Patents by Inventor Chang Hyun Lim

Chang Hyun Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170237408
    Abstract: A resonator includes a resonating portion including a first electrode, a second electrode, and a piezoelectric layer positioned between the first electrode and the second electrode; and a frame provided at an outer edge of the resonating portion, at least a portion of the frame covering an outer end portion of the second electrode.
    Type: Application
    Filed: September 21, 2016
    Publication date: August 17, 2017
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung HAN, Dae Ho KIM, Ran Hee SHIN, Hwa Sun LEE, Chang Hyun LIM, Tae Kyung LEE, Sung Sun KIM
  • Publication number: 20170176288
    Abstract: A method for sensing reverse rotation of an engine in vehicle includes: detecting tooth period ratios using a crankshaft angle detection sensor and storing the detected tooth period ratios in a buffer of an electronic control unit (ECU); calculating a tooth period ratio between a measured tooth period and a tooth period measured just before thereof; determining whether the tooth period ratio is greater than a first reference value; updating the tooth period value stored in the buffer by measuring the recent tooth period if the tooth period ratio is greater than the first reference value; calculating the tooth period ratio using the updated tooth period value; and determining a reverse rotation state of the engine by checking whether the change shows a predetermined pattern after a change in the value of the tooth period ratio is observed.
    Type: Application
    Filed: October 6, 2016
    Publication date: June 22, 2017
    Inventors: Tae-Kwang EOM, Jung-Suk HAN, Chang-Hyun LIM
  • Publication number: 20170175654
    Abstract: An engine synchronization apparatus includes: a crank shaft position sensor detecting a position of a crank shaft to detect a tooth and a missing tooth; a cam sensor detecting a position of a cam corresponding to an angle of rotation of each of an intake cam and an exhaust cam; and a controller synchronizing the engine to use a tooth detection signal from the crank shaft position sensor and a cam signal from the cam sensor. The controller carries out an engine synchronization by determining the position of the crank shaft and the position of the cam to select one cam between the intake cam and the exhaust cam and to detect the position of a unique part of the cam signal from a voltage level and a level length of the cam signal of the selected cam.
    Type: Application
    Filed: October 7, 2016
    Publication date: June 22, 2017
    Inventors: Tae-Kwang EOM, Jung-Suk HAN, Chang-Hyun LIM
  • Publication number: 20170166211
    Abstract: An engine control method for preventing an engine of a vehicle from stalling on a sloped road includes steps of: detecting whether a shifting lever is in a neutral stage (N-stage); measuring a vehicle speed and a slope angle of the sloped road, and calculating a load acting on a vehicle body on the sloped road; accelerating an engine a first time to increase an engine RPM so that an engine torque is larger than the load; and accelerating the engine a second time to move the vehicle when the shifting lever enters into a driving gear stage (D-stage).
    Type: Application
    Filed: October 10, 2016
    Publication date: June 15, 2017
    Inventors: Tae-Kwang EOM, Jung-Suk HAN, Chang-Hyun LIM, Hyeok-Jun KWON
  • Publication number: 20170101307
    Abstract: There is provided a semiconductor package that comprises a board; a semiconductor chip disposed on the board and having an installation recess; an adhesive layer disposed within the installation recess; and a sensor unit disposed on the adhesive layer.
    Type: Application
    Filed: June 14, 2016
    Publication date: April 13, 2017
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hyun LIM, Tae Hun LEE, Dae Hun JEONG
  • Publication number: 20170003187
    Abstract: A pressure sensor element includes a die; a concave groove formed in one surface of the die; a partition wall formed in the concave groove to be spaced apart from side walls, the partition wall partitioning the concave groove into a trench and a cavity; and a membrane formed on the die and covering the concave groove.
    Type: Application
    Filed: February 17, 2016
    Publication date: January 5, 2017
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Hyun LIM, Dae Hun JEONG, Tae Hun LEE
  • Publication number: 20170001857
    Abstract: Provided are sensor elements and a method of manufacturing the same. The sensor element includes a die, an active part including a frame surrounded by the die, a first trench disposed between the die and the active part, and a bridge connecting the die and the frame and a second trench being formed in the bridge, whereby electrical connection from the active part to an electrode pad may be secured and transfer of external stress to the active part may be significantly reduced through the second trench.
    Type: Application
    Filed: March 3, 2016
    Publication date: January 5, 2017
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Hun JEONG, Chang Hyun LIM, Tae Hun LEE
  • Publication number: 20160313201
    Abstract: A pressure sensor package includes a substrate, a pressure sensor, and a semiconductor circuit. The semiconductor circuit is disposed on one surface of the substrate and having a reception space open to one surface of the substrate. A pressure sensor is connected to the substrate and disposed in the reception space.
    Type: Application
    Filed: January 7, 2016
    Publication date: October 27, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hun LEE, Chang Hyun LIM, Dae Hun JEONG
  • Publication number: 20160273985
    Abstract: A pressure sensor includes a sensor, an elastic support portion, a membrane, and a pressure detector. The sensor is accommodated in a frame of a base substrate. The elastic support portion is elastically connecting the sensor to the frame. The membrane is disposed on a surface of the sensor. The pressure detector is disposed on the membrane and configured to detect a variation in pressure based on a movement of the membrane.
    Type: Application
    Filed: November 5, 2015
    Publication date: September 22, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hun LEE, Chang Hyun LIM, June Kyoo LEE, Dae Hun JEONG
  • Publication number: 20160069926
    Abstract: There is provided an acceleration sensor in which outer surfaces of a plurality of beams in which piezo-resistive elements are provided and upper portions of a mass body and a support body connected to the plurality of beams may be enclosed by a protective layer to prevent electrical disturbances from being transferred from an external environment to the piezo-resistive elements.
    Type: Application
    Filed: April 28, 2015
    Publication date: March 10, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.,
    Inventors: Tae Yoon KIM, Seung Hoon HAN, Chang Hyun LIM
  • Publication number: 20150241215
    Abstract: Embodiments of the invention provide a MEMS sensor, including a mass body, a flexible beam coupled with the mass body, and a support part coupled with the flexible beam and floatably supporting the mass body. According to at least one embodiment, the flexible beam is provided with a sensing device configured to detect a physical amount depending on a displacement of the mass body, and a connection part between the flexible beam and the support part is provided with a reinforcement part to relax stress concentration in response to rigidity reinforcement.
    Type: Application
    Filed: January 21, 2015
    Publication date: August 27, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Woon KIM, Seung Hun HAN, Sung Jun LEE, Sung Wook KIM, Chang Hyun LIM
  • Patent number: 9107313
    Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: August 11, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hyun Lim, Jung Eun Kang, Heung Soo Park, Seog Moon Choi, Kwang Soo Kim, Joon Seok Chae, Sung Keun Park
  • Publication number: 20150198626
    Abstract: Embodiments of the invention provide an acceleration sensor, including a sensor part comprising a mass body part including a first mass body, a second mass body, and a connecting layer connecting the first mass body and the second mass body to each other, a flexible beam having the mass body part connected thereto to be displaceable, and a supporting part having the flexible beam connected thereto and supporting the mass body part to be floatable. The acceleration sensor further includes a cover coupled to the supporting part to cover the sensor part, being opposite to the first mass body to thereby form a cavity, and being opposite to the second mass body to thereby form a protrusion part.
    Type: Application
    Filed: August 21, 2014
    Publication date: July 16, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Yoon KIM, Chang Hyun LIM, Jong Woon KIM
  • Publication number: 20150185010
    Abstract: Embodiments of the invention provide an acceleration sensor including a mass body, flexible beams coupled to the mass body, a supporting part having the flexible beams connected thereto and supporting the mass body so as to be floatable, and a lower cover coupled to the supporting part to cover the mass body, wherein the lower cover is provided with a buffering beam part so as to be opposite to the mass body.
    Type: Application
    Filed: April 7, 2014
    Publication date: July 2, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hyun LIM, Seung Hun HAN, Sung Jun LEE
  • Publication number: 20150135834
    Abstract: There is provided a MEMS sensor including: a mass body; a support part floatably supporting the mass body; and a flexible beam having one end connected to the mass body and the other end connected to the support part. At least one end of the flexible beam connected to the mass body or the support part includes a curved portion to maximize an effective length supporting a load.
    Type: Application
    Filed: November 21, 2014
    Publication date: May 21, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Woon KIM, Chang Hyun Lim, Sung Jun Lee, Jong Beom Kim
  • Publication number: 20150114119
    Abstract: Embodiments of the invention provide an acceleration sensor, including a mass body part including a first mass body and a second mass body, flexible beams coupled with the first mass body, and a support part including first support parts, which are connected to the flexible beams and are disposed to face the second mass body, and second support parts, which are coupled with the first support parts. The mass body part, the flexible beams, and the support parts are configured of a first substrate and a second substrate coupled with each other so as to be stacked, and when the mass body part is excessively displaced, the second mass body contacts the first support parts to limit the displacement of the mass body part.
    Type: Application
    Filed: April 8, 2014
    Publication date: April 30, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hyun LIM, Jong Woon KIM, Jong Beom KIM, Seung Hun HAN, Sung Jun LEE
  • Publication number: 20150114111
    Abstract: Disclosed herein is an MEMS sensor, including: a sensor unit; and a substrate connected to the sensor unit, in which the substrate may be provided with a flexible printed circuit board (FPCB) to correspond to an outer peripheral portion of the sensor unit.
    Type: Application
    Filed: February 17, 2014
    Publication date: April 30, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kyu Jeung, Chang Hyun Lim, Jung Won Lee, Jong Hyeong Song
  • Publication number: 20150059477
    Abstract: Disclosed herein is an acceleration sensor including: a mass; a flexible beam on which an electrode or a piezoresistive element is disposed and the mass is coupled; and a support part connecting to and supporting the flexible beam and having therein a stress isolating slit facing the mass, wherein the mass, the flexible beam and the support part are formed by coupling first and second substrates, wherein the first substrate has a first masking pattern formed thereon corresponding to the flexible beam, the mass and the support part and the second substrate has a second masking pattern formed thereon corresponding to the mass and the support part.
    Type: Application
    Filed: August 18, 2014
    Publication date: March 5, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Woon Kim, Sung Jun Lee, Chang Hyun Lim
  • Publication number: 20150007657
    Abstract: Disclosed herein is an inertial sensor including: a flexible part; a mass body connected to the flexible part; and a support part connected to the flexible part and supporting the mass body in a floated state to displace the mass body, wherein the flexible part has an upper piezoresistor disposed on one surface thereof and a lower piezoresistor disposed on the other surface thereof to detect a displacement of the mass body.
    Type: Application
    Filed: March 10, 2014
    Publication date: January 8, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Hun HAN, Jeong Suong YANG, Sung Jun LEE, Chang Hyun LIM
  • Publication number: 20140174940
    Abstract: Embodiments of the invention provide a heat-dissipating substrate and a fabricating method of the heat-dissipating substrate. According to various embodiments, the heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.
    Type: Application
    Filed: February 12, 2014
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hyun LIM, Seog Moon CHOI, Sang Hyun SHIN, Young Ki LEE, Sung Keun PARK