ELECTRONIC PACKAGE STRUCTURE

Abstract

An electronic package structure includes a first printed circuit board, a second printed circuit board and first space columns. The first printed circuit board has a first surface and a through hole. The second printed circuit board has a second surface facing the first surface. Each first space column is interconnected between the first surface and the second surface. An encapsulation layer is filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber. A MEMS microphone component located within the hollow chamber is located on the first surface and aligned with the through hole. A sensing component is located within the hollow chamber.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to U.S. Provisional Application Ser. No. 62/807,252, filed Feb. 19, 2019, which is herein incorporated by reference in its entirety.

BACKGROUND

Field of Invention

The present disclosure relates to an electrical device package structure, and more particular to a package structure including a microphone component.

Description of Related Art

In the current trend of shrinking the size of the electronic device, various components inside the electronic device is also required to be miniaturized, and the package structure of the microphone component is one of them. How to design a miniaturized electronic package structure and meet the performance requirements of the microphone component is one of the research directions developed by manufacturers.

SUMMARY

The present invention provides an electronic package structure to deal with the needs of the prior art problems.

In one or more embodiments, an electronic package structure includes a first printed circuit board, a second printed circuit board and first space columns. The first printed circuit board has a first surface and a through hole. The second printed circuit board has a second surface facing the first surface. Each first space column is interconnected between the first surface and the second surface. An encapsulation layer is filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber. A MEMS microphone component located within the hollow chamber is located on the first surface and aligned with the through hole. A sensing component is located within the hollow chamber.

In one or more embodiments, the first space columns are electrically-insulated columns.

In one or more embodiments, the electronic package structure further includes at least one electrically-conductive column located within the hollow chamber and interconnected between the first and second printed circuit boards.

In one or more embodiments, the electronic package structure further includes at least one acoustic signal processing component located within the hollow chamber and located on the first surface, wherein the acoustic signal processing component is electrically connected to the second printed circuit board via the electrically-conductive column.

In one or more embodiments, the electrically-conductive column is closer to the acoustic signal processing component than the first space columns.

In one or more embodiments, the electronic package structure further includes at least one second space column within the hollow chamber and interconnected between the first surface and the second surface.

In one or more embodiments, the second space column is not covered by the encapsulation layer.

In one or more embodiments, the electronic package structure further includes at least one integrated circuit component located within the hollow chamber and not covered by the encapsulation layer.

In one or more embodiments, the electronic package structure further includes at least one integrated circuit component located within the hollow chamber and covered by the encapsulation layer.

In one or more embodiments, the electronic package structure further includes at least one integrated circuit component located on the second printed circuit board and covered by the encapsulation layer, and the second printed circuit board has an area greater than that of the first printed circuit board.

In one or more embodiments, the first printed circuit board has a third surface opposite to the first surface, and the encapsulation layer covers the third surface but exposes the through hole.

In one or more embodiments, the sensing component is located on the second surface of the second printed circuit board.

In one or more embodiments, the MEMS microphone component and the sensing component are not covered by the encapsulation layer.

In sum, the electronic package structure disclosed herein utilizes two printed circuit boards and a space column to construct a hollow chamber, and installs a MEMS microphone component and/or a sensing component in the hollow chamber to maintain its operating parameters without being sealed by an encapsulation layer. The space column or electrically-conductive column can be configured between two printed circuit boards as required such that the miniaturized package structure can simultaneously integrate the MEMS microphone component, the sensing component and/or other integrated circuit components on the two printed circuit boards.

It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:

FIG. 1 illustrates a cross-sectional view of an electronic package structure according to a first embodiment of the present disclosure;

FIG. 2 illustrates a cross-sectional view of an electronic package structure according to a second embodiment of the present disclosure;

FIG. 3 illustrates a cross-sectional view of an electronic package structure according to a third embodiment of the present disclosure;

FIG. 4 illustrates a top view of an electronic package structure with an upper printed circuit board removed according to a fourth embodiment of the present disclosure;

FIG. 5 illustrates a cross-sectional view of an electronic package structure according to a fifth embodiment of the present disclosure; and

FIG. 6 illustrates a cross-sectional view of an electronic package structure according to a sixth embodiment of the present disclosure.

DETAILED DESCRIPTION

Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

Reference is made to FIG. 1, which illustrates a cross-sectional view of an electronic package structure according to a first embodiment of the present disclosure. An electronic package structure 100a includes a printed circuit board 104, a printed circuit board 102, space columns 108a, an encapsulation layer 110, a Micro-Electro-Mechanical System (MEMS) microphone component 106 and a sensing component 112. The printed circuit board 104 has a surface 104a and a through hole 104b. The printed circuit board 102 has a surface 102a facing the surface 104a of the printed circuit board 104. Each space column 108a is interconnected between the surface 102a and the surface 104a. The encapsulation layer 110 is filled between the two printed circuit boards (102, 104) and filled into gaps among the space columns 108a such that a hollow chamber 132 is formed between the printed circuit boards (102, 104) and the space columns 108a. The MEMS microphone component 106 is located within the hollow chamber 132 and secured to the surface 104a and aligned with the through hole 104b. The sensing component 112 can be, for example, an inertial sensor, a pressure sensor, or the like, and secured to the surface 102a within the hollow chamber 132. In this embodiment, the two printed circuit boards (102, 104) are substantially parallel to each other, but are not limited thereto.

In this embodiment, the MEMS microphone component 106 and the sensing component 112 are located within the hollow chamber 132 and thus free from the erosion of outer water and gas without being covered or sealed by the encapsulation layer. The MEMS microphone component 106 is positioned aligned with the through hole 104b. The MEMS microphone component 106 has its operating parameters (such as the operating parameters of its diaphragm 106a) not recalibrated because of not being covered or sealed by the encapsulation layer. Similarly, the sensing component 112 also has its operating parameters (such as the operating parameters for measuring inertial motion) not recalibrated because of not being covered or sealed by the encapsulation layer.

In this embodiment, each space column 108a is an electrically-insulated column that is covered by or embedded within the encapsulation layer 110, but not limited thereto, for example, the space column 108a may be an electrically-conductive column.

In this embodiment, a space column 108b may be located within the hollow chamber 132 and not covered by or embedded within the encapsulation layer 110. The space column 108b can be an electrically-insulated column interconnected between the surface 102a and the surface 104a.

In this embodiment, at least one electrically-conductive column 116 may be located within the hollow chamber 132 and electrically connected between the printed circuit boards (102, 104), for example, the electrically-conductive column 116 is interconnected between a conductive route 102b of the printed circuit board 102 and a conductive route 104c of the printed circuit board 104. The electrically-conductive column 116 is closer to the acoustic signal processing component 120 than the space columns 108a such that acoustic signal processing component 120 is connected to the printed circuit board 102 by means of a shorter conductive route, i.e., via the electrically-conductive column 116.

In this embodiment, at least one acoustic signal processing component 120 is located in the hollow chamber 132 and secured to the surface 104a. The acoustic signal processing component 120 is electrically connected to the printed circuit board 102 via the conductive route 104c of the printed circuit board 104 and the electrically-conductive column 116. The acoustic signal processing component 120 is located between the electrically-conductive column 116 and the MEMS microphone component 106, and electrically connected to the MEMS microphone component 106 and the printed circuit board 104 via metal wires.

In this embodiment, another integrated circuit component 114 may be located within the hollow chamber 132 and not covered or sealed by the encapsulation layer 110.

Reference is made to FIG. 2, which illustrates a cross-sectional view of an electronic package structure according to a second embodiment of the present disclosure. The electronic package structure 100b is different from the electronic package structure 100a in that the integrated circuit component 114 is covered or sealed by the encapsulation layer 110 and located between the two printed circuit boards (102, 104).

Reference is made to FIG. 3, which illustrates a cross-sectional view of an electronic package structure according to a third embodiment of the present disclosure. The electronic package structure 100c is different from the electronic package structure 100b in that the printed circuit board 102 has an area greater than that of the printed circuit board 104, and the integrated circuit component 114 is not located between the two printed circuit boards (102, 104), but located on the printed circuit board 102 and covered or sealed by the encapsulation layer 110.

Reference is made to FIG. 4, which illustrates a top view of an electronic package structure with an upper printed circuit board removed according to a fourth embodiment of the present disclosure. The electronic package structure 100d is different from the electronic package structure 100c in that it includes more integrated circuit components (124a, 124b, 124c, 124d) that are not located between the two printed circuit boards (102, 104) but located on the printed circuit board 102 and covered or sealed by the encapsulation layer 110b. The area surrounded by the encapsulation layer 110a is covered by another printed circuit board 104. That is, only the area surrounded by the encapsulation layer 110a is located between the two printed circuit boards (102, 104).

FIG. 5 illustrates a cross-sectional view of an electronic package structure according to a fifth embodiment of the present disclosure. The electronic package structure 100e is different from the electronic package structure 100d in that it includes integrated circuit components packaged in different manners on the printed circuit board 102 and covered by the encapsulation layer 110. For example, an integrated circuit component 130 is flip-chip bonded on the printed circuit board 102, an integrated circuit component 128 is bonded to the printed circuit board 102 by surface-mount technology, and an integrated circuit component 126 is raw chip bonded to the printed circuit board 102 and directly covered by the encapsulation layer 110. In addition, the printed circuit board 104 further include a surface 104d opposite to the surface 104a, and the encapsulation layer 110 covers the surface 104d but exposes the through hole 104b allowing the MEMS microphone component 106 to operate properly.

Reference is made to FIG. 6, which illustrates a cross-sectional view of an electronic package structure according to a sixth embodiment of the present disclosure. The electronic package structure 100f is different from the electronic package structure 100e in that the encapsulation layer 110 only covers integrated circuit components (126, 130) and does not cover the upper surface 104d of the printed circuit board 104.

In sum, the electronic package structure disclosed herein utilizes two printed circuit boards and a space column to construct a hollow chamber, and installs a MEMS microphone component and/or a sensing component in the hollow chamber to maintain its operating parameters without being sealed by an encapsulation layer. The space column or electrically-conductive column can be configured between two printed circuit boards as required such that the miniaturized package structure can simultaneously integrate the MEMS microphone component, the sensing component and/or other integrated circuit components on the two printed circuit boards.

Although the present invention has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims.

Claims

1. An electronic package structure comprising:

a first printed circuit board having a first surface and a through hole;

a second printed circuit board having a second surface facing the first surface;

a plurality of first space columns, each first space column is interconnected between the first surface and the second surface;

an encapsulation layer filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber;

a Micro-Electro-Mechanical System (MEMS) microphone component disposed within the hollow chamber and located on the first surface and aligned with the through hole; and

a sensing component located within the hollow chamber.

2. The electronic package structure of claim 1, wherein the first space columns are electrically-insulated columns.

3. The electronic package structure of claim 1 further comprising at least one electrically-conductive column disposed within the hollow chamber and interconnected between the first and second printed circuit boards.

4. The electronic package structure of claim 3 further comprising at least one acoustic signal processing component disposed within the hollow chamber and located on the first surface, wherein the acoustic signal processing component is electrically connected to the second printed circuit board via the electrically-conductive column.

5. The electronic package structure of claim 4, wherein the electrically-conductive column is closer to the acoustic signal processing component than the first space columns.

6. The electronic package structure of claim 1 further comprising at least one second space column within the hollow chamber and interconnected between the first surface and the second surface.

7. The electronic package structure of claim 6, wherein the second space column is not covered by the encapsulation layer.

8. The electronic package structure of claim 1 further comprising at least one integrated circuit component disposed within the hollow chamber and not covered by the encapsulation layer.

9. The electronic package structure of claim 1 further comprising at least one integrated circuit component disposed within the hollow chamber and covered by the encapsulation layer.

10. The electronic package structure of claim 1 further comprising at least one integrated circuit component disposed on the second printed circuit board and covered by the encapsulation layer, and the second printed circuit board has an area greater than that of the first printed circuit board.

11. The electronic package structure of claim 10, wherein the first printed circuit board has a third surface opposite to the first surface, and the encapsulation layer covers the third surface but exposes the through hole.

12. The electronic package structure of claim 1, wherein the sensing component is located on the second surface of the second printed circuit board.

13. The electronic package structure of claim 1, wherein the MEMS microphone component and the sensing component are not covered by the encapsulation layer.