Abstract: A multi-wafer stacking structure and a fabrication method thereof are disclosed. A first dielectric layer and a second dielectric layer are bonded to each other, a first interconnection layer is electrically connected with a second metal layer and a first metal layer via a first opening; a third dielectric layer and an insulating layer are bonded to each other, and a second interconnection layer is electrically connected with a third metal layer and the first interconnection layer via a second opening. Reservation of a pressure welding lead space among wafers is not needed, a silicon substrate is omitted, multi-wafer stacking thickness is reduced while interconnection of multiple pieces of wafers is realized, and therefore, the overall thickness of the device after multi-wafer stacking and packaging is reduced, packaging density is increased, and the requirement of thinning of the semiconductor products is met.

Abstract: A semiconductor device and a manufacturing method thereof are disclosed. In the device, the isolation layer is used to prevent the first metal layer and the second metal layer which are over-etched and back-splashed from diffusing to a first substrate; and the isolation layer serves as a barrier layer to prevent an interconnection layer from diffusing into the first substrate. Further, the isolation layer includes a silicon nitride layer, which is advantageous for preventing the metal layers from back-splashing and diffusing to the sidewall of the first substrate. The isolation layer further includes a first silicon oxide layer and a second silicon oxide layer, wherein the second silicon oxide layer is used to protect the silicon nitride layer from being etched and consumed and the first silicon oxide layer is used to improve the adhesion between the silicon nitride layer and the first substrate.

Abstract: A multi-wafer stacking structure and fabrication method are disclosed. In the multi-wafer stacking structure, a first interconnection layer is electrically connected to a second metal layer and a first metal layer via a first opening, a second interconnection layer is electrically connected to the first interconnection layer via a second opening, a third interconnection layer is electrically connected to a third metal layer via a third opening, and the second interconnection layer is electrically connected to the third interconnection layer. It is unnecessary to reserve a bonding lead space between wafers, a silicon substrate is eliminated, and the multi-wafer stacking thickness is reduced while multi-wafer interconnection is realized, so that the overall device thickness is reduced after multi-wafer stacked package. Moreover, there is no need of leads, so as to eliminate design processing of a silicon substrate and a plurality of shared bonding pads on the silicon substrate.

Abstract: A multi-wafer stack structure and fabricating method thereof are disclosed. In the multi-wafer stack structure, the first interconnection layer is electrically connected to the second metal layer and the first metal layer via the first opening, the second interconnection layer is electrically connected to the first interconnection layer via the second openings, the third interconnection layer is electrically connected to the third metal layer via the third openings, and the second interconnection layer is in contact with the third interconnection layer, so that there is no need to reserve the wire pressure welding space between the wafers and a silicon substrate is eliminated, the overall device thickness of the multi-wafer stack package is reduced. Moreover, the design processing of the silicon substrate and a plurality of common pads on the silicon substrate is eliminated, thereby reducing the parasitic capacitance and power loss, and increasing the transmission speed.

Abstract: A semiconductor device and a manufacturing method thereof are disclosed. In which a first opening and a second opening are vertically separated, and are no longer restricted by the condition that a deep upper opening needs to be filled with a thick photoresist when a TSV nested hole in vertical communication forms a middle opening and lower opening, thereby satisfying devices with different thicknesses requirements. The design is no longer restricted by the lateral process of the TSV nested hole, thereby enhancing the flexibility of the design. In the photolithography process, the deep hole does not need to be filled with the photoresist, the photoresist does not need to be thick, thereby reducing the complexity of the photolithography process and improving the exposure effect. The first metal layer and the second metal layer are directly led out via a first trench, thereby simplifying the process and reducing the production cost.

Abstract: A thermal extrusion method to fabricate large-dimension superhydrophobic cylinder pillar arrays with droplet pancake bouncing phenomenon. Preparing thermal extrusion mold: the through-hole arrays with 0.8˜1.25 mm diameter, 0.25 mm interval space and 0.6˜1.0 mm height are first obtained on metals, and are then polished, rinsed and dried. Thermal extrusion: polymer materials are first thermally extruded on the obtained mold and cooled to room temperature. Demold: excess polymer materials flowing from the through hole are cut off and then the polymer cylinder pillar arrays are lifted off from the mold. Superhydrophobic treatment: the whole polymer sample is treated using mixed liquid spray consisting of titanium oxide nanoparticles dispersed in fluoroalkylsilane ethanol solution, and the superhydrophobic cylinder pillar arrays are obtained.

Abstract: An optical imaging lens includes first, second, third, fourth, fifth and sixth lens elements arranged in order from the object side to the image side. The first lens element has an image-side surface with a concave portion in a vicinity of its periphery, the third lens element has positive refractive power and an object-side surface with a convex portion in a vicinity of its periphery, the fifth lens element has negative refractive power, and the sixth lens element has an image-side surface with a concave portion in a vicinity of the optical axis.

Abstract: An optical imaging lens includes first, second, third, fourth, fifth and sixth lens elements arranged in order from the object side to the image side. The first lens element has an image-side surface with a concave portion in a vicinity of its periphery, the third lens element has positive refractive power and an object-side surface with a convex portion in a vicinity of its periphery, the fifth lens element has negative refractive power, and the sixth lens element has an image-side surface with a concave portion in a vicinity of the optical axis.

Abstract: An optical imaging lens includes first, second, third, fourth, fifth and sixth lens elements arranged in order from the object side to the image side. The first lens element has an image-side surface with a concave part in a vicinity of its periphery, the second lens element has an image-side surface with a concave part in a vicinity of the optical axis, the third lens element has positive refractive power, the fourth lens element has an object-side surface with a convex part in a vicinity of its periphery, the fifth lens element has an object-side surface with a concave part in a vicinity of the optical axis, the sixth lens element has an image-side surface with a concave part in a vicinity of the optical axis. The second lens element has negative refractive power. The sixth lens element has positive refractive power.

Abstract: An optical imaging lens includes first, second, third, fourth, fifth and sixth lens elements arranged in order from the object side to the image side. The first lens element has an image-side surface with a concave part in a vicinity of its periphery, the second lens element has an image-side surface with a concave part in a vicinity of the optical axis, the third lens element has positive refractive power, the fourth lens element has an object-side surface with a convex part in a vicinity of its periphery, the fifth lens element has an object-side surface with a concave part in a vicinity of the optical axis, the sixth lens element has an image-side surface with a concave part in a vicinity of the optical axis. The second lens element has negative refractive power. The sixth lens element has positive refractive power.

Abstract: An imaging lens includes first to sixth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: Present embodiments provide for a mobile device and an optical imaging lens thereof. The optical imaging lens comprises six lens elements positioned sequentially from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements and designing parameters satisfying at least one inequality, the optical imaging lens shows better optical characteristics and the total length of the optical imaging lens is shortened.

Abstract: An optical imaging lens includes: a first, second, third, fourth, fifth and sixth lens element. The first lens element has an image-side surface with a concave part in a vicinity of its periphery, the second lens element has an image-side surface with a concave part in a vicinity of the optical axis, the third lens element has positive refractive power, the fourth lens element has an object-side surface with a convex part in a vicinity of its periphery, the fifth lens element has an object-side surface with a concave part in a vicinity of the optical axis, the sixth lens element has an image-side surface with a concave part in a vicinity of the optical axis, and the sixth lens element being made of plastic.

Abstract: An imaging lens includes first to sixth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.

Abstract: An optical imaging lens includes: a first, second, third, fourth, fifth and sixth lens element, the first lens element has a positive refracting power, the second lens element has a negative refracting power and an object-side surface with a concave part in a vicinity of its periphery, the third lens element has an object-side surface with a concave part in a vicinity of its periphery, and an image-side surface with a convex part in a vicinity of the optical axis, the fourth lens has an image-side surface with a convex part in a vicinity of the optical axis, the fifth lens element has object-side surface with a concave part in a vicinity of its periphery, and an image-side surface with a convex part in a vicinity of the optical axis, the sixth lens element has an image-side surface with a convex part in a vicinity of its periphery.

Abstract: An optical imaging lens includes: a first, second, third, fourth, fifth and sixth lens element, the first lens element has a positive refracting power, the second lens element has a negative refracting power and an object-side surface with a concave part in a vicinity of its periphery, the third lens element has an object-side surface with a concave part in a vicinity of its periphery, and an image-side surface with a convex part in a vicinity of the optical axis, the fourth lens has an image-side surface with a convex part in a vicinity of the optical axis, the fifth lens element has object-side surface with a concave part in a vicinity of its periphery, and an image-side surface with a convex part in a vicinity of the optical axis, the sixth lens element has an image-side surface with a convex part in a vicinity of its periphery.

Abstract: An optical imaging lens includes: a first, second, third, fourth, fifth and sixth lens element. The first lens element has an image-side surface with a concave part in a vicinity of its periphery, the second lens element has an image-side surface with a concave part in a vicinity of the optical axis, the third lens element has positive refractive power, the fourth lens element has an object-side surface with a convex part in a vicinity of its periphery, the fifth lens element has an object-side surface with a concave part in a vicinity of the optical axis, the sixth lens element has an image-side surface with a concave part in a vicinity of the optical axis, and the sixth lens element being made of plastic.

Abstract: Present embodiments provide for a mobile device and an optical imaging lens thereof. The optical imaging lens comprises six lens elements positioned sequentially from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements and designing parameters satisfying at least one inequality, the optical imaging lens shows better optical characteristics and the total length of the optical imaging lens is shortened.