Abstract: The present disclosure provides technology that proposes an ultra-high frequency band (mmWave band) vertical polarization antenna having a new structure applicable to a slim planar structure (e.g., a terminal).

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Abstract: Disclosed is a substrate-integrated waveguide slot antenna including a lower substrate having a substrate-integrated waveguide structure, the lower substrate being provided in the upper surface thereof with at least one slot, whereby an electromagnetic wave is guided by the substrate-integrated waveguide structure and is emitted through the slot, and an upper substrate formed on the lower substrate, the upper substrate having a metasurface configured such that a plurality of unit cells is arranged at predetermined intervals, whereby the electromagnetic wave dispatched through the slot is reemitted by the metasurface.

Abstract: The present invention relates to a method of manufacturing a main body of a grinding tool fixture, a grinding tool fixture having a cap at a front, a sleeve and a coil spring consecutively connected, and a main body connected at a rear, and the main body having a body and a rotating shaft integrally formed with a rear of the body. The main body of the grinding tool fixture is turned, heat-treated, and then straightened. According to the present invention, a grinding tool for a grinder can be conveniently attached and detached by reciprocating a sleeve such that a separate working tool or fastener is not required, and the grinding tool can be immediately replaced even during use of the grinder.

Abstract: A method of cutting a substrate including a device region and a scribe lane region includes selectively forming a passivation layer in the device region of the substrate, selectively forming a self-assembled monolayer on the passivation layer, and performing plasma cutting in the scribe lane region.

Abstract: Disclosed is a substrate-integrated waveguide slot antenna including a lower substrate having a substrate-integrated waveguide structure, the lower substrate being provided in the upper surface thereof with at least one slot, whereby an electromagnetic wave is guided by the substrate-integrated waveguide structure and is emitted through the slot, and an upper substrate formed on the lower substrate, the upper substrate having a metasurface configured such that a plurality of unit cells is arranged at predetermined intervals, whereby the electromagnetic wave dispatched through the slot is reemitted by the metasurface.

Abstract: A method of cutting a substrate including a device region and a scribe lane region includes selectively forming a passivation layer in the device region of the substrate, selectively forming a self-assembled monolayer on the passivation layer, and performing plasma cutting in the scribe lane region.

Abstract: The present inventive concept relates to a hand grinder including a grinder main body, a coupler including a power transfer member coupled to a rotary shaft of a grinder main body and a main body provided between the grinder main body and power transfer member, and a grinding disc including a grinding stone having a hollow disc plate and a coupling portion provided at a central portion of the grinding stone and detachably coupled to the coupler. A plurality of hook steps are radially arranged along an outer circumference of an upper end portion of the power transfer member, and a plurality of coupling pieces are radially arranged on an inner circumference of a central portion of the coupling portion. When the grinding disc is assembled such that the hook steps pass between the coupling pieces and the main body is rotated, a lower surface of the hook steps is placed on an upper surface of the coupling pieces and the grinding disc is fixed to the coupler.

Abstract: A window control device for a vehicle, and a method therefor, include a driving motor configured to drive a window glass, a first sensor configured to generate one pulse signal corresponding to a rotation of the driving motor, a second sensor configured to sense a voltage signal provided to the driving motor, and a controller configured to perform a safety function based on the one pulse signal generated by the first sensor and the voltage signal sensed by the second sensor. Although a fault occurs in one of two hall sensors, the window control device may normally perform the safety function.

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Abstract: The present invention relates to a device for detaching/attaching a hand grinder polishing disk, the device being clamped on the rotating shaft of a grinder main body so as to enable the easier and quicker detachment/attachment of a consumable polishing disk used for finishing, cutting, severing, etc. the surface of a target object, or to enable the definite prevention of loosening, vibration phenomenon, etc.

Abstract: A window control device for a vehicle, and a method therefor, include a driving motor configured to drive a window glass, a first sensor configured to generate one pulse signal corresponding to a rotation of the driving motor, a second sensor configured to sense a voltage signal provided to the driving motor, and a controller configured to perform a safety function based on the one pulse signal generated by the first sensor and the voltage signal sensed by the second sensor. Although a fault occurs in one of two hall sensors, the window control device may normally perform the safety function.

Abstract: The present inventive concept relates to a hand grinder including a grinder main body, a coupler including a power transfer member coupled to a rotary shaft of a grinder main body and a main body provided between the grinder main body and power transfer member, and a grinding disc including a grinding stone having a hollow disc plate and a coupling portion provided at a central portion of the grinding stone and detachably coupled to the coupler. A plurality of hook steps are radially arranged along an outer circumference of an upper end portion of the power transfer member, and a plurality of coupling pieces are radially arranged on an inner circumference of a central portion of the coupling portion. When the grinding disc is assembled such that the hook steps pass between the coupling pieces and the main body is rotated, a lower surface of the hook steps is placed on an upper surface of the coupling pieces and the grinding disc is fixed to the coupler.

Abstract: The present invention relates to a method of manufacturing a main body of a grinding tool fixture, a grinding tool fixture having a cap at a front, a sleeve and a coil spring consecutively connected, and a main body connected at a rear, and the main body having a body and a rotating shaft integrally formed with a rear of the body. The main body of the grinding tool fixture is turned, heat-treated, and then straightened. According to the present invention, a grinding tool for a grinder can be conveniently attached and detached by reciprocating a sleeve such that a separate working tool or fastener is not required, and the grinding tool can be immediately replaced even during use of the grinder.

Abstract: The present invention relates to a device for detaching/attaching a hand grinder polishing disk, the device being clamped on the rotating shaft of a grinder main body so as to enable the easier and quicker detachment/attachment of a consumable polishing disk used for finishing, cutting, severing, etc. the surface of a target object, or to enable the definite prevention of loosening, vibration phenomenon, etc.

Abstract: A semiconductor package may include a first semiconductor chip including a first surface facing a package substrate, a second surface opposite to the first surface, and at least one through-electrode penetrating the first semiconductor chip, a molding layer molding the first semiconductor chip and exposing the second surface of the first semiconductor chip, a second semiconductor chip stacked on the second surface of the first semiconductor chip, and a non-conductive film provided between the first and second semiconductor chips. The second semiconductor chip includes an overhang portion extending past an edge of the first semiconductor chip. For example, a size of the second semiconductor chip may be greater than that of the first semiconductor chip, so the second semiconductor chip has an overhang. The second semiconductor chip includes at least one interconnecting terminal electrically connected to the at least one through-electrode.

Abstract: A selective catalytic reduction and catalytic regeneration system includes: a main exhaust flow path; a reactor which is installed on the main exhaust flow path; a bypass exhaust flow path which branches off from the main exhaust flow path, and bypasses the reactor; an ammonia injection unit, which injects ammonia to the exhaust gas which is to flow into the reactor; a hydrolysis chamber, which produces ammonia to be supplied to the ammonia injection unit; a branch flow path, which branches off from the main exhaust flow path at a front side of the reactor; a recirculation flow path, which branches off from the main exhaust flow path at a rear side of the reactor, and merges with the branch flow path; and a multifunctional flow path, which connects the hydrolysis chamber with a point where the branch flow path and the recirculation flow path merge together.

Abstract: A semiconductor package may include a first semiconductor chip including a first surface facing a package substrate, a second surface opposite to the first surface, and at least one through-electrode penetrating the first semiconductor chip, a molding layer molding the first semiconductor chip and exposing the second surface of the first semiconductor chip, a second semiconductor chip stacked on the second surface of the first semiconductor chip, and a non-conductive film provided between the first and second semiconductor chips. The second semiconductor chip includes an overhang portion extending past an edge of the first semiconductor chip. For example, a size of the second semiconductor chip may be greater than that of the first semiconductor chip, so the second semiconductor chip has an overhang. The second semiconductor chip includes at least one interconnecting terminal electrically connected to the at least one through-electrode.

Abstract: A selective catalytic reduction and catalytic regeneration system includes: a main exhaust flow path; a reactor which is installed on the main exhaust flow path; a bypass exhaust flow path which branches off from the main exhaust flow path, and bypasses the reactor; an ammonia injection unit, which injects ammonia to the exhaust gas which is to flow into the reactor; a hydrolysis chamber, which produces ammonia to be supplied to the ammonia injection unit; a branch flow path, which branches off from the main exhaust flow path at a front side of the reactor; a recirculation flow path, which branches off from the main exhaust flow path at a rear side of the reactor, and merges with the branch flow path; and a multifunctional flow path, which connects the hydrolysis chamber with a point where the branch flow path and the recirculation flow path merge together.

Abstract: Apparatuses of manufacturing semiconductor packages are provided. An apparatus includes a chuck having a body, a porous plate disposed on the body, and a buffer pad disposed on the plate to provide a place on which a plurality of chips are loaded. The buffer pad has elasticity greater than the plate. The apparatus also includes a vacuum part supplying vacuum to the chuck so that the plurality of chips are sucked onto the buffer pad. Methods of manufacturing semiconductor packages using the apparatus are also provided.