Abstract: An optical sensing device includes a substrate, sensing elements, a planarization layer, and a light-shielding layer. The sensing elements are located on the substrate. Each sensing element includes a first net-shaped electrode, a second net-shaped electrode, and a sensing layer. The first net-shaped electrode is located between the sensing layer and the substrate. The sensing layer is located between the first net-shaped electrode and the second net-shaped electrode. The planarization layer is located on the sensing elements and the substrate and has via holes. The light-shielding layer is located on the planarization layer and includes net-shaped light-shielding patterns. The net-shaped light-shielding patterns are overlapped with the second net-shaped electrodes of the sensing elements, respectively, and the net-shaped light-shielding patterns are electrically connected to the second net-shaped electrodes of the sensing elements via the via holes, respectively.

Abstract: An optical sensing device includes a substrate, a sensing element layer, a light-shielding layer, and a light absorbing layer. The substrate has a first surface and a second surface opposite to each other. The sensing element layer is disposed on the first surface and includes multiple sensing elements. The light-shielding layer is disposed on the sensing element layer and has multiple openings. An orthogonal projection of the opening on the substrate overlaps an orthogonal projection of the sensing element on the substrate. The light absorbing layer is disposed on the second surface. An electronic apparatus including the optical sensing device is also provided.

Abstract: A fingerprint sensing device includes a first substrate, a sensing element layer, a second substrate, a micro-structure layer, and a spacer layer. The sensing element layer is located on the first substrate and includes multiple sensing elements. The second substrate is located on the sensing element layer. The micro-structure layer is located between the second substrate and the sensing element layer, and includes multiple micro-lens structures and multiple dummy structures. Orthogonal projections of the micro-lens structures on the first substrate overlap orthogonal projections of the sensing elements on the first substrate. The spacer layer is located between the second substrate and the sensing element layer, and includes multiple main spacers. Each of the main spacers covers at least one of the dummy structures.

Abstract: A fingerprint recognition device including a light emitting layer, an image sensing layer and a micro-lens layer is provided. The image sensing layer has a plurality of pixels. The micro-lens layer is disposed between the light emitting layer and the image sensing layer and has a plurality of micro lenses respectively corresponding to the pixels. A distance between the micro-lens layer and the light emitting layer is less than or equal to 800 um and greater than or equal to h1, where h1=x/(2×tan ?), x is the minimum distance between two micro lenses respectively corresponding to different pixels on a plane where the micro-lens layer is disposed, and ? is an FWHM light receiving angle of each of the micro lenses.

Abstract: A real/fake fingerprint recognition device includes a light source, a detector, and a processor. The light source is configured to provide a first color light and a second color light to a fingerprint. The detector is configured to receive a first reflect light corresponding to the first color light, and receive a second reflect light corresponding to the second color light. The processor is configured to establish a first image and a second image according to the first reflect light and the second reflect light respectively, and determine whether the fingerprint is a real fingerprint according to the first image and the second image.

Abstract: A display device includes a first substrate, a red sub-pixel, a green sub-pixel, a blue sub-pixel, a plurality of photosensitive devices, and a second substrate. The red sub-pixel, the green sub-pixel, and the blue sub-pixel are located on a first side of the first substrate. The photosensitive devices are located on the first side of the first substrate. Each of the photosensitive devices overlaps at least one of the red sub-pixel, the green sub-pixel, and the blue sub-pixel. Each of the photosensitive devices includes an active element and a photosensitive element. The active element is located on the first substrate. The photosensitive element is electrically connected to the active element. The second substrate overlaps the first substrate.

Abstract: A fingerprint sensing module including a substrate, a plurality of photosensitive devices, a collimation structure layer, a light-shielding layer, an interposer and a plurality of micro lenses is provided. The photosensitive devices are disposed on the substrate. The collimation structure layer is disposed on the photosensitive devices. The light-shielding layer is disposed on the collimation structure layer and has a surface and a plurality of first openings recessed from the surface. The first openings respectively overlap the photosensitive devices. The interposer is disposed on the collimation structure layer and positioned in a part of the first openings of the light-shielding layer. The micro lenses are disposed on the interposer and respectively overlap the first openings.

Abstract: A fingerprint sensing module includes a first substrate, an active device, a photosensitive element layer, a collimation structure layer, a second substrate, a plurality of micro lenses, and a spacer pattern. The active device is disposed on the first substrate. The photosensitive element layer is disposed on the first substrate and is electrically connected to the active device. The collimation structure layer is disposed on the photosensitive element layer. The second substrate is disposed on the collimation structure layer. The micro lenses are disposed on a surface of the collimation structure layer facing away from the photosensitive element layer, and overlap the photosensitive element layer. The micro lenses are divided into a plurality of microlens groups, and the microlens groups are respectively located in a plurality of sensing pixel areas of the fingerprint sensing module. The spacer pattern extends between the microlens groups.

Abstract: A fingerprint sensing module including a substrate, a plurality of photosensitive devices, a collimation structure layer, a light-shielding layer, an interposer and a plurality of micro lenses is provided. The photosensitive devices are disposed on the substrate. The collimation structure layer is disposed on the photosensitive devices. The light-shielding layer is disposed on the collimation structure layer and has a surface and a plurality of first openings recessed from the surface. The first openings respectively overlap the photosensitive devices. The interposer is disposed on the collimation structure layer and positioned in a part of the first openings of the light-shielding layer. The micro lenses are disposed on the interposer and respectively overlap the first openings.

Abstract: A biological feature identification device includes a display device and a sensing device. The display device includes multiple pixels arranged along a first direction. The pixels each has a sub-pixel having a display element and a switch element. The sensing device includes multiple sensing units arranged along a second direction. The sensing units each has a sensing element. When the spatial frequency relation is |4*(RE/100)?(1/SU)|>A, the first and second directions are the same, and the biological feature identification device satisfy the criteria: A<|4*(RE/100)?(1/SU)|<B. When the spatial frequency relation is |4*(RE/100)?(1/SU)|?A, the first and second directions form an angle, and the biological feature identification device satisfy the criteria: A<|4*(RE/100)?{1/[SU*Cos(?)]}|<C. RE is the resolution of the display device, SU is the sensing unit size, ? is the angle, 0°<?<90°, B and C>A, and A is not equal to zero.

Abstract: A photosensitive element and a manufacturing method thereof are provided. The manufacturing method of the photosensitive element includes successively depositing a second conductive layer, a photosensitive material layer, and a first top electrode material layer on a substrate; forming a first patterned photoresist layer on the first top electrode material layer; patterning the first top electrode material layer by using the first patterned photoresist layer as a mask to form a first top electrode; removing the first patterned photoresist layer; patterning the photosensitive material layer by using the first top electrode as a mask to form a photosensitive layer; forming an insulation layer having an opening on the first top electrode; and forming a second top electrode on the insulation layer, and the second top electrode is electrically connected to the first top electrode via the opening.

Abstract: A photosensor includes a substrate, a sensing device, and a light shielding layer. The sensing device is disposed on the substrate and includes a first electrode, a photo-sensing layer, and a second electrode. The first electrode is disposed on the substrate. The photo-sensing layer is disposed on the first electrode. The second electrode is disposed on the photo-sensing layer, and the photo-sensing layer is interposed between the first electrode and the second electrode. The light shielding layer is disposed on the second electrode. Here, the photo-sensing layer has a shielded portion shielded by the light shielding layer and a photo-receiving portion not shielded by the light shielding layer, and an area of the shielded portion is 55% to 99% of an entire area of the photo-sensing layer.

Abstract: A real/fake fingerprint recognition device includes a light source, a detector, and a processor. The light source is configured to provide a first color light and a second color light to a fingerprint. The detector is configured to receive a first reflect light corresponding to the first color light, and receive a second reflect light corresponding to the second color light. The processor is configured to establish a first image and a second image according to the first reflect light and the second reflect light respectively, and determine whether the fingerprint is a real fingerprint according to the first image and the second image.

Abstract: A pixel array substrate including pixel units is provided. Each of the pixel units includes a thin film transistor, a first insulating layer disposed on the thin film transistor, a common electrode disposed on the first insulating layer, a second insulating layer covering the common electrode, and a pixel electrode disposed on the second insulating layer. The first insulating layer includes a first via. The common electrode includes an opening and connects to the first via. The second insulating layer includes a second via and connects to the opening and the first via. The pixel electrode connects to the thin film transistor through the second via, the opening and the first via. The first via has two first sides opposite to each other and the opening has two third sides opposite to each other are aligned. A fourth side of the opening is not connected to the first via and the second via.

Abstract: A pixel array substrate including pixel units is provided. Each of the pixel units includes a thin film transistor, a first insulating layer disposed on the thin film transistor, a common electrode disposed on the first insulating layer, a second insulating layer covering the common electrode, and a pixel electrode disposed on the second insulating layer. The first insulating layer includes a first via. The common electrode includes an opening and connects to the first via. The second insulating layer includes a second via and connects to the opening and the first via. The pixel electrode connects to the thin film transistor through the second via, the opening and the first via. The first via has two first sides opposite to each other and the opening has two third sides opposite to each other are aligned. A fourth side of the opening is not connected to the first via and the second via.

Abstract: A photosensor includes a substrate, a sensing device, and a light shielding layer. The sensing device is disposed on the substrate and includes a first electrode, a photo-sensing layer, and a second electrode. The first electrode is disposed on the substrate. The photo-sensing layer is disposed on the first electrode. The second electrode is disposed on the photo-sensing layer, and the photo-sensing layer is interposed between the first electrode and the second electrode. The light shielding layer is disposed on the second electrode. Here, the photo-sensing layer has a shielded portion shielded by the light shielding layer and a photo-receiving portion not shielded by the light shielding layer, and an area of the shielded portion is 55% to 99% of an entire area of the photo-sensing layer.

Abstract: A pixel array substrate including pixel units is provided. Each of the pixel units includes a thin film transistor, a first insulating layer disposed on the thin film transistor, a common electrode disposed on the first insulating layer, a second insulating layer covering the common electrode, and a pixel electrode disposed on the second insulating layer. The first insulating layer includes a first via. The common electrode includes an opening and connects to the first via. The second insulating layer includes a second via and connects to the opening and the first via. The pixel electrode connects to the thin film transistor through the second via, the opening and the first via. The first via has two first sides opposite to each other and the opening has two third sides opposite to each other are aligned. A fourth side of the opening is not connected to the first via and the second via.

Abstract: A photosensitive element and a manufacturing method thereof are provided. The manufacturing method of the photosensitive element includes successively depositing a second conductive layer, a photosensitive material layer, and a first top electrode material layer on a substrate; forming a first patterned photoresist layer on the first top electrode material layer; patterning the first top electrode material layer by using the first patterned photoresist layer as a mask to form a first top electrode; removing the first patterned photoresist layer; patterning the photosensitive material layer by using the first top electrode as a mask to form a photosensitive layer; forming an insulation layer having an opening on the first top electrode; and forming a second top electrode on the insulation layer, and the second top electrode is electrically connected to the first top electrode via the opening.

Abstract: A display panel having a notch extending inwardly from its edge and including a plurality of first signal lines having a first extending direction, a plurality of second signal lines having a second extending direction different from the first extension direction, a plurality of pixel units, and a plurality of transmission lines is provided. The pixel units are electrically connected to the first signal lines and the second signal lines. The transmission lines are electrically connected to the first signal lines. Part of the transmission lines includes a first sub-transmission line, a second sub-transmission line and a third sub-transmission line electrically connected to each other. The first sub-transmission line is disposed between the adjacent second signal lines. The second sub-transmission line is disposed between the adjacent first signal lines. The third sub-transmission line overlaps another transmission line in the second extending direction.

Abstract: A display panel having a notch extending inwardly from its edge and including a plurality of first signal lines having a first extending direction, a plurality of second signal lines having a second extending direction different from the first extension direction, a plurality of pixel units, and a plurality of transmission lines is provided. The pixel units are electrically connected to the first signal lines and the second signal lines. The transmission lines are electrically connected to the first signal lines. Part of the transmission lines includes a first sub-transmission line, a second sub-transmission line and a third sub-transmission line electrically connected to each other. The first sub-transmission line is disposed between the adjacent second signal lines. The second sub-transmission line is disposed between the adjacent first signal lines. The third sub-transmission line overlaps another transmission line in the second extending direction.