Abstract: Grating forming the floor of a clean room minimizes turbulence and enhances the rate at which air is discharged therethrough. The grate includes a base plate having a plurality of through-holes. Each of the through-holes includes a receiving portion through which the air is received and an exhausting portion through which the air is exhausted. The cross-sectional area of the receiving decreases toward the exhausting portion, and the cross-sectional area of the exhausting portion decreases toward the receiving portion.

Abstract: A video monitor includes a display housing which is carried in a stowage recess of an overhead console. A broad rectangular leaf of a hinge assembly is pivotally mounted at one of its ends to the console and is pivotally mounted at its opposite end to a rear casing of the display housing at the approximate mid-height of the housing. The leaf is configured to lie within a recess formed in the rear casing of the display housing when the housing is stowed, overlying ventilation ports in the rear casing. To deploy the display housing in a viewing position, the leaf is rotated about a console pivot and the display housing is rotated relative to the leaf about a housing pivot.

Abstract: An improved wafer transfer apparatus is provided that allows the ambient atmosphere within a modified front open unified pod (“FOUP”) while the FOUP is positioned on a loading stage provided on an equipment front end module (“EFEM”). In particular, the wafer transfer apparatus includes both an injection assembly and an exhaust assembly that will be engaged when the door of the FOUP is docked to a door holder provided on the EFEM. The injection assembly may include a mass flow controller (“MFC”) for controlling the injection of purge gas(es) into the container. Similarly, the exhaust assembly may include a MFC for controlling the removal of fluid from the container. While the door is docked to the door holder, inert or less reactive gases may be introduced into the container, thereby reducing the likelihood of oxidation or contamination of the wafers therein.