Abstract: An electroconductive polyamide/polyphenylene ether resin composition and a molded product for vehicle manufactured using the same includes a base resin (a) including polyphenylene ether (a-1) and polyamide (a-2); an impact modifier (b); a compatibilizer (c); and an electroconductive filler (d). The electroconductive filler (d) includes aromatic compounds having molecular weights of about 120 to about 1,000 g/mol, wherein the aromatic compounds are byproducts generated when preparing the electroconductive filler (d).

Abstract: A thermoplastic resin composition includes a base resin comprising about 5 to about 95 weight % of polycarbonate resin and about 5 to about 95 weight % of polycarbonate-polysiloxane copolymer resin; and about 0.1 to about 5 parts by weight of luster pigment per about 100 parts by weight of the base resin.

Abstract: A semiconductor device includes a semiconductor substrate including a first region and a second region, a first high-k dielectric film pattern on the first region, a second high-k dielectric film pattern on the second region and having the same thickness as the first high-k dielectric film pattern. First and second work function control film patterns are positioned on the high-k dielectric film patterns of the first region. Third and fourth work function control patterns are positioned on the high-k dielectric film pattern of the second region, the first work function control pattern being thicker than the third work function control pattern and the fourth work function control pattern being thicker than the second.

Abstract: A thermoplastic resin composition having improved weather resistance includes an acrylic graft copolymer, an aromatic vinyl-vinyl cyanide copolymer, and a coloring agent including an inorganic pigment and an organic pigment mixed with each other at a predetermined ratio to maintain mechanical properties of the resin and have improved color mixing ability and weather resistance.

Abstract: A molded article for an automobile is formed using a thermoplastic resin composition including (A) about 1 to about 20 wt % of a first rubber-modified acrylic-based graft copolymer having an average particle diameter of greater than or equal to about 100 nm and less than about 200 nm, (B) about 1 to about 20 wt % of a second rubber-modified acrylic-based graft copolymer having an average particle diameter of greater than or equal to about 200 nm and less than or equal to about 400 nm, (C) about 5 to about 40 wt % of a first vinyl-based copolymer of an alkyl(meth)acrylate monomer, an aromatic vinyl monomer, and an unsaturated nitrile monomer wherein the alkyl(meth)acrylate monomer is included in an amount of greater than or equal to about 50 wt %, and (D) about 50 to about 85 wt % of a polycarbonate resin, wherein the molded article is a radiator grill or an outside mirror housing.

Abstract: Disclosed are a thermoplastic resin composition including (A) a polycarbonate resin, (B) an aromatic vinyl-based copolymer, (C) a rubber modified vinyl-based graft copolymer, and (D) a glass fiber, wherein the glass fiber (D) includes (D-1) a first glass fiber having a length of about 1 ?m to about 200 ?m and (D-2) a second glass fiber having a length of about 2 mm to about 6 mm, and a molded article using the same.

Abstract: There is provided a semiconductor device comprising, at least one SRAM cell, wherein the SRAM cell includes a pull-up transistor, a pull-down transistor, and a pass-gate transistor, and an inversion-layer thickness (Tinv) of a gate stack of the pass-gate transistor is different from Tinv of a gate stack of the pull-up transistor and Tinv of a gate stack of the pull-down transistor.

Abstract: A thermoplastic resin composition includes (A) a first rubber-modified acrylic-based graft copolymer having an average rubber particle diameter of greater than or equal to about 100 nm and less than about 200 nm, (B) a second rubber-modified acrylic-based graft copolymer having an average rubber particle diameter of greater than or equal to about 200 nm and less than or equal to about 400 nm, (C) a first vinyl-based copolymer of an aromatic vinyl monomer and a unsaturated nitrile monomer, and (D) a second vinyl-based copolymer of an alkyl (meth)acrylate monomer, an aromatic vinyl monomer, and a unsaturated nitrile monomer. A molded article can be made using the same.

Abstract: Provided is a thermoplastic resin composition that includes 100 parts by weight of a thermoplastic resin including 50 to 90 wt % of a polycarbonate resin; and 10 to 50 wt % of a polyester resin; 1 to 10 parts by weight of a vinyl cyanide compound-aromatic vinyl compound copolymer; and 1 to 10 parts by weight of an inorganic particle; wherein the vinyl cyanide compound in the vinyl cyanide compound-aromatic vinyl compound copolymer is less than or equal to 30 wt %.

Abstract: A thermoplastic elastomer composition of the present invention comprises (A) 30 to 40% by weight of a block terpolymer of an aromatic vinyl compound and alkene or a conjugated diene-based compound; (B) 25 to 50% by weight of a paraffin oil; (C) 1 to 5% by weight of a polyolefin-based resin; (D) 5 to 20% by weight of an inorganic additive; and (E) 5 to 15% by weight of a polyphenylene ether-based resin. The thermoplastic elastomer composition, which has a surface hardness of 0.1 to 40 A (shore A), shows excellent low hardness and has improved physical properties at high temperature, particularly, flexibility, restoring force at high temperatures, and the like.

Abstract: Disclosed is a thermoplastic resin composition including: (A) a polycarbonate resin; (B) an acrylate-styrene-acrylonitrile (ASA) graft copolymer; (C) a random copolymer of an alkyl(meth)acrylate, an aromatic vinyl compound, and a vinyl cyanide compound; and (D) a copolymer of an aromatic methacrylate and a monofunctional unsaturated monomer.

Abstract: A thermoplastic resin composition includes a base resin including (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer; (D) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having at least two carboxyl groups and (E) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond, based on about 100 parts by weight of the base resin.

Abstract: Disclosed is a resin composition including (A) a polycarbonate resin and (B) a rubber modified vinyl-based graft copolymer, and (C) about 1 to about 9 parts by weight of a random copolymer of a compound represented by the following Chemical Formula 1, an aromatic vinyl monomer, and a vinyl cyanide monomer, based on about 100 parts by weight of the polycarbonate resin (A) and the rubber-modified vinyl-based graft copolymer (B): wherein, in the above chemical formula, m is an integer ranging from 0 to 10, and X is phenyl, methylphenyl, methylethylphenyl, methoxyphenyl, cyclohexylphenyl, chlorophenyl, bromophenyl, phenylphenyl group, or benzylphenyl.

Abstract: Disclosed are a transparent thermoplastic resin composition including (A) about 5 to about 40 wt % of an impact-reinforcing agent having a core-shell structure where an acrylic-based compound is grafted on a rubber core including a copolymer of an acrylic-based monomer and a diene-based monomer, to form a shell, and (B) about 60 to about 95 wt % of an acrylic-based resin, and a molded article using the same.

Abstract: A thermoplastic resin composition comprises (A) about 30 to about 98 wt % of a polycarbonate resin, (B) about 1 to about 50 wt % of a rubber modified acrylic-based graft copolymer, and (C) about 1 to about 69 wt % of a branched copolymer including silicon-based compound. A molded article can be made using the same.

Abstract: A polyamide resin composition includes (A) a semi-aromatic polyamide resin including a dicarboxylic acid unit including about 40 to about 100 mol % of an aromatic dicarboxylic acid unit, and an aliphatic diamine unit; (B) a glass fiber, and optionally (C) a heat stabilizer including copper halide and/or alkali metal halide, where a content of a terminal carboxyl group [COOH] and a content of a terminal amino group [NH2] of a molecular chain in the semi-aromatic polyamide resin (A) satisfy the following conditions: [COOH]>37 ?eq/g; [NH2]>80 ?eq/g; and, [NH2]/[COOH]>1.

Abstract: Disclosed are a thermoplastic resin composition including (A) a polycarbonate resin, (B) an aromatic vinyl-based copolymer, (C) a rubber modified vinyl-based graft copolymer, and (D) a glass fiber, wherein the glass fiber (D) includes (D-1) a first glass fiber having a length of about 1 ?m to about 200 ?m and (D-2) a second glass fiber having a length of about 2 mm to about 6 mm, and a molded article using the same.

Abstract: There is provided a semiconductor device comprising, at least one SRAM cell, wherein the SRAM cell includes a pull-up transistor, a pull-down transistor, and a pass-gate transistor, and an inversion-layer thickness (Tinv) of a gate stack of the pass-gate transistor is different from Tinv of a gate stack of the pull-up transistor and Tinv of a gate stack of the pull-down transistor.

Abstract: A semiconductor device includes a semiconductor substrate including a first region and a second region, a first high-k dielectric film pattern on the first region, a second high-k dielectric film pattern on the second region and having the same thickness as the first high-k dielectric film pattern. First and second work function control film patterns are positioned on the high-k dielectric film patterns of the first region. Third and fourth work function control patterns are positioned on the high-k dielectric film pattern of the second region, the first work function control pattern being thicker than the third work function control pattern and the fourth work function control pattern being thicker than the second.

Abstract: A long glass reinforced resin composite of the present invention may comprise two kinds of thermoplastic matrix resin (a1, a2) which have different viscosities and a long glass fiber (B). The method of preparing the long glass reinforced resin composite comprises preparing a LFT (Long fiber thermoplastic) master-batch composition by impregnating the long glass fiber (B) of continuous phase into the low viscosity thermoplastic resin (a2), and compounding the LFT (Long fiber thermoplastic) master-hatch composition with high viscosity thermoplastic resin. The long glass fiber reinforced resin composite of the present invention has excellent mechanical properties such as impact strength, tensile strength, and flexural modulus.