Abstract: A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.

Abstract: The disclosure relates to a fixing band for a battery module and a battery module. The fixing band comprises a first end portion, a connecting section and a second end portion which are arranged successively in an extending direction of the fixing band. The first end portion includes a body and engaging grooves which are protruded in a thickness direction of the body. The engaging grooves are integral with the body. The second end portion has engaging protrusions which are shaped to match the engaging grooves. The first end portion and the second end portion are laminated in the thickness direction and are engaged with each other by the engaging grooves and the engaging protrusions, so that the fixing band encloses an annular accommodation space.

Abstract: The present disclosure provides a for peptoid compounds that bind selective to cancer stem cells (CSCs), particularly those associated with breast cancer. Conjugates of the peptoids to detactable labels and therapeutic agent are contemplated as are methods of diagnosing and treating breast cancer.

Abstract: The disclosure relates to an end plate and a battery module. The end plate comprises an end plate body, which has an inner surface and an outer surface that are opposed in a thickness direction of the end plate body, the outer surface is engaged with a fixing band for the battery module; and a limiting assembly, which is disposed on the outer surface, the limiting assembly includes a fixed clamping member and a movable clamping member which are spaced apart from each other in a height direction of the end plate body and are used in cooperation with each other. A clamping space is formed between the fixed clamping member and the movable clamping member. The movable clamping member can make room for the fixing band so that the fixing band enters the clamping space by the movable clamping member and is limited within the clamping space.

Abstract: The present invention disclosed a method for improving the adsorption capacity of a fixed bed and its application in organic waste gas treatment field. The steps are: (1) adsorption: organic waste gas is passed through the adsorption column containing the adsorbent to allow the organic waste to be adsorbed; when VOCs concentration at the outlet end of the adsorption column reached a preset value, the adsorption is halted; (2) desorption: adsorbent that has absorbed VOCs was desorbed by water vapor of 110° C. or higher, or hot nitrogen of 150° C. or higher; the desorbed VOCs enter into a condenser and is recovered in liquid state; (3) pre-adsorption of water: spray water inside the adsorption column after the desorption to adjust the water content of the adsorbent to 8-35%, no other treatment is necessary before the next batch of VOCs adsorption.

Abstract: The disclosure relates to a fixing band for a battery module and a battery module. The fixing band comprises a first end portion, a connecting section and a second end portion which are arranged successively in an extending direction of the fixing band. The first end portion includes a body and engaging grooves which are protruded in a thickness direction of the body. The engaging grooves are integral with the body. The second end portion has engaging protrusions which are shaped to match the engaging grooves. The first end portion and the second end portion are laminated in the thickness direction and are engaged with each other by the engaging grooves and the engaging protrusions, so that the fixing band encloses an annular accommodation space.

Abstract: The disclosure relates to an end plate and a battery module. The end plate comprises an end plate body, which has an inner surface and an outer surface that are opposed in a thickness direction of the end plate body, the outer surface is engaged with a fixing band for the battery module; and a limiting assembly, which is disposed on the outer surface, the limiting assembly includes a fixed clamping member and a movable clamping member which are spaced apart from each other in a height direction of the end plate body and are used in cooperation with each other. A clamping space is formed between the fixed clamping member and the movable clamping member. The movable clamping member can make room for the fixing band so that the fixing band enters the clamping space by the movable clamping member and is limited within the clamping space.

Abstract: A semiconductor package includes a plurality of half bridge assemblies each including a metal lead, a first power transistor die attached to a first side of the metal lead, and a second power transistor die disposed under the first power transistor die and attached to a second side of the metal lead opposite the first side. Each metal lead has a notch which exposes one or more bond pads at a side of the second power transistor die attached to the metal lead. The semiconductor package also includes a controller die configured to control the power transistor dies. Each power transistor die, each metal lead and the controller die are embedded in a mold compound. Bond wire connections are provided between the controller die and the one or more bond pads at the side of each second power transistor die exposed by the notch in the corresponding metal lead.

Abstract: Embodiments of the present disclosure provide an improved pool. Embodiments of the present disclosure also provide a method of making an improved pool. The pool can comprise an unitary sidewall joined to a floor portion. The unitary sidewall can be constructed from one piece of material, and can have fewer seams than traditional pools, thereby reducing the likelihood that that pool will rupture and leak. In some embodiments, since the pool has fewer seams than traditional pools, fewer manufacturing steps are required to make the pool. This can increase manufacturing speed and decrease cost.

Abstract: A semiconductor package includes a plurality of half bridge assemblies each including a metal lead, a first power transistor die attached to a first side of the metal lead, and a second power transistor die disposed under the first power transistor die and attached to a second side of the metal lead opposite the first side. Each metal lead has a notch which exposes one or more bond pads at a side of the second power transistor die attached to the metal lead. The semiconductor package also includes a controller die configured to control the power transistor dies. Each power transistor die, each metal lead and the controller die are embedded in a mold compound. Bond wire connections are provided between the controller die and the one or more bond pads at the side of each second power transistor die exposed by the notch in the corresponding metal lead.

Abstract: The present invention disclosed a method for improving the adsorption capacity of a fixed bed and its application in organic waste gas treatment field. The method solved existing problems including high equipment investment cost, low processing capacity, attendant safety risks, etc. The steps are: (1) adsorption: organic waste gas is passed through the adsorption column containing the adsorbent to allow the organic waste to be adsorbed; when VOCs concentration at the outlet end of the adsorption column reached a preset value, the adsorption is halted; (2) desorption: adsorbent that has absorbed VOCs was desorbed by water vapor of 110° C. or higher, or hot nitrogen of 150° C. or higher; the desorbed VOCs enter into a condenser and is recovered in liquid state; (3) pre-adsorption of water: spray water inside the adsorption column after the desorption to adjust the water content of the adsorbent to 8-35%, no other treatment is necessary before the next batch of VOCs adsorption.

Abstract: A method for auto-enabling an information-capturing device includes sensing a motion of a wearer to generate a motion signal by a motion sensing unit of a wearable device, determining whether the motion signal matches a motion template by a processing unit of the wearable device, and sending an enabling signal when determining that the motion signal matches the motion template by a wireless transmitting unit of the wearable device, such that an information-capturing device starts to capture an environmental data upon receiving the enabling signal.

Abstract: A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure encapsulating and electrically insulating the semiconductor chip. Two or more electrical conductors that are each electrically connected to one of the terminals extend to an outer surface of the protective structure. A first surface feature is on an exterior surface of the semiconductor device package. The system further includes a connectable package extender having a second surface feature configured to interlock with the first surface feature when the first surface feature is mated with the second surface feature so as to secure the package extender to the semiconductor device package. An extension portion adjoins and extends away from the exterior surface of the semiconductor device package when the package extender is secured to the semiconductor device package.

Abstract: A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure encapsulating and electrically insulating the semiconductor chip. Two or more electrical conductors that are each electrically connected to one of the terminals extend to an outer surface of the protective structure. A first surface feature is on an exterior surface of the semiconductor device package. The system further includes a connectable package extender having a second surface feature configured to interlock with the first surface feature when the first surface feature is mated with the second surface feature so as to secure the package extender to the semiconductor device package. An extension portion adjoins and extends away from the exterior surface of the semiconductor device package when the package extender is secured to the semiconductor device package.

Abstract: A semiconductor device includes a device carrier, a first semiconductor chip mounted on the device carrier and a second semiconductor chip mounted on the device carrier. Further, the semiconductor device includes a first contact clip bonded to a first electrode of the first semiconductor chip, a second contact clip bonded to a first electrode of the second semiconductor chip and an insulating connector configured to hold the first contact clip and the second contact clip together.

Abstract: Embodiments of the present disclosure provide an improved pool. Embodiments of the present disclosure also provide a method of making an improved pool. The pool can comprise an unitary sidewall joined to a floor portion. The unitary sidewall can be constructed from one piece of material, and can have fewer seams than traditional pools, thereby reducing the likelihood that that pool will rupture and leak. In some embodiments, since the pool has fewer seams than traditional pools, fewer manufacturing steps are required to make the pool. This can increase manufacturing speed and decrease cost.

Abstract: A semiconductor assembly includes a substrate with electrically conductive regions and a semiconductor package. The semiconductor package includes a semiconductor die, first and second terminals, and a mold compound. The die has opposing first and second main surfaces, an edge disposed perpendicular to the first and second main surfaces, a first electrode at the first main surface, and a second electrode at the second main surface. The first terminal is attached to the first electrode. The second terminal is attached to the second electrode. The mold compound encloses at least part of the die and the first and second terminals so that each of the terminals has a side parallel with and facing away from the die that remains at least partly uncovered by the mold compound. The first and second terminals of the semiconductor package are connected to different ones of the electrically conductive regions of the substrate.

Abstract: An electronic module is provided, comprising an electronic chip arranged in the electronic module and comprising an input terminal and an output terminal; a first current path electrically connected to the input terminal; a second current path electrically connected to the output terminal; and an insulation arranged between the first current path and the second current path, wherein the first current path and the second current path extend in the same direction and arranged in close proximity to each other.