Abstract: Disclosed is a MEMS variable capacitor, the capacitor including a first electrode, a second electrode that is floated on an upper surface of the first electrode, and a third electrode capable of variably-adjusting a capacitance value by adjusting a gap between the first electrode and the second electrode.

Abstract: Disclosed herein is a variable capacitor and its driving method, the variable capacitor including, a movable first electrode; and a second electrode formed with an insulating film, fixed in place, and its insulating film contacting the first electrode that is moved.

Abstract: Disclosed herein is an MEMS variable capacitor and its driving method, the MEMS variable capacitor including, a first electrode, a second electrode floating over the first electrode upper part, a fixed electrode separated at the second electrode side surface, and a drifting electrode placed between the second electrode and the fixed electrode, connected to the second electrode, and physically contacting the fixed electrode by a voltage applied to the fixed electrode.

Abstract: A method of forming a photoelectrode structure includes: disposing a light-scattering layer including a nanowire on a photoanode substrate; and coating the light-scattering layer with an inorganic binder solution to fix the light-scattering layer on the photoanode substrate. Due to the structure of the photoelectrode structure, the adhesive force between the light-scattering layer and the photoanode substrate is enhanced and the photocurrent density is increased.

Abstract: A method of forming a photoelectrode structure includes: disposing a light-scattering layer including a nanowire on a photoanode substrate; and coating the light-scattering layer with an inorganic binder solution to fix the light-scattering layer on the photoanode substrate. Due to the structure of the photoelectrode structure, the adhesive force between the light-scattering layer and the photoanode substrate is enhanced and the photocurrent density is increased.

Abstract: A negative electrode for a lithium rechargeable battery includes a current collector, and a negative active material layer on the current collector, the negative active material layer including a silicon-based active material, a carbon-based active material, and an aqueous additive including an aqueous binder and an agent for increasing viscosity, the silicon-based active material being coated with an organic binder, wherein the aqueous additive is between portions of the silicon-based active material, between portions of the carbon-based active material, or between the silicon-based active material and the carbon-based active material.

Abstract: A dye-sensitized solar cell including a first electrode, a negative photoelectrode on the first electrode, a light scattering layer on a surface of the negative photoelectrode, a second electrode facing the first electrode with the negative photoelectrode and the light scattering layer therebetween, and an electrolyte between the first electrode and the second electrode. The light scattering layer includes a titanium dioxide nano wire and a titanium dioxide nano particle.

Abstract: A dye-sensitized solar cell includes a first electrode, a light absorption layer disposed on one side of the first electrode, a second electrode facing the first electrode, a light reflecting layer disposed on one side of the second electrode, and an electrolyte filled between the first electrode and the second electrode. Here, the light reflecting layer includes a plurality of thin films including a first oxide thin film and a second oxide thin film, the first oxide thin film has a different refractive index from the second oxide thin film, and the first and second oxide thin films are stacked alternately.

Abstract: An apparatus and method for matching impedance of an antenna by using Standing Wave Ratio (SWR) information is provided. While the impedance of the impedance matching unit is controlled, a region of a Smith chart in which initial total impedance of the impedance matching unit and the antenna is located by using an SWR calculated by an SWR operation unit, and the impedance of the impedance matching unit is controlled according to the determined region, thus correctly matching the impedance of the antenna.

Abstract: A method of fabricating a high-voltage semiconductor device includes the following steps: providing a semiconductor layer; forming a plurality of trenches in the semiconductor layer to define a plurality of pillars of a first conductivity type in the semiconductor layer between adjacent trenches, wherein the trenches extend from a top surface of the semiconductor layer toward a bottom surface of the semiconductor layer; forming a charge compensation layer of a second conductivity type over at least sidewalls of each trench to a predetermined thickness thereby forming a groove in each trench; and substantially filling each groove with a charge compensation plug of the first conductivity type.

Abstract: A high-voltage semiconductor device includes a semiconductor layer having a plurality of pillars of a first conductivity type defined by a plurality of trenches which extend from a top surface of the semiconductor layer toward a bottom surface thereof. A charge compensation layer of a second conductivity type is disposed over at least sidewalls of each trench to a predetermined thickness to form a groove in each trench. A charge compensation plug of the first conductivity type substantially fills each groove.

Abstract: An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

Abstract: A drum assembly of a laundry dryer includes a cylindrical drum main body formed through a seam-welding process, a drum head including a main head rim having a predetermined width in a direction toward a center of the drum main body, the main head rim being coupled to a first end of the drum main body and provided with a plurality of elevated portion, and a support sleeve bent from an end of the main head rim, a drum rear wall coupled to a second end of the drum main body and provided with a plurality of hot wind introducing holes, and a lift coupled to an inner circumference of the drum main body to lift the laundry.

Abstract: Provided are a composition for preparing an electron emission source, including a nano-sized inorganic material and a vehicle, a method for preparing an electron emission source using the composition, an electron emission source including a nano-sized inorganic material and a small amount of a residual carbon, and further, an electron emission device including the electron emission source.

Abstract: In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Abstract: An electron emission source including a carbon-based material coated with metal carbide in the surface coating layer, of which the metal has a negative Gibbs free energy when forming the metal carbide at 1,500 K or lower, a method of preparing electron emission sources, and an electron emission device including the electron emission source. The electron emission source includes a carbon nanotube coated with metal carbide or a carbon nanotube having a metal carbide layer and a metal coating layer, which are sequentially formed thereon. Thus, the electron emission source has long lifespan without deterioration of electron emitting characteristics. The electron emission source can be used to manufacture electron emission devices with improved reliability.

Abstract: A composition for preparing an electron emitter, an electron emitter produced by using the composition, and an electron emission device comprising the electron emitter are provided. The composition for preparing an electron emitter includes carbon-based materials and vehicles, wherein the vehicles comprise a polymer having a vinyl pivalate monomer. The composition for preparing an electron emitter improves a printing and a current-voltage characteristic simultaneously.

Abstract: The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess.