Abstract: A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.

Abstract: An underneath type railway freight car bogie wheelset radial device has front and rear subframes and two cross-arranged connecting rods that are pinned by round pin connectors. The subframe is a combination structure of the adapter and the lateral arm. The connecting rods are arranged under the bolster to form the underneath bogie wheelset radial structure. The height of the central plane of the connecting rod is lower than the height of the central plane of the subframe adapter surface. The adapter has an adapter surface forming an arc-shaped adapter structure and an adapter connecting arm integrated with the adapter surface structure and vertically arranged at one end of the adapter surface; the subframes are fixed to the adapter by the rivet assembly.

Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.

Abstract: A detection system adapted for a liquid-cooling system includes a pressurizing device and at least one pressure sensor, the pressurizing device is configured to connect to and to pressure the liquid-cooling system, the pressure sensor is configured to measure a transient pressure response in response to detecting residual air bubbles in the liquid-cooling system.

Abstract: A testing device for simulating frictional wear behaviors of threaded joints of a drill pipe under turbid seafloor environment, including a support, an oil cylinder, upper and lower specimens, a first motor, several second motors, stirring rods, a turbidity sensor, and a test tank. The oil cylinder and test tank are arranged on the support. A piston rod of the oil cylinder is connected to the first motor. A rotating-speed sensor is arranged on a bottom surface of the first motor, facing toward an output shaft of the first motor. The output shaft of the first motor is connected to an upper end of a torque limiter. A lower end of the upper specimen fits an upper end of the lower specimen under loading of a main shaft of the first motor. The stirring rods are provided at two sides of the test tank.

Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.

Abstract: A computing system includes a cabinet, an inlet temperature sensor, a cooling device, an environmental sensor, and at least one processor. The cabinet houses at least one computing device. The inlet temperature sensor is configured to detect inlet temperature data for the at least one computing device. The inlet temperature data represents internal temperature within the cabinet. The cooling device is coupled to the cabinet for maintaining temperature within the cabinet. The environmental sensor is configured to detect environmental temperature data external to the cabinet. The environmental temperature data represents external temperature outside the cabinet. The at least one processor is configured to: (a) determine if one or more of the inlet temperature data and the environmental temperature data exceeds a temperature range; and (b) in response to the temperature range being exceeded, generate a first warning signal indicating a temperature problem.

Abstract: A flow path module, adapted to a heat exchange element and a coolant and including a pipeline structure and at least one flow resistance element, is provided. The pipeline structure is adapted to be connected to the heat exchange element. The flow resistance element is disposed in the pipeline structure, and the coolant flows through the heat exchange element from the pipeline structure. A flow resistance of the flow resistance element is adapted to be adjusted corresponding to a flow resistance of the heat exchange element. A coolant distribution device and a server are also provided.

Abstract: Cooling devices, such as fans, installed in a computing device can be automatically identified by reading an encoded signal from the cooling device's tachometer signal line. A cooling device can temporarily output an encoded signal in response to a trigger event, such as a power on event (e.g., powering-on of the cooling device). A controller, such as a baseboard management controller (BMC), can receive the encoded signal and decode the signal to determine identification information about the cooling device, such as vendor information and/or model information. The identification information about the cooling device can be stored, logged, output, and/or used to customize the operation of the cooling device.

Abstract: Disclosed are compositions comprising a) one or more polycarbonates; b) one or more first colorants; c) one or more flame retardants; and d) one or more particles having a melting point above the temperature at which polycarbonates are processed wherein the particles are coated with an organic polymer having a melting point above the processing temperature of the one or more polycarbonates; wherein the composition when molded exhibits a flecked appearance. The particles have a second colorant bound to the surface of the particles by the organic polymer. The organic polymer may be crosslinked. The one or more polycarbonates may comprise post-consumer recycled polycarbonates. Disclosed are molded products prepared from the disclosed compositions. The molded products exhibit good properties as disclosed herein. The molded products have a flecked appearance.

Abstract: A wafer having a first region and a second region is provided. A first topography variation exists between the first region and the second region. A first layer is formed over the first region and over the second region of the wafer. The first layer is patterned. A patterned first layer causes a second topography variation to exist between the first region and the second region. The second topography variation is smoother than the first topography variation. A second layer is formed over the first region and the second region. At least a portion of the second layer is formed over the patterned first layer.

Abstract: A light emitting device includes a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element. The second reflective layer has an outer diameter. A top surface of the second reflective layer is lower than a top surface of the light emitting element. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer. The encapsulating layer is directly contact with the outer diameter.

Abstract: A VCO (voltage-controlled oscillator) includes: a resonant tank having a parallel connection of an inductor, a fixed capacitor, a variable capacitor, a first temperature compensating capacitor, and a second temperature compensating capacitor across a first node and a second node, and configured to establish an oscillation of a first oscillatory voltage at the first node and a second oscillatory voltage at the second node; and a regenerative network placed across the first node and the second node to provide energy to sustain the oscillation. The variable capacitor is controlled by a control voltage, the first temperature compensating capacitor is controlled by a first temperature tracking voltage of a positive temperature coefficient, and the second temperature compensating capacitor is controlled by a second temperature tracking voltage of a negative temperature coefficient.

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

Abstract: An object detection model training apparatus, method and non-transitory computer readable storage medium thereof are provided. The apparatus performs a first object detection on a plurality of training images to generate a piece of first label information corresponding to each of the training images by a first teacher model. The apparatus trains a student model based on the training images and the first label information. The apparatus performs a second object detection on the training images to generate a piece of second label information corresponding to each of the training images by a second teacher model. The apparatus trains the student model based on the training images and the second label information.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: The present disclosure provides an impregnation device for a fiber prepreg, which includes a film layer separation assembly, a hot pressing element, and a thermal barrier element. The hot pressing element is disposed beneath the film layer separation assembly. The thermal barrier element is disposed between the film layer separation assembly and the hot pressing element. The present disclosure also provides an impregnation method for a fiber prepreg.

Abstract: A method of manufacturing resin composition includes following operations. A nano-particle filler, a micro-inorganic particle, and a resin are stirred and mixed to form a mixture. The mixture is centrifuged at a high speed to form an upper layer mixing liquid and a lower layer mixing liquid. The upper layer mixing liquid is taken out and obtains the resin composition.

Abstract: The present disclosure provides a light emitting device including a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element, and the second reflective layer has an outer diameter. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer, and the height is 0.1 to 0.5 times the outer diameter. The present disclosure also provides a backlight and a display panel.

Abstract: An electrostatic discharge (ESD) circuit is used to protect an internal circuit. The ESD circuit includes: an ESD clamp, having a first terminal connected to a power and a second terminal connected to a ground voltage; and a first switch, connected between an ESD terminal of the ESD clamp and the internal circuit. A gate of the first switch is controlled by a state signal in the ESD clamp to turn off the first switch when an ESD event occurs on the first terminal of the ESD clamp and turn on the first switch when the ESD event does not occur.