Patents by Inventor Chao-Sen Chang
Chao-Sen Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11800298Abstract: A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.Type: GrantFiled: May 6, 2022Date of Patent: October 24, 2023Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Yueh-Kang Lee, Chao-Sen Chang
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Patent number: 11781901Abstract: A vibration sensor includes a support board, a circuit board housing, a metal housing, a pressure-enhancing member and a sensor. The circuit board housing is located on a surface of the support board, and defines a first hollow chamber together with the support board. The metal housing is located on another surface of the support board, and defines a second hollow chamber together with the support board. The pressure-enhancing member is in one of the first and second hollow chambers. The sensor is in the other one of the first and second hollow chambers. The support board has a first through hole and a second through hole. The first through hole is misaligned with the pressure-enhancing member and the sensor. The second through hole is aligned between the pressure-enhancing member and the sensor. The sensor, support board and diaphragm collectively define a third hollow chamber.Type: GrantFiled: February 3, 2021Date of Patent: October 10, 2023Assignee: MERRY ELECTRONICS CO., LTD.Inventors: Jen-Yi Chen, Chao-Sen Chang, Yung-Hsiang Chang
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Patent number: 11671735Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.Type: GrantFiled: July 31, 2022Date of Patent: June 6, 2023Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
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Patent number: 11619544Abstract: A vibration sensor is designed to have a pressure-enhancing member, a pressure sensing device and first, second, third chambers. An air gap is designed to enable the first chamber to be vented to the third chamber such that the first chamber is combined with the third chamber to obtain a communicable air volume. An adhesive layer is formed between a spacer and a circuit board, and the air gap is formed in an adhesive-absent section between the spacer and the circuit board. When the pressure-enhancing member is moved to squeeze the air in the second chamber, a sensitivity of the pressure sensing device will be greatly improved.Type: GrantFiled: August 3, 2021Date of Patent: April 4, 2023Assignee: MERRY ELECTRONICS CO., LTD.Inventors: Jen-Yi Chen, Chao-Sen Chang, Yueh-Kang Lee
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Patent number: 11561129Abstract: A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.Type: GrantFiled: July 21, 2021Date of Patent: January 24, 2023Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Yueh-Kang Lee, Chao-Sen Chang, Kai-Yu Jiang
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Publication number: 20220408197Abstract: A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.Type: ApplicationFiled: May 6, 2022Publication date: December 22, 2022Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Yueh-Kang Lee, Chao-Sen Chang
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Publication number: 20220404196Abstract: A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.Type: ApplicationFiled: July 21, 2021Publication date: December 22, 2022Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Yueh-Kang Lee, Chao-Sen Chang, Kai-Yu Jiang
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Patent number: 11509984Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.Type: GrantFiled: January 25, 2021Date of Patent: November 22, 2022Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
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Publication number: 20220369012Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.Type: ApplicationFiled: July 31, 2022Publication date: November 17, 2022Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
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Patent number: 11467027Abstract: A vibration sensor is designed to have a pressure-enhancing member, a pressure sensing device and first, second, third chambers. A first through hole is designed to enable the first chamber to be vented to the third chamber such that the first chamber is combined with the third chamber to obtain a communicable air volume. When the pressure-enhancing member is moved to squeeze the air in the second chamber, a sensitivity of the pressure sensing device will be greatly improved.Type: GrantFiled: September 15, 2020Date of Patent: October 11, 2022Assignee: MERRY ELECTRONICS CO., LTD.Inventors: Jen-Yi Chen, Chao-Sen Chang, Yueh-Kang Lee
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Publication number: 20220191605Abstract: A microphone module, including a substrate assembly, two sensing structures, and two housings, is provided. The substrate assembly has at least one through hole and at least one circuit structure electrically connected to at least one pad. The through hole includes two holes formed on opposite sides of the substrate assembly. The sensing structures are disposed on and cover the two holes. The two sensing structures and the through hole collectively form a communicating cavity. A size of the communicating cavity in an axial direction is greater than that in a radial direction. The two housings are respectively disposed on the opposite sides of the substrate assembly and respectively shield the two sensing structures. Each of the housings, the substrate assembly, and the corresponding sensing structure form an inner cavity. The housings each has a sound hole. The inner cavity communicates with the outside through the sound hole.Type: ApplicationFiled: January 25, 2021Publication date: June 16, 2022Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Kai-Yu Jiang, Yung-Hsiang Chang
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Publication number: 20210364346Abstract: A vibration sensor includes a circuit board, a spacer, a pressure sensing device and a housing. The spacer is located on the circuit board. The pressure sensing device is located on the spacer, and the circuit board, the spacer and the pressure sensing device jointly form a first chamber and an air gap. The housing is mounted on the circuit board to defining a third chamber along with the circuit board, wherein the air gap allows the first chamber venting to the third chamber.Type: ApplicationFiled: August 3, 2021Publication date: November 25, 2021Inventors: Jen-Yi CHEN, Chao-Sen CHANG, Yueh-Kang LEE
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Publication number: 20210302227Abstract: A vibration sensor includes a support board, a circuit board housing, a metal housing, a pressure-enhancing member and a sensor. The circuit board housing is located on a surface of the support board, and defines a first hollow chamber together with the support board. The metal housing is located on another surface of the support board, and defines a second hollow chamber together with the support board. The pressure-enhancing member is in one of the first and second hollow chambers. The sensor is in the other one of the first and second hollow chambers. The support board has a first through hole and a second through hole. The first through hole is misaligned with the pressure-enhancing member and the sensor. The second through hole is aligned between the pressure-enhancing member and the sensor. The sensor, support board and diaphragm collectively define a third hollow chamber.Type: ApplicationFiled: February 3, 2021Publication date: September 30, 2021Inventors: Jen-Yi CHEN, Chao-Sen CHANG, Yung-Hsiang CHANG
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Publication number: 20210302225Abstract: A vibration sensor includes a circuit board, a pressure sensing device and a metal housing. The circuit board has a concave recess. The pressure sensing device is located on the circuit board and defines a first chamber along with the concave recess of the circuit board. The pressure sensing device includes a support board, a sensor and a pressure-enhancing member. The pressure-enhancing member includes a diaphragm and a mass. The support board, the sensor and the diaphragm of the pressure-enhancing member collectively define a second chamber. The metal housing is located on the circuit board and defines a third chamber along with the circuit board, wherein the circuit board has a sidewall which defines the concave recess and has a first through hole, and the first through hole allows the first chamber venting to the third chamber.Type: ApplicationFiled: September 15, 2020Publication date: September 30, 2021Inventors: Jen-Yi CHEN, Chao-Sen CHANG, Yueh-Kang LEE
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Patent number: 10972844Abstract: The invention provides an earphone and a set of earphones. The earphone includes a processing circuit and a filtering module. The processing circuit acquires a first speech signal and performs a pre-processing operation on the first speech signal to generate a second speech signal. The filtering module includes high-pass, low-pass, and band-pass filters. The processing circuit is further configured to: receive first, second, and third signals respectively from the high-pass, low-pass, and band-pass filters; perform a noise reduction operation on the second and third signals to generate a fourth signal; and perform a signal synthesis operation on the first and fourth signals to synthesize the first and fourth signals to form an output speech signal.Type: GrantFiled: March 27, 2020Date of Patent: April 6, 2021Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Yen Ta Chiang, Hung-Chi Lin, Chao-Sen Chang
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Patent number: 10972840Abstract: A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.Type: GrantFiled: June 26, 2019Date of Patent: April 6, 2021Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.Inventors: Jen-Yi Chen, Yueh-Kang Lee, Kai-Yu Jiang, Chao-Sen Chang
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Patent number: 10943870Abstract: A microphone package structure includes a substrate, a metal housing, a MEMS microphone component and at least one integrated circuit component. The substrate has a first surface and a second surface that are opposite to each other. The metal housing is located on the first surface such that the substrate and the metal housing collectively define a hollow chamber. The MEMS microphone component is located on the metal housing and within the hollow chamber. The at least one integrated circuit component is located within a region of the second surface on which the metal housing has a vertical projection.Type: GrantFiled: July 29, 2019Date of Patent: March 9, 2021Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.Inventor: Chao-Sen Chang
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Publication number: 20200322731Abstract: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions and a plurality of elastic structures. The elastic structures are concentrically arranged along peripheries of the vibratile portions. The acoustic transducer further has a connecting portion extending from the back plate to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The elastic structures include a first elastic structure and a second elastic structures arranged alongside of the boundary, and a third elastic structure arranged along an outer periphery of the vibrating membrane. The vibratile portions are geometrically different from each other and different in rigidity, and the vibratile portions can vibrate independently to respond to various sound pressure levels.Type: ApplicationFiled: June 23, 2020Publication date: October 8, 2020Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Jen-Yi Chen, Chao-Sen Chang, Yung-Hsiang Chang
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Publication number: 20200266151Abstract: An electronic package structure includes a first printed circuit board, a second printed circuit board and first space columns. The first printed circuit board has a first surface and a through hole. The second printed circuit board has a second surface facing the first surface. Each first space column is interconnected between the first surface and the second surface. An encapsulation layer is filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber. A MEMS microphone component located within the hollow chamber is located on the first surface and aligned with the through hole. A sensing component is located within the hollow chamber.Type: ApplicationFiled: September 9, 2019Publication date: August 20, 2020Inventors: Jen-Yi CHEN, Chao-Sen CHANG, Shen-Hang WEI
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Publication number: 20200267479Abstract: A microphone package structure includes a substrate, a metal housing, a MEMS microphone component and at least one integrated circuit component. The substrate has a first surface and a second surface that are opposite to each other. The metal housing is located on the first surface such that the substrate and the metal housing collectively define a hollow chamber. The MEMS microphone component is located on the metal housing and within the hollow chamber. The at least one integrated circuit component is located within a region of the second surface on which the metal housing has a vertical projection.Type: ApplicationFiled: July 29, 2019Publication date: August 20, 2020Inventor: Chao-Sen CHANG