Structure of a heat dissipating module

Abstract

A heat dissipating module includes a plurality of heat dissipating fins stacking together in a parallel manner, a plurality of base boards soldering on the heat dissipating fins and a heat transfer duct running through the heat dissipating fins. Each of the dissipating fins has a first portion and a second portion which is formed by bending two sides of the first portion forwards in a vertical manner. The second portion on the same side is coupled to form a coupling surface which is soldered on the base boards. By incorporating the heat transfer duct a firmer heat dissipating module structure is formed.

Description

FIELD OF THE INVENTION

The present invention relates to a heat dissipating module and particularly to a heat dissipating fin structure that has a plurality of base boards to hold a plurality of heat dissipating fins.

BACKGROUND OF THE INVENTION

These days a wide variety of electronic products are available on the market. Some of them require a greater amount of power and incur a greater amount of loss that becomes waste heat. When temperature fluctuates at a greater extent the characteristics of electronic elements also alter. This could cause malfunction of circuits. Hence heat dissipating apparatus is important to precise electronic products. Many references of heat dissipating devices are available in the prior art. For instance, R.O.C. patent application No. 093217149 entitled “Coupling structure for heat dissipating fins” has radiation plates bending outwards on a distal end to form a bend plate which has an inclined first leaning surface and a second leaning surface. The first leaning surface leans against the second leaning surface of a neighboring bend plate. There is a latch trough located between the first leaning surface and the second leaning surface. The latch trough can be wedged in by a neighboring latch portion so that the heat dissipating fins are stacked to become a heat dissipating fin module. Another example is R.O.C. patent application No. 093218949 entitled “Latching structure for heat dissipating fin module” which has a plurality of latch portions on each heat dissipating fin. The latch portion is formed by bending the periphery of the heat dissipating fin to form a bend edge and a latch hook. The bend edge has a notch to hold the latch hook of a neighboring heat dissipating fin. The heat dissipating fin behind the notch has a boss. The latch hook is in parallel with the heat dissipating fin. The latch hook has a latch slot in the middle corresponding to the boss. The boss can be clipped by the latch slot of the neighboring heat dissipating fin to form coupling. The previous two examples aim to stack the heat dissipating fins together. Each heat dissipating fin has a latch portion or latch hook, and a trough to be latched by the latch portion or latch hook. To enhance the firmness of the latched heat dissipating fins, the structure of the latch portion becomes more complicated. As a result, the cost of fabricating molds is higher. Fabrication of the complicated latch structure also requires many different lathes and machineries. The fabrication process is more complex and difficult. Total production cost increases and production speed decreases. All this begs for improvement.

SUMMARY OF THE INVENTION

In view of the aforesaid problem occurred to the conventional stacking heat dissipating fin structure that is more complicated in order to achieve a firmer coupling, the primary object of the present invention is to provide a heat dissipating module that has a simplified production process and structure, and forms a firmed coupling structure for a plurality of heat dissipating fins.

The heat dissipating module according to the invention includes a plurality of heat dissipating fins, two base boards soldering on the heat dissipating fins and a heat transfer duct running through the heat dissipating fins. Each heat dissipating fin has two opposite sides bending to form respectively a coupling plate. The heat dissipating fins are stacked in the same direction so that the coupling plate is coupled closely with one another to form a coupling surface to be in contact with the two base boards. Then the base boards and the coupling plates are bonded by soldering. The heat transfer duct also can increase heat dispersion effect and mechanical strength to make the heat dissipating module firmer.

The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of the heat dissipating fins and base boards.

FIG. 2 is a perspective view of the heat dissipating fins and base boards in a coupled condition.

FIG. 3 is a perspective view of the invention with the heat transfer duct installed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 1, 2 and 3 for an embodiment of the invention. The heat dissipating module of the invention includes a plurality of heat dissipating fins 1, a heat transfer duct 3 running through the heat dissipating fins 1 and at least two base boards 2. Each of the heat dissipating fins 1 has a first portion 11 and at least two second portions 14 formed on two opposite ends of the first portion 11 by bending forwards. The heat dissipating fins 1 can be stacked together with the second portions 14 connecting closely to one another to form a coupling surface 12 on each of two opposite sides of the heat dissipating fins 1. The length of the second portion 14 may be equal to or smaller than the side length of the heat dissipating fin 1 so that the area of the coupling surface 12 can be changed. The first portion 11 further has one or more apertures 13 to allow the heat transfer duct 3 to pass through. The base boards 2 are in contact with and bonded to the second surface 12 by soldering. Referring to FIG. 2, after the base boards 2 are bonded to the heat dissipating fins 1, roll welding can be applied on a selected soldering track 21 to solder the base boards 2 and the coupling surface 12 together so that the heat dissipating fins 1 can be fixedly located on the base boards 2. As the heat dissipating fins 1 are braced by the base boards 2 on two sides, they can withstand external mechanical forces and be heated without deforming. The heat dissipating module thus constructed is firmer.

Refer to FIG. 3 for an embodiment of coupling the invention with the heat transfer duct 3. To enhance heat dissipating effect, the first portion 11 has one or more apertures 13 formed thereon to be run through by the heat transfer duct 3. Such a structure provides improved heat transfer and heat dispersion effect. Furthermore, with the heat dissipating fins 1 running through by the heat transfer duct 3, mechanical strength also increases. When subject to an external mechanical force, a portion of the mechanical force is distributed to the heat transfer duct 3. As the heat transfer duct 3 is closely coupled with the heat dissipating fins 1 through the apertures 13, the resistance of the heat dissipating fins 1 against the transverse shearing force is greatly enhanced. The structure thus formed is stronger and less likely to be damaged.

In short, the invention provides a significant improvement over the conventional techniques and offers the following benefits:

• • 1. simplified structure and lower cost.
  • 2. reduced fabrication process and faster production speed.
  • 3. Better meet the requirements of the industry.

While the preferred embodiments of the invention have been set forth for the purpose of disclosure, modifications of the disclosed embodiments of the invention as well as other embodiments thereof may occur to those skilled in the art. Accordingly, the appended claims are intended to cover all embodiments which do not depart from the spirit and scope of the invention.

Claims

1. A structure of a heat dissipating module, comprising:

a plurality of perforated heat dissipating fins stacking together in a parallel manner, each of the heat dissipating fins having a first portion and a second portion, the second portion being coupled closely to form a coupling surface;

a heat transfer duct running through the heat dissipating fins; and

a plurality of base boards bonding to the coupling surface formed on each of two sides of the heat dissipating fins by soldering to form a firm coupling between the heat dissipating fins and the base boards.

2. The structure of the heat dissipating module of claim 1, wherein the second portion is a flat plate formed by bending two opposite sides of the first portion forwards vertical to the first portion.

3. The structure of the heat dissipating module of claim 1, wherein the soldering of the base boards and the radiation fins is done by roll welding.

4. The structure of the heat dissipating module of claim 1, wherein the coupling surface formed by stacking the heat dissipating fins is a flat surface.

5. The structure of the heat dissipating module of claim 1, wherein the second portion is formed at a length same as the length of one side of the heat dissipating fins.

6. The structure of the heat dissipating module of claim 1, wherein the second portion is formed at a length smaller than the length of one side of the heat dissipating fins.

7. The structure of the heat dissipating module of claim 1, wherein the perforation is formed on the first portion of the heat dissipating fins.

8. The structure of the heat dissipating module of claim 7, wherein the perforation is one or more.

9. The structure of the heat dissipating module of claim 8, wherein the heat transfer duct is coupled tightly with the perforation.