Abstract: A backlight assembly includes a light guiding plate and a plurality of first light sources. The light guiding plate includes a light exiting surface through which light can exit, a light guiding surface positioned opposite to the light exiting surface, and a first surface extending between the light guiding surface and the light exiting surface and inclined with respect to the light guiding surface by a first angle. The first angle is an acute angle. The first light sources can generate light, and are disposed under the light guiding plate. These first light sources are disposed adjacent to a first edge connecting the first surface with the light guiding surface.

Abstract: A mobile terminal equipped with a flexible first display module and a second display module capable of receiving a touch input and a method of controlling the mobile terminal are provided. The method includes displaying an operating screen on the first display module and displaying an operation control menu on the second display module; determining whether the first display module is bent or folded; and choosing one of a plurality of menu items of the operation control menu corresponding to a bent or folded portion of the first display module. Therefore, it is possible to control various operations performed by the mobile terminal according to whether the first display module is bent or folded.

Abstract: Disclosed are a composition for inhibiting a proliferation of sulphate reducing bacteria comprising at least one of 1,2-benzisothiazol-3(2H)-one, irgasan, benzyl-2-bromoacetate, 2,2-dibromo-2-cyanoacetamide, and 2-bromo-2-nitropropan-1,3-diol as effective ingredients; a method for inhibiting the proliferation of sulphate reducing bacteria comprising the step of including a sufficient amount for inhibiting the proliferation of sulphate reducing bacteria of at least one of 1,2-benzisothiazol-3(2H)-one, irgasan, benzyl-2-bromoacetate, 2,2-dibromo-2-cyanoacetamide, and 2-bromo-2-nitropropan-1,3-diol in a corrosion sensitive material or degradation sensitive material; a sheet comprising the composition; and a steel plate to which the composition is applied.

Abstract: Provided are a semiconductor package and a method of forming the same. The semiconductor package includes a stress reliever disposed on a part (more specifically, a weak part) of a semiconductor chip. The stress reliever relieves thermal and/or physical stresses caused by a molding layer. As a result, the semiconductor chip does not suffer from the thermal and/or physical stresses.

Abstract: A mobile terminal equipped with a flexible first display module and a second display module capable of receiving a touch input and a method of controlling the mobile terminal are provided. The method includes displaying an operating screen on the first display module and displaying an operation control menu on the second display module; determining whether the first display module is bent or folded; and choosing one of a plurality of menu items of the operation control menu corresponding to a bent or folded portion of the first display module. Therefore, it is possible to control various operations performed by the mobile terminal according to whether the first display module is bent or folded.

Abstract: An IPTV reproducing apparatus and a method for reproducing data are disclosed.

Abstract: A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

Abstract: Through holes for flow paths of the fuel cell are formed in a thermoplastic polymer film by a process selected from a group consisting of laser drilling, etching and lithography, an inner side surface of the thermoplastic polymer film is coated with a metal layer, and the through holes are filled with a fuel diffusion material and a catalyst to provide an anode. The procedure is repeated to provide a cathode. Then, the anode and the cathode are placed to oppose each other. A cation conducting polymer membrane is disposed, between the anode and the cathode, and the anode, the cation conducting polymer membrane and the cathode are hot-pressed.

Abstract: Disclosed is a solder bonding structure for flip chip connection. Particularly, this invention relates to a solder bonding structure, in which the shape of a connection pad on which solder is applied is changed to thus increase the size of the solder bond that is formed using a reflow process, resulting in highly reliable solder bonding. To this end, the solder bonding structure is composed of a connection pad (a bridge type pattern) composed of at least two pattern regions spaced apart from each other by a predetermined interval, a solder bond formed on the connection pad having such a shape, and a metal bump in contact with the solder bond. In such a solder bonding structure, the solder bond is formed to a sufficient size on a fine pattern having a smaller width, thus achieving reliable solder bonding between the semiconductor chip having the metal bump and the printed circuit board having the connection pad.

Abstract: Provided is a garment for measuring a physiological signal. The garment includes: an inner layer made of an elastic mesh fabric; a physiological signal measuring electrode including a connector connected to an external line and an electrode having a protrusion and measuring a physiological signal, the protrusion of the electrode passing through a mesh of the inner layer and engaging with the connector to be attached to the inner layer; and a compressing cushion interposed between an outer layer and the inner layer and compressing the physiological signal measuring electrode to a human body. Accordingly, poor contact between the physiological signal measuring electrode and the human body can be prevented and noise generated when measuring the physiological signal can be reduced.

Abstract: Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S110), step for forming mounting holes in the insulating member (S120), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S130), step for forming copper cladding coated with an adhesive on the insulating member (S140), step for applying heat and/or pressure to the copper cladding (S150), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S160). The step (S150) can comprise a step (S240) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S250) for applying copper cladding on respective surfaces of the inter-adhesive.

Abstract: A parallel chip embedded printed circuit board and manufacturing method thereof are disclosed. With a method of manufacturing a parallel chip embedded printed circuit board, comprising: (a) forming a parallel chip by connecting in parallel a plurality of unit chips having electrodes or electrically connected members formed on the upper and lower surfaces thereof, using at least one conductive member; (b) joining an electrode on one side of the parallel chip to a first board; and (c) joining an electrode on the other side of the parallel chip to a second board, chips may be embedded in a printed circuit board at a low cost, as a plurality of unit chips can be embedded at once, and a mechanical drill or router can be used instead of a laser drill in perforating the cavity or via holes.

Abstract: Provided is a display device and method configured to change an image displayed in a display area flexibly when the display area is changed. The flexible display device depending on change of a display area comprises a memory, a location output unit and a screen display unit. The memory is configured to store size information of a display area displayed on a screen and the entire image data of the displayed image. The location computing unit is configured to compute a start point of the changed display area when the display area is changed. The display unit is configured to decode data corresponding to the size of the display area based on the computed new start point from the image data to display the decoded data in the display area. Since the start point is obtained with center point of the changed display area and its size information and then an display area to be displayed is determined based on the start point, a current search location is maintained as it is even when the screen is swung.

Abstract: An organic photovoltaic conversion device, such as a solar cell includes a matrix material, such as a polymer matrix material, carbon nanotubes dispersed in the matrix material, and photovoltaic organic molecules, such as organic dye molecules, attached to defect sites on the carbon nanotubes.

Abstract: Disclosed herein is a method for manufacturing a component-embedded printed circuit board that is economically advantageous and simple. The method is characterized by stacking boards in which a high density of electronic components are mounted to form a core layer in which the electronic components are embedded, and by subsequently building up additional circuit layers.

Abstract: The invention relates to derivatized, well-dispersed CNTs that have enhanced miscibility with organic agents. Composite materials may be made using such CNTs. The composite materials, in turn, may be used in optical and electronic applications.

Abstract: The present invention relates to a capacitor-embedded PCB and a method of manufacturing the same. The capacitor-embedded PCB includes a dielectric layer, a lower electrode layer formed under the dielectric layer, and an upper electrode layer formed on the dielectric layer and configured to have at least one first blind via hole that is inwardly formed.

Abstract: A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

Abstract: The present invention relates to an embedded chip printed circuit board in which a space required for embedding a chip is formed to a desired depth depending on various thicknesses of chips to be embedded, and thus, the circuit line for the electrical connection between the embedded chip and the circuit pattern layer can be formed to be relatively short, thereby maximizing space efficiency and decreasing inductance at high frequencies. In addition, a method of manufacturing such an embedded printed circuit board is also provided.

Abstract: A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.