Patents by Inventor Chang-Hun Kim
Chang-Hun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220051973Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.Type: ApplicationFiled: October 14, 2021Publication date: February 17, 2022Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
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Patent number: 11152296Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.Type: GrantFiled: July 23, 2018Date of Patent: October 19, 2021Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD.Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
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Publication number: 20210301051Abstract: Provided is a method of preparing an acrylonitrile-based copolymer for a carbon fiber, which comprises: preparing a reaction solution including a monomer mixture comprising a sulfonate-based monomer represented by Chemical Formula 1, a carboxylic acid-based monomer, and an acrylonitrile-based monomer and an organic solvent; and subjecting the reaction solution to polymerization, wherein the monomer mixture comprises the sulfonate-based monomer represented by Chemical Formula 1 at 0.55 to 1.6 mol %.Type: ApplicationFiled: November 1, 2019Publication date: September 30, 2021Inventors: Jong Gil KIM, Chang Hun KIM, Jeong Hun CHO, Hyun Min KIM, Joon Hee CHO, Hyo Yong KIM
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Publication number: 20210230330Abstract: Provided is an acrylonitrile-based copolymer for a carbon fiber which includes a sulfonate-based monomer unit, a carboxylic acid-based monomer unit, and an acrylonitrile-based monomer unit, and the acrylonitrile-based copolymer for a carbon fiber includes the sulfonate-based monomer unit at 0.55 to 1.55 mol %, and the carboxylic acid-based monomer unit at 0.60 to 1.40 mol %.Type: ApplicationFiled: November 1, 2019Publication date: July 29, 2021Inventors: Chang Hun Kim, Jong Gil Kim, Hyun Min Kim, Yeon Soo Kim, Jeong Hun Cho, Hye Jin Han, Joon Hee Cho
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Patent number: 11046792Abstract: The present invention relates to a method of preparing a (meth)acrylonitrile-based polymer for preparing a carbon fiber, which comprises adding a reaction solution comprising a (meth)acrylonitrile-based monomer and a reaction solvent to a reactor to perform solution polymerization, performing solution polymerization under a condition in which a power consumption of the reactor is 1 to 5 kW/m3 when the reaction solution in the reactor has a viscosity of 0.1 poise or more and 250 poise or less, and performing solution polymerization under a condition in which a power consumption of the reactor is 8 to 13 kW/m3 when the reaction solution in the reactor has a viscosity of more than 250 poise and 450 poise or less.Type: GrantFiled: September 14, 2018Date of Patent: June 29, 2021Assignee: LG CHEM, LTD.Inventors: Jeong Hun Cho, Young Soo Song, Hyun Min Kim, Chang Hun Kim, Hyo Yong Kim, Joon Hee Cho
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Publication number: 20200149196Abstract: The present invention relates to a method for producing a polyacrylonitrile-based fiber, wherein the method polymerizes a monomer mixture including an acrylonitrile-based monomer, a carboxylic acid-based comonomer, and an acrylate-based comonomer, wherein the acrylate-based comonomer includes the steps of producing a polyacrylonitrile-based copolymer so as to be included in an amount of 4 to 20 parts by weight based on 100 parts by weight of the monomer mixture, fiberizing the polyacrylonitrile-based copolymer, oxidizing and stabilizing the fiberized polyacrylonitrile-based copolymer, which may control the oxidation stabilization reaction, particularly the cyclization reaction. Accordingly, the energy consumption of the oxidation stabilization reaction may be reduced, economical efficiency of the production of polyacrylonitrile-based fiber may be obtained, and the physical and mechanical properties of the carbon fiber may be improved.Type: ApplicationFiled: November 22, 2017Publication date: May 14, 2020Inventors: Jeong Kyu LEE, Chang Hun KIM, In Young SONG, Jeong Hun CHO, Jong Soo DO, Sung Joon OH, Joon Hee CHO
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Publication number: 20190375870Abstract: A method of preparing an acrylonitrile-based copolymer for a carbon fiber. The method includes: preparing a reaction solution including a (meth)acrylonitrile-based monomer and a first reaction solvent; adding a first portion of a radical polymerization initiator to the reaction solution to initiate polymerization; and adding a second portion of the radical polymerization initiator to the reaction solution when a polymerization conversion ratio is between 70 to 80%.Type: ApplicationFiled: September 18, 2018Publication date: December 12, 2019Inventors: Chang Hun KIM, Hyun Min KIM, Jeong Hun CHO, Joon Hee CHO
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Publication number: 20190315889Abstract: The present invention relates to a method of preparing a (meth)acrylonitrile-based polymer for preparing a carbon fiber, which comprises adding a reaction solution comprising a (meth)acrylonitrile-based monomer and a reaction solvent to a reactor to perform solution polymerization, performing solution polymerization under a condition in which a power consumption of the reactor is 1 to 5 kW/m3 when the reaction solution in the reactor has a viscosity of 0.1 poise or more and 250 poise or less, and performing solution polymerization under a condition in which a power consumption of the reactor is 8 to 13 kW/m3 when the reaction solution in the reactor has a viscosity of more than 250 poise and 450 poise or less.Type: ApplicationFiled: September 14, 2018Publication date: October 17, 2019Inventors: Jeong Hun CHO, Young Soo SONG, Hyun Min KIM, Chang Hun KIM, Hyo Yong KIM, Joon Hee CHO
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Patent number: 10185862Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a substrate comprising a dielectric layer and a wiring pattern embedded in and exposed from the dielectric layer.Type: GrantFiled: April 6, 2016Date of Patent: January 22, 2019Assignee: Amkor Technology, Inc.Inventors: Seung Mo Kim, Chang Hun Kim, Jung Hwa Kim, Se Man Oh
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Publication number: 20180350734Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.Type: ApplicationFiled: July 23, 2018Publication date: December 6, 2018Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
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Patent number: 10032705Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.Type: GrantFiled: May 8, 2016Date of Patent: July 24, 2018Assignee: Amkor Technology, Inc.Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
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Publication number: 20180015596Abstract: A screw and a fastening tool of a screw are disclosed. The screw has a cross-shaped tool insertion groove formed on a head part and a holding groove formed on one side inner surface of the tool insertion groove, so as to be assembled with a cap having a cross-shaped fitting part and a holding protrusion provided at one side of the fitting part. The fastening tool includes a first linear insertion part and a second insertion part, which are configured to be fitted into the tool insertion groove, wherein the first and second insertion parts are perpendicular. As the fastening tool fitted into the head part of the screw is rotated, the rotation torque is uniformly dispersed over the four corner portions of the tool insertion groove through the first and second insertion parts, thereby avoiding abrasion of the tool insertion groove and extending the lifespan of the screw.Type: ApplicationFiled: September 30, 2016Publication date: January 18, 2018Inventor: Chang Hun KIM
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Patent number: 9601275Abstract: A dielectric ceramic composition includes a main component comprising (1-x)BaTiO3-x(Na1-yKy)NbO3, where 0.005?x?0.5 and 0.3?y?1.0; a first subcomponent comprising an element selected from the group consisting of Mn, V, Cr, Fe, Ni, Co, Cu and Zn; and a second subcomponent comprising SiO2.Type: GrantFiled: October 28, 2015Date of Patent: March 21, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seok-Hyun Yoon, Yun-Jung Park, Doo-Young Kim, Song-Je Jeon, Chang-Hun Kim
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Publication number: 20170018493Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.Type: ApplicationFiled: May 8, 2016Publication date: January 19, 2017Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
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Publication number: 20160300096Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a substrate comprising a dielectric layer and a wiring pattern embedded in and exposed from the dielectric layer.Type: ApplicationFiled: April 6, 2016Publication date: October 13, 2016Inventors: Seung Mo Kim, Chang Hun Kim, Jung Hwa Kim, Se Man Oh
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Publication number: 20120023169Abstract: A portable terminal to provide social network service using human body communication includes a human body communication unit to transmit or receive data through a human body, a memory unit to store at least one of social data, user data, reference data, and any additional data collected, a contact object identifying unit to identify a contact object by using the data received by the human body communication unit, and a pattern analyzing unit to analyze a pattern of contact with the contact object using the data stored in the memory unit. A method for providing social network service using human body communication includes sensing a human body contact, identifying a contact object, and analyzing a pattern of contact with the contact object using at least one of social data, user data, reference data and any additional data collected.Type: ApplicationFiled: February 1, 2011Publication date: January 26, 2012Applicant: PANTECH CO., LTD.Inventors: Min Su KANG, Bo Sun KIM, Jung Woon LEE, Hyoung Jun JEON, Min Kyung KIM, Chang Hun KIM, Sung Yun KIM
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Publication number: 20110189955Abstract: Mobile terminals and a communication method using the same in which a mobile terminal includes a display unit to display image information processed in the mobile terminal; a conversion unit to convert an image signal corresponding to the image information output from the display unit into an electric signal; and an electrical output unit to output the electric signal converted by the conversion unit. Further, a mobile terminal includes an electrical reception unit to receive an electric signal for image information; a conversion unit to convert the electric signal received by the electrical reception unit into an image signal; and a display unit to display image information corresponding to the image signal converted by the conversion unit.Type: ApplicationFiled: August 9, 2010Publication date: August 4, 2011Applicant: PANTECH CO., LTD.Inventors: Yang Lyul LEE, Chang Hun Kim, Jin Woo Shin, Hyeon Ji Jeon, Seung Min Jeung
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Publication number: 20110188483Abstract: A communication terminal captures an image of a device having a local area wireless communication function, displays the image on a screen, and performs local area wireless communications with the device while further displaying data stored in the device on the screen.Type: ApplicationFiled: August 20, 2010Publication date: August 4, 2011Applicant: PANTECH CO., LTD.Inventors: Hyung Chul Lee, Chang Hun Kim, Jin Woo Shin, Hyeon Ji Jeon, Seung Min Jeung
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Publication number: 20020067354Abstract: An efficient method is disclosed for reconstructing a 3D object from a free-hand line drawing. The search domain is reduced by classifying potential faces into implausible faces that cannot be actual faces, basis faces that are actual faces without search, and minimal faces that are undetermined. The actual faces of an object can be identified rapidly by searching the minimal faces only. In addition, the 3D regularities and quadric regularities are introduced to reconstruct various 3D objects more accurately.Type: ApplicationFiled: September 28, 2001Publication date: June 6, 2002Inventors: Beom-Soo Oh, Chang-Hun Kim
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Publication number: 20020035458Abstract: A method and system is presented that can predict the result of a plastic surgery on a patient. The method includes the steps of taking pictures of a patient's hard and soft tissue, preparing a personalized 3-D model of the patient by overlaying the hard and soft tissue pictures and extracting outlines and feature points based on a standard 3-D model of a representative person, performing a virtual surgery by a doctor by manipulating the patient's hard tissue, and synthesizing the result of the virtual surgery by deriving changes in the patient's soft tissue according to the changes in the hard tissue.Type: ApplicationFiled: April 21, 2001Publication date: March 21, 2002Inventors: Chang-Hun Kim, Young-Sik Jeong, Beom-Soo Oh, Hwa-Sung Kim