Patents by Inventor Changhong Dai

Changhong Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Analyzing interconnect structures
    Publication number: 20040082230
    Abstract: In one embodiment, an interconnect structure may be analyzed to determine electromagnetic characteristics of the structure by identifying structure seeds corresponding to the structure; modeling the structure seeds to obtain field patterns; and processing the field patterns to obtain the electromagnetic characteristics.
    Type: Application
    Filed: October 28, 2002
    Publication date: April 29, 2004
    Inventors: Dan Jiao, Mohiuddin Mazumder, Changhong Dai