Patents by Inventor Chao-Chien Chiu

Chao-Chien Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11434277
    Abstract: Disclosed herein are methods for high-throughput screening of a virus-specific neutralizing antibody. According to certain embodiments of the present disclosure, the virus is an influenza virus. Also disclosed herein are the antibodies selected by the high-throughput screening method, and the uses thereof in the prophylaxis and/or treatment of viral infection.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: September 6, 2022
    Assignee: ACADEMIA SINICA
    Inventors: An-Suei Yang, Ing-Chien Chen, Yi-Kai Chiu, Chung-Ming Yu, Cheng-Chung Lee, Chao-Ping Tung, Yueh-Liang Tsou, Yi-Jen Huang, Chia-Lung Lin, Hong-Sen Chen, Hwei-Jiung Wang
  • Publication number: 20220182508
    Abstract: A display device includes a first substrate, a red sub-pixel, a green sub-pixel, a blue sub-pixel, a plurality of photosensitive devices, and a second substrate. The red sub-pixel, the green sub-pixel, and the blue sub-pixel are located on a first side of the first substrate. The photosensitive devices are located on the first side of the first substrate. Each of the photosensitive devices overlaps at least one of the red sub-pixel, the green sub-pixel, and the blue sub-pixel. Each of the photosensitive devices includes an active element and a photosensitive element. The active element is located on the first substrate. The photosensitive element is electrically connected to the active element. The second substrate overlaps the first substrate.
    Type: Application
    Filed: November 2, 2021
    Publication date: June 9, 2022
    Applicant: Au Optronics Corporation
    Inventors: Hsun-Chen Chu, Tsu-Chien Tung, Yu-Han Huang, Chia-Bin Hsiao, Chao-Chien Chiu
  • Patent number: 11308307
    Abstract: A fingerprint sensing module including a substrate, a plurality of photosensitive devices, a collimation structure layer, a light-shielding layer, an interposer and a plurality of micro lenses is provided. The photosensitive devices are disposed on the substrate. The collimation structure layer is disposed on the photosensitive devices. The light-shielding layer is disposed on the collimation structure layer and has a surface and a plurality of first openings recessed from the surface. The first openings respectively overlap the photosensitive devices. The interposer is disposed on the collimation structure layer and positioned in a part of the first openings of the light-shielding layer. The micro lenses are disposed on the interposer and respectively overlap the first openings.
    Type: Grant
    Filed: June 27, 2021
    Date of Patent: April 19, 2022
    Assignee: Au Optronics Corporation
    Inventors: Yu-Han Huang, Chao-Chien Chiu, Shih-Hua Lu
  • Publication number: 20220050989
    Abstract: A fingerprint sensing module including a substrate, a plurality of photosensitive devices, a collimation structure layer, a light-shielding layer, an interposer and a plurality of micro lenses is provided. The photosensitive devices are disposed on the substrate. The collimation structure layer is disposed on the photosensitive devices. The light-shielding layer is disposed on the collimation structure layer and has a surface and a plurality of first openings recessed from the surface. The first openings respectively overlap the photosensitive devices. The interposer is disposed on the collimation structure layer and positioned in a part of the first openings of the light-shielding layer. The micro lenses are disposed on the interposer and respectively overlap the first openings.
    Type: Application
    Filed: June 27, 2021
    Publication date: February 17, 2022
    Applicant: Au Optronics Corporation
    Inventors: Yu-Han Huang, Chao-Chien Chiu, Shih-Hua Lu
  • Publication number: 20220050987
    Abstract: A fingerprint sensing module includes a first substrate, an active device, a photosensitive element layer, a collimation structure layer, a second substrate, a plurality of micro lenses, and a spacer pattern. The active device is disposed on the first substrate. The photosensitive element layer is disposed on the first substrate and is electrically connected to the active device. The collimation structure layer is disposed on the photosensitive element layer. The second substrate is disposed on the collimation structure layer. The micro lenses are disposed on a surface of the collimation structure layer facing away from the photosensitive element layer, and overlap the photosensitive element layer. The micro lenses are divided into a plurality of microlens groups, and the microlens groups are respectively located in a plurality of sensing pixel areas of the fingerprint sensing module. The spacer pattern extends between the microlens groups.
    Type: Application
    Filed: June 4, 2021
    Publication date: February 17, 2022
    Applicant: Au Optronics Corporation
    Inventors: Chao-Chien Chiu, Shuo-Hong Wang, Shih-Hua Lu, Hsun-Chen Chu, Yan-Liang Chen
  • Publication number: 20220050992
    Abstract: A biological feature identification device includes a display device and a sensing device. The display device includes multiple pixels arranged along a first direction. The pixels each has a sub-pixel having a display element and a switch element. The sensing device includes multiple sensing units arranged along a second direction. The sensing units each has a sensing element. When the spatial frequency relation is |4*(RE/100)?(1/SU)|>A, the first and second directions are the same, and the biological feature identification device satisfy the criteria: A<|4*(RE/100)?(1/SU)|<B. When the spatial frequency relation is |4*(RE/100)?(1/SU)|?A, the first and second directions form an angle, and the biological feature identification device satisfy the criteria: A<|4*(RE/100)?{1/[SU*Cos(?)]}|<C. RE is the resolution of the display device, SU is the sensing unit size, ? is the angle, 0°<?<90°, B and C>A, and A is not equal to zero.
    Type: Application
    Filed: July 21, 2021
    Publication date: February 17, 2022
    Inventors: Shuo-Hong WANG, Chao-Chien CHIU, Shang-Wei HSIEH
  • Patent number: 11227874
    Abstract: A photosensitive element and a manufacturing method thereof are provided. The manufacturing method of the photosensitive element includes successively depositing a second conductive layer, a photosensitive material layer, and a first top electrode material layer on a substrate; forming a first patterned photoresist layer on the first top electrode material layer; patterning the first top electrode material layer by using the first patterned photoresist layer as a mask to form a first top electrode; removing the first patterned photoresist layer; patterning the photosensitive material layer by using the first top electrode as a mask to form a photosensitive layer; forming an insulation layer having an opening on the first top electrode; and forming a second top electrode on the insulation layer, and the second top electrode is electrically connected to the first top electrode via the opening.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: January 18, 2022
    Assignee: Au Optronics Corporation
    Inventors: Po-Chao Chang, Ruei-Pei Chen, Kuo-Yu Huang, Chao-Chien Chiu
  • Patent number: 11139404
    Abstract: A photosensor includes a substrate, a sensing device, and a light shielding layer. The sensing device is disposed on the substrate and includes a first electrode, a photo-sensing layer, and a second electrode. The first electrode is disposed on the substrate. The photo-sensing layer is disposed on the first electrode. The second electrode is disposed on the photo-sensing layer, and the photo-sensing layer is interposed between the first electrode and the second electrode. The light shielding layer is disposed on the second electrode. Here, the photo-sensing layer has a shielded portion shielded by the light shielding layer and a photo-receiving portion not shielded by the light shielding layer, and an area of the shielded portion is 55% to 99% of an entire area of the photo-sensing layer.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: October 5, 2021
    Assignee: Au Optronics Corporation
    Inventors: Po-Chao Chang, Ruei-Pei Chen, Chao-Chien Chiu
  • Publication number: 20210248350
    Abstract: A real/fake fingerprint recognition device includes a light source, a detector, and a processor. The light source is configured to provide a first color light and a second color light to a fingerprint. The detector is configured to receive a first reflect light corresponding to the first color light, and receive a second reflect light corresponding to the second color light. The processor is configured to establish a first image and a second image according to the first reflect light and the second reflect light respectively, and determine whether the fingerprint is a real fingerprint according to the first image and the second image.
    Type: Application
    Filed: December 9, 2020
    Publication date: August 12, 2021
    Inventors: Po-Chao CHANG, Ruei-Pei CHEN, Chao-Chien CHIU
  • Patent number: 11003036
    Abstract: A pixel array substrate including pixel units is provided. Each of the pixel units includes a thin film transistor, a first insulating layer disposed on the thin film transistor, a common electrode disposed on the first insulating layer, a second insulating layer covering the common electrode, and a pixel electrode disposed on the second insulating layer. The first insulating layer includes a first via. The common electrode includes an opening and connects to the first via. The second insulating layer includes a second via and connects to the opening and the first via. The pixel electrode connects to the thin film transistor through the second via, the opening and the first via. The first via has two first sides opposite to each other and the opening has two third sides opposite to each other are aligned. A fourth side of the opening is not connected to the first via and the second via.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: May 11, 2021
    Assignee: Au Optronics Corporation
    Inventors: Ching-Shun Lin, Chao-Chien Chiu
  • Publication number: 20200292900
    Abstract: A pixel array substrate including pixel units is provided. Each of the pixel units includes a thin film transistor, a first insulating layer disposed on the thin film transistor, a common electrode disposed on the first insulating layer, a second insulating layer covering the common electrode, and a pixel electrode disposed on the second insulating layer. The first insulating layer includes a first via. The common electrode includes an opening and connects to the first via. The second insulating layer includes a second via and connects to the opening and the first via. The pixel electrode connects to the thin film transistor through the second via, the opening and the first via. The first via has two first sides opposite to each other and the opening has two third sides opposite to each other are aligned. A fourth side of the opening is not connected to the first via and the second via.
    Type: Application
    Filed: June 1, 2020
    Publication date: September 17, 2020
    Applicant: Au Optronics Corporation
    Inventors: Ching-Shun Lin, Chao-Chien Chiu
  • Publication number: 20200274004
    Abstract: A photosensor includes a substrate, a sensing device, and a light shielding layer. The sensing device is disposed on the substrate and includes a first electrode, a photo-sensing layer, and a second electrode. The first electrode is disposed on the substrate. The photo-sensing layer is disposed on the first electrode. The second electrode is disposed on the photo-sensing layer, and the photo-sensing layer is interposed between the first electrode and the second electrode. The light shielding layer is disposed on the second electrode. Here, the photo-sensing layer has a shielded portion shielded by the light shielding layer and a photo-receiving portion not shielded by the light shielding layer, and an area of the shielded portion is 55% to 99% of an entire area of the photo-sensing layer.
    Type: Application
    Filed: August 13, 2019
    Publication date: August 27, 2020
    Applicant: Au Optronics Corporation
    Inventors: Po-Chao Chang, Ruei-Pei Chen, Chao-Chien Chiu
  • Patent number: 10718985
    Abstract: A pixel array substrate including pixel units is provided. Each of the pixel units includes a thin film transistor, a first insulating layer disposed on the thin film transistor, a common electrode disposed on the first insulating layer, a second insulating layer covering the common electrode, and a pixel electrode disposed on the second insulating layer. The first insulating layer includes a first via. The common electrode includes an opening and connects to the first via. The second insulating layer includes a second via and connects to the opening and the first via. The pixel electrode connects to the thin film transistor through the second via, the opening and the first via. The first via has two first sides opposite to each other and the opening has two third sides opposite to each other are aligned. A fourth side of the opening is not connected to the first via and the second via.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: July 21, 2020
    Assignee: Au Optronics Corporation
    Inventors: Ching-Shun Lin, Chao-Chien Chiu
  • Publication number: 20190371823
    Abstract: A photosensitive element and a manufacturing method thereof are provided. The manufacturing method of the photosensitive element includes successively depositing a second conductive layer, a photosensitive material layer, and a first top electrode material layer on a substrate; forming a first patterned photoresist layer on the first top electrode material layer; patterning the first top electrode material layer by using the first patterned photoresist layer as a mask to form a first top electrode; removing the first patterned photoresist layer; patterning the photosensitive material layer by using the first top electrode as a mask to form a photosensitive layer; forming an insulation layer having an opening on the first top electrode; and forming a second top electrode on the insulation layer, and the second top electrode is electrically connected to the first top electrode via the opening.
    Type: Application
    Filed: March 21, 2019
    Publication date: December 5, 2019
    Applicant: Au Optronics Corporation
    Inventors: Po-Chao Chang, Ruei-Pei Chen, Kuo-Yu Huang, Chao-Chien Chiu
  • Patent number: 10424603
    Abstract: A display panel having a notch extending inwardly from its edge and including a plurality of first signal lines having a first extending direction, a plurality of second signal lines having a second extending direction different from the first extension direction, a plurality of pixel units, and a plurality of transmission lines is provided. The pixel units are electrically connected to the first signal lines and the second signal lines. The transmission lines are electrically connected to the first signal lines. Part of the transmission lines includes a first sub-transmission line, a second sub-transmission line and a third sub-transmission line electrically connected to each other. The first sub-transmission line is disposed between the adjacent second signal lines. The second sub-transmission line is disposed between the adjacent first signal lines. The third sub-transmission line overlaps another transmission line in the second extending direction.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: September 24, 2019
    Assignee: Au Optronics Corporation
    Inventors: Cheng-Chieh Lee, Chao-Chien Chiu
  • Publication number: 20190252411
    Abstract: A display panel having a notch extending inwardly from its edge and including a plurality of first signal lines having a first extending direction, a plurality of second signal lines having a second extending direction different from the first extension direction, a plurality of pixel units, and a plurality of transmission lines is provided. The pixel units are electrically connected to the first signal lines and the second signal lines. The transmission lines are electrically connected to the first signal lines. Part of the transmission lines includes a first sub-transmission line, a second sub-transmission line and a third sub-transmission line electrically connected to each other. The first sub-transmission line is disposed between the adjacent second signal lines. The second sub-transmission line is disposed between the adjacent first signal lines. The third sub-transmission line overlaps another transmission line in the second extending direction.
    Type: Application
    Filed: June 15, 2018
    Publication date: August 15, 2019
    Applicant: Au Optronics Corporation
    Inventors: Cheng-Chieh Lee, Chao-Chien Chiu
  • Publication number: 20190179207
    Abstract: A pixel array substrate including pixel units is provided. Each of the pixel units includes a thin film transistor, a first insulating layer disposed on the thin film transistor, a common electrode disposed on the first insulating layer, a second insulating layer covering the common electrode, and a pixel electrode disposed on the second insulating layer. The first insulating layer includes a first via. The common electrode includes an opening and connects to the first via. The second insulating layer includes a second via and connects to the opening and the first via. The pixel electrode connects to the thin film transistor through the second via, the opening and the first via. The first via has two first sides opposite to each other and the opening has two third sides opposite to each other are aligned. A fourth side of the opening is not connected to the first via and the second via.
    Type: Application
    Filed: November 19, 2018
    Publication date: June 13, 2019
    Applicant: Au Optronics Corporation
    Inventors: Ching-Shun Lin, Chao-Chien Chiu
  • Patent number: 9252167
    Abstract: An active device array substrate includes a flexible substrate, a gate electrode, a dielectric layer, a channel layer, a source electrode, a drain electrode, and a pixel electrode. The flexible substrate has a transistor region and a transparent region adjacent to each other. The gate electrode is disposed on the transistor region. The dielectric layer covers the flexible substrate and the gate electrode. A portion of the dielectric layer disposed on the gate electrode has a first thickness. Another portion of the dielectric layer disposed on the transparent region has a second thickness less than the first thickness. The channel layer is disposed above the gate electrode. The source electrode and the drain electrode are electrically connected to the channel layer. The pixel electrode is disposed on the dielectric layer which is disposed on the transparent region. The pixel electrode is electrically connected to the drain electrode.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: February 2, 2016
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Jia-Hong Ye, Ssu-Hui Lu, Wu-Hsiung Lin, Chao-Chien Chiu, Ming-Hsien Lee, Chia-Tien Peng, Wei-Ming Huang
  • Publication number: 20150028336
    Abstract: An active device array substrate includes a flexible substrate, a gate electrode, a dielectric layer, a channel layer, a source electrode, a drain electrode, and a pixel electrode. The flexible substrate has a transistor region and a transparent region adjacent to each other. The gate electrode is disposed on the transistor region. The dielectric layer covers the flexible substrate and the gate electrode. A portion of the dielectric layer disposed on the gate electrode has a first thickness. Another portion of the dielectric layer disposed on the transparent region has a second thickness less than the first thickness. The channel layer is disposed above the gate electrode. The source electrode and the drain electrode are electrically connected to the channel layer. The pixel electrode is disposed on the dielectric layer which is disposed on the transparent region. The pixel electrode is electrically connected to the drain electrode.
    Type: Application
    Filed: September 15, 2014
    Publication date: January 29, 2015
    Inventors: Jia-Hong YE, Ssu-Hui LU, Wu-Hsiung LIN, Chao-Chien CHIU, Ming-Hsien LEE, Chia-Tien PENG, Wei-Ming HUANG
  • Patent number: 8865532
    Abstract: A method for manufacturing an active device array substrate includes providing a flexible substrate having a transistor region and a transparent region; forming a gate electrode on the transistor region; sequentially forming a dielectric layer and a semiconductor layer to cover the gate electrode and the flexible substrate; removing a part of the semiconductor layer to form a channel layer above the gate electrode and removing a thickness of the dielectric layer disposed on the transparent region, such that a portion of the dielectric layer on the gate electrode has a first thickness, and another portion of the dielectric layer on the transparent region has a second thickness less than the first thickness; respectively forming a source electrode and a drain electrode on opposite sides of the channel layer; and forming a pixel electrode electrically connected to the drain electrode.
    Type: Grant
    Filed: September 25, 2012
    Date of Patent: October 21, 2014
    Assignee: AU Optronics Corporation
    Inventors: Jia-Hong Ye, Ssu-Hui Lu, Wu-Hsiung Lin, Chao-Chien Chiu, Ming-Hsien Lee, Chia-Tien Peng, Wei-Ming Huang