Abstract: A display panel including a circuit substrate, a plurality of light-emitting elements, a plurality of microlenses, and a plurality of dummy microlenses is provided. The circuit substrate is provided with a plurality of pixel areas. Each of the pixel areas is provided with the light-emitting elements. The plurality of microlenses are disposed on the circuit substrate and respectively overlapped with the light-emitting elements. The plurality of dummy microlenses are disposed between the microlenses and not overlapped with the light-emitting elements.

Abstract: A sensing panel includes a substrate, a first sensor, a second sensor, a first switching element, and a second switching element. The first sensor includes a first metal electrode layer, a light-sensing layer, and a first transparent electrode layer. The first sensor is configured to receive a light and correspondingly generate a first sensing signal. The second sensor includes a second metal electrode layer, an insulating layer, and a second transparent electrode layer. The second sensor is configured to contact an object and generate a second sensing signal based on a capacitance value between the object and the second metal electrode layer. The first metal electrode layer is electrically connected to the second metal electrode layer and is electrically connected to the first switching element and the second switching element. The first transparent electrode layer is electrically connected with the second transparent electrode layer.

Abstract: The present disclosure provides a light emitting diode structure. The light emitting diode structure includes a substrate, a first light emitting structure on the substrate, a second light emitting structure on the substrate, and a third light emitting structure on the substrate. The first light emitting structure includes a first light emitting diode and a first focusing optic on the first light emitting diode. The second light emitting structure includes a second light emitting diode and a second focusing optic on the second light emitting diode. The third light emitting structure includes a third light emitting diode and a third focusing optic on the third light emitting diode. The first light emitting structure, the second light emitting structure and the third light emitting structure are arranged along a first direction and are dislocated in a second direction perpendicular to the first direction.

Abstract: A capacitive fingerprint sensor is provided. The capacitive fingerprint sensor includes a plurality of capacitive sensing pixels. Each of the capacitive sensing pixels includes a sensing node, a first transistor, a sensing capacitor and a second transistor. The first transistor has a first terminal receiving a first system voltage, a control terminal receiving a reset control signal, and a second terminal coupled to the sensing node. The sensing capacitor is coupled between the sensing node and a sensing control signal. The second transistor has a first terminal receiving a second system voltage, a control terminal receiving a sensing voltage of the sensing node, and a second terminal providing a sensing output signal.

Abstract: A capacitive fingerprint sensor is provided. The capacitive fingerprint sensor includes a plurality of capacitive sensing pixels. Each of the capacitive sensing pixels includes a sensing node, a first transistor, a sensing capacitor and a second transistor. The first transistor has a first terminal receiving a first system voltage, a control terminal receiving a reset control signal, and a second terminal coupled to the sensing node. The sensing capacitor is coupled between the sensing node and a sensing control signal. The second transistor has a first terminal receiving a second system voltage, a control terminal receiving a sensing voltage of the sensing node, and a second terminal providing a sensing output signal.

Abstract: A sensing device includes a first substrate, a first sensing element, a first light-shielding layer, a second light-shielding layer and an insulating layer. The first sensing element is disposed on the first substrate. The first light-shielding layer is disposed on the first sensing element and has a first opening, wherein the first opening is completely overlapped with the first sensing element. The second light-shielding layer is disposed on the first light-shielding layer and includes an upper light-shielding part and a lateral light-shielding part, wherein the upper light-shielding part is overlapped with the first light-shielding layer and has a second opening, and the lateral light-shielding part is separated from the upper light-shielding part. The insulating layer is disposed between the first light-shielding layer and the second light-shielding layer, and the lateral light-shielding part covers a sidewall of the insulating layer.

Abstract: An optical sensing device includes a substrate, sensing elements, a planarization layer, and a light-shielding layer. The sensing elements are located on the substrate. Each sensing element includes a first net-shaped electrode, a second net-shaped electrode, and a sensing layer. The first net-shaped electrode is located between the sensing layer and the substrate. The sensing layer is located between the first net-shaped electrode and the second net-shaped electrode. The planarization layer is located on the sensing elements and the substrate and has via holes. The light-shielding layer is located on the planarization layer and includes net-shaped light-shielding patterns. The net-shaped light-shielding patterns are overlapped with the second net-shaped electrodes of the sensing elements, respectively, and the net-shaped light-shielding patterns are electrically connected to the second net-shaped electrodes of the sensing elements via the via holes, respectively.

Abstract: A light-sensing device comprises a substrate, multiple first working light-sensing elements, multiple second working light-sensing elements, multiple third working light-sensing elements, multiple first reference light-sensing elements, multiple second reference light-sensing elements, multiple third reference light-sensing elements, a first processing element, and a second processing element. The substrate has a first working area, a second working area, a third working area, a first reference area, a second reference area, and a third reference area. The multiple first working light-sensing elements, the multiple second working light-sensing elements, and the multiple third working light-sensing elements are respectively disposed in the first working area, the second working area, and the third working area.

Abstract: A sensing device includes a first substrate, a first sensing element, a first light-shielding layer, a second light-shielding layer and an insulating layer. The first sensing element is disposed on the first substrate. The first light-shielding layer is disposed on the first sensing element and has a first opening, wherein the first opening is completely overlapped with the first sensing element. The second light-shielding layer is disposed on the first light-shielding layer and includes an upper light-shielding part and a lateral light-shielding part, wherein the upper light-shielding part is overlapped with the first light-shielding layer and has a second opening, and the lateral light-shielding part is separated from the upper light-shielding part. The insulating layer is disposed between the first light-shielding layer and the second light-shielding layer, and the lateral light-shielding part covers a sidewall of the insulating layer.

Abstract: A sensing device, including a first substrate, a first sensing element, a light-emitting element, and a light-shielding layer, is provided. The first sensing element is located on the first substrate. The light-emitting element is located on the first sensing element. The light-shielding layer is located between the light-emitting element and the first sensing element, and is electrically connected to the light-emitting element.

Abstract: An optical sensing device includes a substrate, a sensing element layer, a light-shielding layer, and a light absorbing layer. The substrate has a first surface and a second surface opposite to each other. The sensing element layer is disposed on the first surface and includes multiple sensing elements. The light-shielding layer is disposed on the sensing element layer and has multiple openings. An orthogonal projection of the opening on the substrate overlaps an orthogonal projection of the sensing element on the substrate. The light absorbing layer is disposed on the second surface. An electronic apparatus including the optical sensing device is also provided.

Abstract: A fingerprint sensing module includes a first substrate, an active device, a photosensitive element layer, a collimation structure layer, a second substrate, a plurality of micro lenses, and a spacer pattern. The active device is disposed on the first substrate. The photosensitive element layer is disposed on the first substrate and is electrically connected to the active device. The collimation structure layer is disposed on the photosensitive element layer. The second substrate is disposed on the collimation structure layer. The micro lenses are disposed on a surface of the collimation structure layer facing away from the photosensitive element layer, and overlap the photosensitive element layer. The micro lenses are divided into a plurality of microlens groups, and the microlens groups are respectively located in a plurality of sensing pixel areas of the fingerprint sensing module. The spacer pattern extends between the microlens groups.

Abstract: A fingerprint sensing device includes a first substrate, a sensing element layer, a second substrate, a micro-structure layer, and a spacer layer. The sensing element layer is located on the first substrate and includes multiple sensing elements. The second substrate is located on the sensing element layer. The micro-structure layer is located between the second substrate and the sensing element layer, and includes multiple micro-lens structures and multiple dummy structures. Orthogonal projections of the micro-lens structures on the first substrate overlap orthogonal projections of the sensing elements on the first substrate. The spacer layer is located between the second substrate and the sensing element layer, and includes multiple main spacers. Each of the main spacers covers at least one of the dummy structures.

Abstract: An optical sensing device includes a substrate, a sensing element layer, a first planarization layer, and a second planarization layer. The sensing element layer is located on the substrate and includes a plurality of sensing elements. The first planarization layer is located on the sensing element layer and has a first slit. The second planarization layer is located on the first planarization layer and has a second slit. An orthogonal projection of the first slit extending in a direction and located on the substrate is not overlapped with an orthogonal projection of the second slit extending in the same direction and located on the substrate, and the orthogonal projection of the second slit on the substrate has a curved pattern.

Abstract: A biological feature identification device includes a display device and a sensing device. The display device includes multiple pixels arranged along a first direction. The pixels each has a sub-pixel having a display element and a switch element. The sensing device includes multiple sensing units arranged along a second direction. The sensing units each has a sensing element. When the spatial frequency relation is |4*(RE/100)?(1/SU)|>A, the first and second directions are the same, and the biological feature identification device satisfy the criteria: A<|4*(RE/100)?(1/SU)|<B. When the spatial frequency relation is |4*(RE/100)?(1/SU)|?A, the first and second directions form an angle, and the biological feature identification device satisfy the criteria: A<|4*(RE/100)?{1/[SU*Cos(?)]}|<C. RE is the resolution of the display device, SU is the sensing unit size, ? is the angle, 0°<?<90°, B and C>A, and A is not equal to zero.

Abstract: A fingerprint recognition device including a light emitting layer, an image sensing layer and a micro-lens layer is provided. The image sensing layer has a plurality of pixels. The micro-lens layer is disposed between the light emitting layer and the image sensing layer and has a plurality of micro lenses respectively corresponding to the pixels. A distance between the micro-lens layer and the light emitting layer is less than or equal to 800 um and greater than or equal to h1, where h1=(x/2×tan ?), x is the minimum distance between two micro lenses respectively corresponding to different pixels on a plane where the micro-lens layer is disposed, and ? is an FWHM light receiving angle of each of the micro lenses.

Abstract: An optical sensing device includes a substrate, sensing elements, a planarization layer, and a light-shielding layer. The sensing elements are located on the substrate. Each sensing element includes a first net-shaped electrode, a second net-shaped electrode, and a sensing layer. The first net-shaped electrode is located between the sensing layer and the substrate. The sensing layer is located between the first net-shaped electrode and the second net-shaped electrode. The planarization layer is located on the sensing elements and the substrate and has via holes. The light-shielding layer is located on the planarization layer and includes net-shaped light-shielding patterns. The net-shaped light-shielding patterns are overlapped with the second net-shaped electrodes of the sensing elements, respectively, and the net-shaped light-shielding patterns are electrically connected to the second net-shaped electrodes of the sensing elements via the via holes, respectively.

Abstract: An optical sensing device includes a substrate, a sensing element layer, a first planarization layer, and a second planarization layer. The sensing element layer is located on the substrate and includes a plurality of sensing elements. The first planarization layer is located on the sensing element layer and has a first slit. The second planarization layer is located on the first planarization layer and has a second slit. An orthogonal projection of the first slit extending in a direction and located on the substrate is not overlapped with an orthogonal projection of the second slit extending in the same direction and located on the substrate, and the orthogonal projection of the second slit on the substrate has a curved pattern.

Abstract: A photosensitive device includes a first photosensitive unit, a first collimator layer, a first lens, and a first dummy lens. The first photosensitive unit includes a first photosensitive component and a first control circuit. The first control circuit is electrically connected to the first photosensitive component. The first collimator layer is located above the first photosensitive component and has a first pinhole and a first dummy pinhole. The first lens is located above the first collimator layer and overlapping with the first photosensitive component and the first pinhole in a first direction. The first dummy lens is located above the first collimator layer and overlapping with the first dummy pinhole in the first direction.

Abstract: A fingerprint sensing device includes a first substrate, a sensing element layer, a second substrate, a micro-structure layer, and a spacer layer. The sensing element layer is located on the first substrate and includes multiple sensing elements. The second substrate is located on the sensing element layer. The micro-structure layer is located between the second substrate and the sensing element layer, and includes multiple micro-lens structures and multiple dummy structures. Orthogonal projections of the micro-lens structures on the first substrate overlap orthogonal projections of the sensing elements on the first substrate. The spacer layer is located between the second substrate and the sensing element layer, and includes multiple main spacers. Each of the main spacers covers at least one of the dummy structures.