-based fiber may be obtained, and the physical and mechanical properties of the carbon fiber may be improved.
    Type: Application
    Filed: November 22, 2017
    Publication date: May 14, 2020
    Inventors: Jeong Kyu LEE, Chang Hun KIM, In Young SONG, Jeong Hun CHO, Jong Soo DO, Sung Joon OH, Joon Hee CHO
  • Publication number: 20190375870
    Abstract: A method of preparing an acrylonitrile-based copolymer for a carbon fiber. The method includes: preparing a reaction solution including a (meth)acrylonitrile-based monomer and a first reaction solvent; adding a first portion of a radical polymerization initiator to the reaction solution to initiate polymerization; and adding a second portion of the radical polymerization initiator to the reaction solution when a polymerization conversion ratio is between 70 to 80%.
    Type: Application
    Filed: September 18, 2018
    Publication date: December 12, 2019
    Inventors: Chang Hun KIM, Hyun Min KIM, Jeong Hun CHO, Joon Hee CHO
  • Publication number: 20190315889
    Abstract: The present invention relates to a method of preparing a (meth)acrylonitrile-based polymer for preparing a carbon fiber, which comprises adding a reaction solution comprising a (meth)acrylonitrile-based monomer and a reaction solvent to a reactor to perform solution polymerization, performing solution polymerization under a condition in which a power consumption of the reactor is 1 to 5 kW/m3 when the reaction solution in the reactor has a viscosity of 0.1 poise or more and 250 poise or less, and performing solution polymerization under a condition in which a power consumption of the reactor is 8 to 13 kW/m3 when the reaction solution in the reactor has a viscosity of more than 250 poise and 450 poise or less.
    Type: Application
    Filed: September 14, 2018
    Publication date: October 17, 2019
    Inventors: Jeong Hun CHO, Young Soo SONG, Hyun Min KIM, Chang Hun KIM, Hyo Yong KIM, Joon Hee CHO
  • Patent number: 10185862
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a substrate comprising a dielectric layer and a wiring pattern embedded in and exposed from the dielectric layer.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: January 22, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Seung Mo Kim, Chang Hun Kim, Jung Hwa Kim, Se Man Oh
  • Publication number: 20180350734
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Application
    Filed: July 23, 2018
    Publication date: December 6, 2018
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Patent number: 10032705
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Grant
    Filed: May 8, 2016
    Date of Patent: July 24, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Publication number: 20180015596
    Abstract: A screw and a fastening tool of a screw are disclosed. The screw has a cross-shaped tool insertion groove formed on a head part and a holding groove formed on one side inner surface of the tool insertion groove, so as to be assembled with a cap having a cross-shaped fitting part and a holding protrusion provided at one side of the fitting part. The fastening tool includes a first linear insertion part and a second insertion part, which are configured to be fitted into the tool insertion groove, wherein the first and second insertion parts are perpendicular. As the fastening tool fitted into the head part of the screw is rotated, the rotation torque is uniformly dispersed over the four corner portions of the tool insertion groove through the first and second insertion parts, thereby avoiding abrasion of the tool insertion groove and extending the lifespan of the screw.
    Type: Application
    Filed: September 30, 2016
    Publication date: January 18, 2018
    Inventor: Chang Hun KIM
  • Patent number: 9601275
    Abstract: A dielectric ceramic composition includes a main component comprising (1-x)BaTiO3-x(Na1-yKy)NbO3, where 0.005?x?0.5 and 0.3?y?1.0; a first subcomponent comprising an element selected from the group consisting of Mn, V, Cr, Fe, Ni, Co, Cu and Zn; and a second subcomponent comprising SiO2.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: March 21, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok-Hyun Yoon, Yun-Jung Park, Doo-Young Kim, Song-Je Jeon, Chang-Hun Kim
  • Publication number: 20170018493
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Application
    Filed: May 8, 2016
    Publication date: January 19, 2017
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Publication number: 20160300096
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a substrate comprising a dielectric layer and a wiring pattern embedded in and exposed from the dielectric layer.
    Type: Application
    Filed: April 6, 2016
    Publication date: October 13, 2016
    Inventors: Seung Mo Kim, Chang Hun Kim, Jung Hwa Kim, Se Man Oh
  • Publication number: 20120023169
    Abstract: A portable terminal to provide social network service using human body communication includes a human body communication unit to transmit or receive data through a human body, a memory unit to store at least one of social data, user data, reference data, and any additional data collected, a contact object identifying unit to identify a contact object by using the data received by the human body communication unit, and a pattern analyzing unit to analyze a pattern of contact with the contact object using the data stored in the memory unit. A method for providing social network service using human body communication includes sensing a human body contact, identifying a contact object, and analyzing a pattern of contact with the contact object using at least one of social data, user data, reference data and any additional data collected.
    Type: Application
    Filed: February 1, 2011
    Publication date: January 26, 2012
    Applicant: PANTECH CO., LTD.
    Inventors: Min Su KANG, Bo Sun KIM, Jung Woon LEE, Hyoung Jun JEON, Min Kyung KIM, Chang Hun KIM, Sung Yun KIM
  • Publication number: 20110189955
    Abstract: Mobile terminals and a communication method using the same in which a mobile terminal includes a display unit to display image information processed in the mobile terminal; a conversion unit to convert an image signal corresponding to the image information output from the display unit into an electric signal; and an electrical output unit to output the electric signal converted by the conversion unit. Further, a mobile terminal includes an electrical reception unit to receive an electric signal for image information; a conversion unit to convert the electric signal received by the electrical reception unit into an image signal; and a display unit to display image information corresponding to the image signal converted by the conversion unit.
    Type: Application
    Filed: August 9, 2010
    Publication date: August 4, 2011
    Applicant: PANTECH CO., LTD.
    Inventors: Yang Lyul LEE, Chang Hun Kim, Jin Woo Shin, Hyeon Ji Jeon, Seung Min Jeung
  • Publication number: 20110188483
    Abstract: A communication terminal captures an image of a device having a local area wireless communication function, displays the image on a screen, and performs local area wireless communications with the device while further displaying data stored in the device on the screen.
    Type: Application
    Filed: August 20, 2010
    Publication date: August 4, 2011
    Applicant: PANTECH CO., LTD.
    Inventors: Hyung Chul Lee, Chang Hun Kim, Jin Woo Shin, Hyeon Ji Jeon, Seung Min Jeung
  • Publication number: 20020067354
    Abstract: An efficient method is disclosed for reconstructing a 3D object from a free-hand line drawing. The search domain is reduced by classifying potential faces into implausible faces that cannot be actual faces, basis faces that are actual faces without search, and minimal faces that are undetermined. The actual faces of an object can be identified rapidly by searching the minimal faces only. In addition, the 3D regularities and quadric regularities are introduced to reconstruct various 3D objects more accurately.
    Type: Application
    Filed: September 28, 2001
    Publication date: June 6, 2002
    Inventors: Beom-Soo Oh, Chang-Hun Kim
  • Publication number: 20020035458
    Abstract: A method and system is presented that can predict the result of a plastic surgery on a patient. The method includes the steps of taking pictures of a patient's hard and soft tissue, preparing a personalized 3-D model of the patient by overlaying the hard and soft tissue pictures and extracting outlines and feature points based on a standard 3-D model of a representative person, performing a virtual surgery by a doctor by manipulating the patient's hard tissue, and synthesizing the result of the virtual surgery by deriving changes in the patient's soft tissue according to the changes in the hard tissue.
    Type: Application
    Filed: April 21, 2001
    Publication date: March 21, 2002
    Inventors: Chang-Hun Kim, Young-Sik Jeong, Beom-Soo Oh, Hwa-Sung Kim