Abstract: Embodiments of the present invention provide an improved pool. Embodiments of the present invention also provide a method of making an improved pool. The pool can comprise an integrated sidewall joined to a floor portion. The integrated sidewall can be constructed from one piece of material, and can have fewer seams than traditional pools, thereby reducing the likelihood that that pool will rupture and leak. In some embodiments, since the pool has fewer seams than traditional pools, fewer manufacturing steps are required to make the pool. This can increase manufacturing speed and decrease cost.

Abstract: In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret handler, transporting the plurality of semiconductor components using the main turret to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component in the first set at a first test pad using a tester while transporting a second semiconductor component in the second set to a second test pad and testing the second semiconductor component using the tester while transporting the first semiconductor component out of the first test pad. The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.

Abstract: A semiconductor die package includes first, second and third metal blocks insulated from one another. The first metal block has a thinner inner section, a first thicker outer section at a first end of the thinner inner section and a second thicker outer section at a second end of the thinner inner section opposing the first end. The second metal block has a thicker outer section and a thinner inner section protruding inward from the thicker outer section. The third metal block has a thicker outer section and a thinner inner section protruding inward from the thicker outer section. A semiconductor die has a first terminal attached to the thinner inner section of the first metal block, a second terminal attached to the thinner inner section of the second metal block, and a third terminal attached to the thinner inner section of the third metal block.

Abstract: An interposer for establishing a vertical connection between semiconductor packages includes an electrically insulating substrate having a first main side and a second main side opposite the first main side, a plurality of first electrical conductors at the first main side of the substrate, a plurality of second electrical conductors at the second main side of the substrate, and a programmable connection matrix at one or both main sides of the substrate. The programmable connection matrix includes programmable junctions configured to open or close electrical connections between different ones of the first electrical conductors and different ones of the second electrical conductors upon programming of the junctions.

Abstract: A semiconductor device is provided, wherein the semiconductor device comprises a carrier, wherein the carrier comprises a first portion configured to hold a semiconductor chip; and a second portion configured for mounting the semiconductor device to a support, the second portion further comprising a first feature configured to be connected to the support; and at least one second feature configured to facilitate transfer of heat away from the first portion, wherein the at least one second feature increases a surface area of the second portion.

Abstract: Embodiments of the present invention provide an improved pool. Embodiments of the present invention also provide a method of making an improved pool. The pool can comprise an integrated sidewall joined to a floor portion. The integrated sidewall can be constructed from one piece of material, and can have fewer seams than traditional pools, thereby reducing the likelihood that that pool will rupture and leak. In some embodiments, since the pool has fewer seams than traditional pools, fewer manufacturing steps are required to make the pool. This can increase manufacturing speed and decrease cost.

Abstract: Embodiments of the present invention provide an improved pool. Embodiments of the present invention also provide a method of making an improved pool. The pool can comprise an integrated sidewall joined to a floor portion. The integrated sidewall can be constructed from one piece of material, and can have fewer seams than traditional pools, thereby reducing the likelihood that that pool will rupture and leak. In some embodiments, since the pool has fewer seams than traditional pools, fewer manufacturing steps are required to make the pool. This can increase manufacturing speed and decrease cost.

Abstract: In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret handler, transporting the plurality of semiconductor components using the main turret to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component in the first set at a first test pad using a tester while transporting a second semiconductor component in the second set to a second test pad and testing the second semiconductor component using the tester while transporting the first semiconductor component out of the first test pad. The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.

Abstract: A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure encapsulating and electrically insulating the semiconductor chip. Two or more electrical conductors that are each electrically connected to one of the terminals extend to an outer surface of the protective structure. A first surface feature is on an exterior surface of the semiconductor device package. The system further includes a connectable package extender having a second surface feature configured to interlock with the first surface feature when the first surface feature is mated with the second surface feature so as to secure the package extender to the semiconductor device package. An extension portion adjoins and extends away from the exterior surface of the semiconductor device package when the package extender is secured to the semiconductor device package.

Abstract: An electronic module is provided, comprising an electronic chip arranged in the electronic module and comprising an input terminal and an output terminal; a first current path electrically connected to the input terminal; a second current path electrically connected to the output terminal; and an insulation arranged between the first current path and the second current path, wherein the first current path and the second current path extend in the same direction and arranged in close proximity to each other.

Abstract: This invention relates to the field of resin, particularly to a magnetic, acrylic strongly basic anion exchange microsphere resin and its manufacturing method. Its basic structure is as follow: wherein its matrix contains magnetic grains and A is a group containing quaternary ammonium salts; the manufacturing method is: taking acrylic compounds as the monomer and mixing it with the crosslinking agent and porogenic agent to form an oil phase; evenly mixing the oil phase with magnetic grains and then conducting suspension polymerization; aminating and alkylating the polymerized magnetic grains so as to form the quaternary ammonium salts, namely the magnetic, acrylic strongly basic anion exchange microsphere resin.

Abstract: A semiconductor package includes a semiconductor die having a plurality of terminals, a molding compound encapsulating the semiconductor die, and a pluggable lead dimensioned for insertion into an external receptacle. The pluggable lead protrudes from the molding compound and provides a separate electrical pathway for more than one terminal of the semiconductor die. The separate electrical pathways of the pluggable lead can be provided by electrical conductors isolated from one another by electrical insulator such as molding compound or other insulation material/medium.

Abstract: A semiconductor die package includes first, second and third metal blocks insulated from one another. The first metal block has a thinner inner section, a first thicker outer section at a first end of the thinner inner section and a second thicker outer section at a second end of the thinner inner section opposing the first end. The second metal block has a thicker outer section and a thinner inner section protruding inward from the thicker outer section. The third metal block has a thicker outer section and a thinner inner section protruding inward from the thicker outer section. A semiconductor die has a first terminal attached to the thinner inner section of the first metal block, a second terminal attached to the thinner inner section of the second metal block, and a third terminal attached to the thinner inner section of the third metal block.

Abstract: An interposer for establishing a vertical connection between semiconductor packages includes an electrically insulating substrate having a first main side and a second main side opposite the first main side, a plurality of first electrical conductors at the first main side of the substrate, a plurality of second electrical conductors at the second main side of the substrate, and a programmable connection matrix at one or both main sides of the substrate. The programmable connection matrix includes programmable junctions configured to open or close electrical connections between different ones of the first electrical conductors and different ones of the second electrical conductors upon programming of the junctions.

Abstract: A semiconductor device includes a semiconductor chip including a transistor. A first flexible lead is electrically coupled to a first electrode on a first surface of the semiconductor chip. A second flexible lead is electrically coupled to a second electrode on the first surface of the semiconductor chip. A third flexible lead is electrically coupled to a third electrode on a second surface of the semiconductor chip, the second surface opposite to the first surface.

Abstract: A semiconductor device includes a device carrier, a first semiconductor chip mounted on the device carrier and a second semiconductor chip mounted on the device carrier. Further, the semiconductor device includes a first contact clip bonded to a first electrode of the first semiconductor chip, a second contact clip bonded to a first electrode of the second semiconductor chip and an insulating connector configured to hold the first contact clip and the second contact clip together.

Abstract: A semiconductor device is provided, wherein the semiconductor device comprises a carrier, wherein the carrier comprises a first portion configured to hold a semiconductor chip; and a second portion configured for mounting the semiconductor device to a support, the second portion further comprising a first feature configured to be connected to the support; and at least one second feature configured to facilitate transfer of heat away from the first portion, wherein the at least one second feature increases a surface area of the second portion.

Abstract: A semiconductor package includes a semiconductor die having a plurality of terminals, a molding compound encapsulating the semiconductor die, and a pluggable lead dimensioned for insertion into an external receptacle. The pluggable lead protrudes from the molding compound and provides a separate electrical pathway for more than one terminal of the semiconductor die. The separate electrical pathways of the pluggable lead can be provided by electrical conductors isolated from one another by electrical insulator such as molding compound or other insulation material/medium.

Abstract: A semiconductor assembly includes a substrate with electrically conductive regions and a semiconductor package. The semiconductor package includes a semiconductor die, first and second terminals, and a mold compound. The die has opposing first and second main surfaces, an edge disposed perpendicular to the first and second main surfaces, a first electrode at the first main surface, and a second electrode at the second main surface. The first terminal is attached to the first electrode. The second terminal is attached to the second electrode. The mold compound encloses at least part of the die and the first and second terminals so that each of the terminals has a side parallel with and facing away from the die that remains at least partly uncovered by the mold compound. The first and second terminals of the semiconductor package are connected to different ones of the electrically conductive regions of the substrate.

Abstract: Disclosed is an internal circulation resin ion exchange adsorption reactor with a mechanical stirrer. The upper part ?˜? of the reactor main body is an open cylinder and the lower part ?˜? is a cone-shaped body with a slope of 30°±10°. A bell-jar shaped reaction slot with a turbine water stirrer inside is located in the center of the reactor main body. The reactor main body is equipped with a cylindrical guide plate. A water collection weir, an inclined tube separator and an annular resin collection hopper are located between the shell of the reactor main body and the guide plate. The reactor is equipped with a water inlet pipe and a water outlet pipe. A resin removal pipe is connected with the annular resin collection hopper and a resin desorption slot respectively, and a regenerated resin reflux pipe is connected to the bell-jar shaped reaction slot.