Abstract: Fan modules and motors are disclosed. The fan motor includes a bearing holder having a first bearing holder end and a second bearing holder end. The bearing holder has a first section with a first diameter that is smaller than diameters of the first bearing holder end and the second bearing holder end. The motor further includes a first bearing retained by the bearing holder at the first bearing holder end, and a second bearing retained by the bearing holder at the second bearing holder end. The motor further includes a shaft retained by the first bearing and the second bearing, and a stator surrounding the first section of the bearing holder.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a dielectric body, a plurality of semiconductor bodies separated by the dielectric body, a through via penetrating through the dielectric body, and a wiring structure located in each of the plurality of semiconductor bodies; a plurality of semiconductor chips located side by side on a first surface of the interposer and electrically connected to the wiring structure; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface of the interposer and electrically connected to the plurality of semiconductor chips through the through via.

Abstract: A system having a rack, an input manifold, an output manifold, and a drain manifold is installed. The rack is configured to support a computing device. The input manifold, the output manifold, and the drain manifold are each configured to be fluidly coupled to the housing. When the computing device is in a first position relative to the rack, the input manifold and the output manifold are fluidly coupled to the housing and the drain manifold is disconnected from the housing. When the computing device is in a second position relative to the rack, the input manifold and the output manifold are disconnected from the housing and the drain manifold is fluidly coupled to the housing. When the computing device is in a third position relative to the rack, the input manifold, the output manifold, and the drain manifold are disconnected from the housing.

Abstract: A locking mechanism for a computing device controls movement of a removable module within a computer chassis. The locking mechanism comprises a lock pin, a head, and a spring stopper. The lock pin includes an elongated shaft and a head. The spring stopper is disposed on the elongated shaft. The spring is disposed about the elongated shaft such that the spring extends from the spring stopper toward an end of the elongated shaft. As the lock pin moves along a longitudinal axis of the elongated shaft from a first position to a second position, the spring is configured to compress between the spring stopper and a fixed bracket in the computer chassis. The opposite second end extends through a hole in the removable module, thereby preventing the removable module from being removed from the computer chassis.

Abstract: Systems and methods include a chassis having a slot configured to receive a module with a flap are disclosed. The flap is configured to be in at least a first position and a second position. The system further includes a push rod configured to translate within the slot. The push rod is configured in a first position to allow the flap to move to the first flap position, and in a second position to move the flap into the second flap position. The system further includes a latch configured to translate within the slot and engage the push rod to travel in a first direction with the push rod, from the first push rod position to the second push rod position. The latch is also configured to withdraw the push rod from the second push rod position in a second direction, opposite from the first direction.

Abstract: A system chassis insertable in a rack is disclosed. The system chassis includes a first end panel. The first end panel includes a first base surface, a first component slot, a first plurality of venting apertures, and a first protrusion. The first base surface has a first portion and a second portion. The first component slot is formed on the first portion of the first base surface. The first component slot is configured to receive a first system component. The first plurality of venting apertures is formed on the first portion of the first base surface and surrounding the first component slot. The first protrusion extends from the second portion of the first base surface. The first protrusion includes a second plurality of venting apertures and a second component slot. The second component slot configured to receive a second system component.

Abstract: An immersion liquid cooling tank assembly includes a generally hexagonal tank, a condenser, a manifold system, and at least one top cover. The tank includes a base and a plurality of side walls. The base and the plurality of sidewalls are connected. The condenser includes a plurality of condenser tubes. The manifold system is coupled to the condenser to assist in distributing liquid flow to and from the plurality of condenser tubes. The at least one top cover is located generally opposite to the base.

Abstract: An immersion liquid cooling tank assembly includes a generally elliptical tank, at least one condenser including a plurality of condenser tubes, at least one cooling fan adjacent to the condenser, a manifold system coupled to the at least one condenser to assist in distributing liquid flow to and from the plurality of condenser tubes, and a top cover disposed over the generally elliptical tank. The top cover includes an air baffle.

Abstract: A cooling device for a computing system is disclosed. The device includes a heat sink, a base, and a cover. The heat sink includes a plurality of fins extending from a first section of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves is configured to mate with at least a portion of the plurality of fins of the heat sink. The cover is configured to be coupled to the base and encapsulate the heat sink. The cover further includes two apertures, each aperture configured to be connected to a tube. A width of the plurality of fins of the heat sink is less than a width of the plurality of grooves of the base. A height of the heat sink is less than a height of an interior portion of the cover.

Abstract: A network device comprising a chassis, a plurality of fiber optic adapters, a plurality of arrangements of interior fiber optic cables, and a plurality of stacked cable management trays. The chassis includes a front panel with a plurality of front fiber optic adapter openings. The chassis defines an interior space. The plurality of front fiber optic adapters is disposed in the front fiber optic adapter openings. The plurality of arrangements of interior fiber optic cables is disposed within the interior space. A first end of each interior fiber optic cable is directly connected to a corresponding one of the plurality of front fiber optic adapters. The plurality of stacked cable management trays each support one of the plurality of arrangements of interior fiber optic cables. The plurality of stacked cable management trays is configured to route a second end of each interior fiber optic cable to a corresponding side fiber optic adapter.

Abstract: Disclosed is a method for identifying methicillin-resistant Staphylococcus aureus through detection a mass signal at m/z of 6580-6600 in the MALDI-TOF mass spectrum. Also disclosed is a novel peptide biomarker, which consists of SEQ NO ID:5 and the use thereof for detection and/or identification of methicillin-resistant Staphylococcus aureus.

Abstract: A device for a computing system is disclosed. The device includes a body, a socket, and a connector. The body includes a panel and an internal conduit. The connector extends from the panel. The connector is removably coupled to the socket. The connector includes an outer end and an inner end. The connector also includes a nut that has an exterior surface mating with a corresponding interior surface of the socket, and a tubular inlet. The connector also has a sleeve with an internal bore and an external surface abutting the tubular inlet of the nut. The internal conduit is coupled to the inner end of the connector to circulate cooling liquid through the body. The nut includes an angled portion and the sleeve includes a flared portion for assisting in securing the nut and the sleeve in the internal conduit.

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.

Abstract: A system chassis insertable in a rack is disclosed. The system chassis includes a first end panel. The first end panel includes a first base surface, a first component slot, a first plurality of venting apertures, and a first protrusion. The first base surface has a first portion and a second portion. The first component slot is formed on the first portion of the first base surface. The first component slot is configured to receive a first system component. The first plurality of venting apertures is formed on the first portion of the first base surface and surrounding the first component slot. The first protrusion extends from the second portion of the first base surface. The first protrusion includes a second plurality of venting apertures and a second component slot. The second component slot configured to receive a second system component.

Abstract: A quick-connector comprises a first body portion, a second body portion, and a ball valve. The first body portion defines a first fluid channel. The second body portion defines a second fluid channel. The second body portion is coupled to the first body portion such that the first fluid channel is aligned with the second fluid channel. The first fluid channel and the second fluid channel form a fluid channel extending through the quick-connector. The ball valve is positioned in the fluid channel extending through the quick-connector. Movement of the first body portion and the second body portion relative to each other causes the ball valve to move between a flow position and a sealed position. In the flow position, the ball valve allows fluid to flow through the quick-connector. In the sealed position, the ball valve prevents fluid from flowing through the quick-connector.

Abstract: A system having a rack, an input manifold, an output manifold, and a drain manifold is installed. The rack is configured to support a computing device. The input manifold, the output manifold, and the drain manifold are each configured to be fluidly coupled to the housing. When the computing device is in a first position relative to the rack, the input manifold and the output manifold are fluidly coupled to the housing and the drain manifold is disconnected from the housing. When the computing device is in a second position relative to the rack, the input manifold and the output manifold are disconnected from the housing and the drain manifold is fluidly coupled to the housing. When the computing device is in a third position relative to the rack, the input manifold, the output manifold, and the drain manifold are disconnected from the housing.

Abstract: A lock mechanism within a slot of a computer chassis is disclosed. The lock mechanism includes a gear wheel, a gear rack body, a push rod latch, a push rod body, and a chassis latch. The gear wheel, the gear rack body, the push rod latch, the push rod body, and the chassis latch cooperate to restrict a flap in the slot from opening when the flap is in the closed position, and the chassis latch is engaged with a cutout on the push rod body.

Abstract: A shock absorber apparatus is provided. The shock absorber apparatus includes an elastic device and at least one mounting device connected to the elastic device. Each mounting device includes two securing elements. Each securing element is configured to secure an opposing portion of a structure. Each mounting device can also include two sliders. Each slider can have at least two surfaces, which are interconnected by an inclined surface facing an opposing slider, and a ground surface. The inclined surface can be slidably connected to one of the at least two securing elements. Each slider can be arranged to move in response to an applied force. The ground surface is configured to slidably connect to an inner wall of a box.

Abstract: Disclosed is a method for identifying methicillin-resistant Staphylococcus aureus through detection a mass signal at m/z of 6580-6600 in the MALDI-TOF mass spectrum. Also disclosed is a novel peptide biomarker, which consists of SEQ NO ID:5 and the use thereof for detection and/or identification of methicillin-resistant Staphylococcus aureus.

Abstract: A locking mechanism for securing different expansion cards in a slot of a chassis of a computing device is disclosed. The locking mechanism includes a base and a main body. The base is coupled to the chassis and movable between an open position and a closed position. The main body is coupled to the base and movable between a first orientation and a second orientation. When the base is in the closed position and the main body is in the first orientation, a first mating feature of the main body engages an expansion card having a first form factor inserted into the slot. When the base is in the closed position and the main body is in the second orientation, the second mating feature engages an expansion card having a second form factor inserted into the slot of the chassis.