Abstract: A LED sunken lamp includes a case and a lighting assembly. The case includes a lamp shade and a case seat. The lamp shade is wedged in the case seat. The lighting assembly also is wedged in the case seat and includes at least a LED lamp and a circuit board that are electrically connected. The case seat can be disassembled to facilitate wedging of the lamp shade and the lighting assembly in the case seat. The case seat also has a plurality of radiation fins to disperse heat energy generated by the LED lamp when in use to increase the life span of the LED lamp.

Abstract: A heat pipe structure with sectional heat conducting capability includes a hollow metal pipe and a working liquid, in the hollow metal pipe, having a heat absorption/exothermic cycle for achieving a heat dispersing effect. In the present invention, at least one pressed section is located between the ends of the metal pipe, and the pressed section further has, relative to the pipe, an indentation portion to contact with the sidewall of the metal pipe so as to form a sealing surface on the metal pipe such the metal pipe is divided into at least two sections which respectively have a heat absorption/exothermic cycle. Therefore, except improving the arrangement flexibility and heat dispersing effect, the processing procedure can be simplified and the cost also can be reduced.

Abstract: A heat transfer duct fastening structure aims to firmly mount a heat transfer duct onto a heat conductive base to increase heat transfer efficiency and facilitate heat dissipating of an electronic device and prevent the electronic device from being damaged at high temperature. The structure includes the base and the heat transfer duct. The base is a good heat conductive element and has a coupling portion to receive the heat transfer duct. The heat transfer duct and the inner wall of the coupling portion are soldered together through a soldering paste. Thus heat generated by the electronic device can be transmitted through the base and heat transfer duct and released to the air.

Abstract: A heat dissipating module includes a plurality of heat dissipating fins stacking together in a parallel manner, a plurality of base boards soldering on the heat dissipating fins and a heat transfer duct running through the heat dissipating fins. Each of the dissipating fins has a first portion and a second portion which is formed by bending two sides of the first portion forwards in a vertical manner. The second portion on the same side is coupled to form a coupling surface which is soldered on the base boards. By incorporating the heat transfer duct a firmer heat dissipating module structure is formed.

Abstract: A printed circuit board having vertical heat dissipating element is characterized in that a substrate of the printed circuit board is made of metal and has a first surface and a second surface, and plural metallic heat dissipating elements are mounted on the first surface of the substrate and the second surface of the substrate is spread by an insulation layer, on which a circuit layer is disposed.