Patents by Inventor Chantal Combi
Chantal Combi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8847340Abstract: Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.Type: GrantFiled: May 31, 2013Date of Patent: September 30, 2014Assignee: STMicroelectronics S.r.l.Inventors: Lorenzo Baldo, Chantal Combi, Mario Francesco Cortese
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Patent number: 8796059Abstract: Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.Type: GrantFiled: January 25, 2012Date of Patent: August 5, 2014Assignee: STMicroelectronics S.r.l.Inventors: Lorenzo Baldo, Chantal Combi, Mario Francesco Cortese
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Publication number: 20130264662Abstract: Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.Type: ApplicationFiled: May 31, 2013Publication date: October 10, 2013Inventors: Lorenzo BALDO, Chantal COMBI, Mario Francesco CORTESE
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Patent number: 8546895Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: GrantFiled: October 17, 2011Date of Patent: October 1, 2013Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) LtdInventors: Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo
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Publication number: 20120164775Abstract: Electronic device which comprises a substrate provided with at least one passing opening, a MEMS device with function of differential sensor provided with a first and a second surface and of the type comprising at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof, the first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate so as to leave the first and second opposed active surfaces exposed respectively through the passinType: ApplicationFiled: January 25, 2012Publication date: June 28, 2012Applicant: STMICROELECTRONICS S.R.L.Inventors: Lorenzo BALDO, Chantal COMBI, Mario Francesco CORTESE
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Patent number: 8134214Abstract: Electronic device which comprises a substrate provided with at least one passing opening, a MEMS device with function of differential sensor provided with a first and a second surface and of the type comprising at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof, the first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate so as to leave the first and second opposed active surfaces exposed respectively through the passinType: GrantFiled: July 24, 2009Date of Patent: March 13, 2012Assignee: STMicroelectronics S.r.l.Inventors: Lorenzo Baldo, Chantal Combi, Mario Francesco Cortese
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Publication number: 20120032285Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: ApplicationFiled: October 17, 2011Publication date: February 9, 2012Applicants: STMICROELECTRONICS (MALTA) LTD., STMICROELECTRONICS S.R.L.Inventors: Mario CORTESE, Mark Anthony AZZOPARDI, Edward MYERS, Chantal COMBI, Lorenzo BALDO
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Patent number: 8049287Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.Type: GrantFiled: April 14, 2008Date of Patent: November 1, 2011Assignee: STMicroelectronics S.r.l.Inventors: Chantal Combi, Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra, Caterina Riva
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Patent number: 8044929Abstract: In a data-input device an actuator element that can be manually actuated, and a sensor mechanically coupled to the actuator element. The sensor is formed in a body of semiconductor material housing a first sensitive element, which detects the actuation of the actuator element and generates electrical control signals. The first sensitive element is a microelectromechanical pressure sensor, formed by: a cavity made within the body; a diaphragm made in a surface portion of the body and suspended above the cavity; and piezoresistive transducer elements integrated in peripheral surface portions of the diaphragm in order to detect its deformations upon actuation of the actuator element.Type: GrantFiled: March 30, 2006Date of Patent: October 25, 2011Assignee: STMicroelectronics S.r.l.Inventors: Lorenzo Baldo, Chantal Combi, Simone Sassolini, Marco Del Sarto
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Patent number: 8043881Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: GrantFiled: December 15, 2010Date of Patent: October 25, 2011Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd.Inventors: Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo
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Patent number: 7928960Abstract: In an input device, a control element is operated by a user; a pressure sensor is mechanically coupled to the control element and is provided with a monolithic body of semiconductor material housing a first sensitive element, which detects an actuation of the control element; a supporting element is connected to the pressure sensor; and connection elements electrically connect the monolithic body to the supporting element without interposition of a package. In particular, the monolithic body has electrical-contact areas carried by one main surface thereof, and the printed circuit board has conductive regions carried by a main face thereof; the connection elements are conductive bumps and electrically connect the electrical-contact areas to the conductive regions.Type: GrantFiled: September 8, 2006Date of Patent: April 19, 2011Assignee: STMicroelectronics S.r.l.Inventors: Lorenzo Baldo, Chantal Combi, Dino Faralli
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Publication number: 20110081739Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: ApplicationFiled: December 15, 2010Publication date: April 7, 2011Applicants: STMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd.Inventors: Mario CORTESE, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo
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Patent number: 7875942Abstract: An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.Type: GrantFiled: January 4, 2008Date of Patent: January 25, 2011Assignees: STMicroelectronics, S.r.l., STMicroelectronics (Malta) Ltd.Inventors: Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo
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Patent number: 7678600Abstract: A process for manufacturing an integrated membrane made of semiconductor material includes the step of forming, in a monolithic body of semiconductor material having a front face, a buried cavity, extending at a distance from the front face and delimiting with the front face a surface region of the monolithic body, the surface region forming a membrane that is suspended above the buried cavity. The process further envisages the step of forming an insulation structure in a surface portion of the monolithic body to electrically insulate the membrane from the monolithic body; and the further and distinct step of setting the insulation structure at a distance from the membrane so that it will be positioned outside the membrane at a non-zero distance of separation.Type: GrantFiled: March 13, 2008Date of Patent: March 16, 2010Assignee: STMicroelectronics S.r.l.Inventors: Flavio Francesco Villa, Pietro Corona, Chantal Combi, Lorenzo Baldo, Gabriele Barlocchi
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Publication number: 20090278215Abstract: Electronic device which comprises a substrate provided with at least one passing opening, a MEMS device with function of differential sensor provided with a first and a second surface and of the type comprising at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof, the first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate so as to leave the first and second opposed active surfaces exposed respectively through the passinType: ApplicationFiled: July 24, 2009Publication date: November 12, 2009Applicant: STMICROELECTRONICS S.R.L.Inventors: Lorenzo BALDO, Chantal COMBI, Mario Francesco CORTESE
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Patent number: 7489004Abstract: A micro-electro-mechanical variable capacitor has a first and a second electrode, and a dielectric region arranged on the first electrode. An intermediate electrode is arranged on the dielectric region. The first electrode is fixed and anchored to a substrate, and the second electrode includes a membrane movable with respect to the first electrode according to an external actuation, in particular an electrostatic force due to an actuation voltage applied between an actuation electrode and the first electrode. The second electrode is suspended over the intermediate electrode in a first operating condition, and contacts the intermediate electrode in a second operating condition; in particular, in the second operating condition, a short-circuit is established between the second electrode and the intermediate electrode.Type: GrantFiled: January 24, 2006Date of Patent: February 10, 2009Assignee: STMicroelectronics S.r.l.Inventors: Chantal Combi, Andrea Rusconi Clerici Beltrami, Benedetto Vigna
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Publication number: 20080315333Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidically isolated from the first empty space, is provided over the respective membrane of the further integrated device.Type: ApplicationFiled: April 14, 2008Publication date: December 25, 2008Applicant: STMicroelectronics S.r.l.Inventors: Chantal Combi, Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra, Caterina Riva
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Publication number: 20080224242Abstract: A process for manufacturing an integrated membrane made of semiconductor material includes the step of forming, in a monolithic body of semiconductor material having a front face, a buried cavity, extending at a distance from the front face and delimiting with the front face a surface region of the monolithic body, the surface region forming a membrane that is suspended above the buried cavity. The process further envisages the step of forming an insulation structure in a surface portion of the monolithic body to electrically insulate the membrane from the monolithic body; and the further and distinct step of setting the insulation structure at a distance from the membrane so that it will be positioned outside the membrane at a non-zero distance of separation.Type: ApplicationFiled: March 13, 2008Publication date: September 18, 2008Applicant: STMICROELECTRONICS S.R.L.Inventors: Flavio Franceso Villa, Pietro Corona, Chantal Combi, Lorenzo Baldo, Gabriele Barlocchi
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Patent number: 7421904Abstract: Described herein is an assembly of an integrated device and of a cap coupled to the integrated device; the integrated device is provided with at least a first and a second region to be fluidically accessed from outside, and the cap has an outer portion provided with at least a first and a second inlet port in fluid communication with the first and second regions. In particular, the first and second regions are arranged on a first outer face, or on respective adjacent outer faces, of the integrated device, and an interface structure is set between the integrated device and the outer portion of the cap, and is provided with a channel arrangement for routing the first and second regions towards the first and second inlets.Type: GrantFiled: June 25, 2007Date of Patent: September 9, 2008Assignee: STMicroelectronics S.r.l.Inventors: Federico Giovanni Ziglioli, Chantal Combi, Lorenzo Baldo, Caterina Riva, Mark Andrew Shaw
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Patent number: RE46671Abstract: A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.Type: GrantFiled: October 31, 2013Date of Patent: January 16, 2018Assignee: STMicroelectronics S.r.l.Inventors: Chantal Combi, Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra, Caterina Riva