Abstract: A semiconductor package and the method of forming the same are provided. The semiconductor package may include a substrate, a semiconductor package component having a semiconductor die bonded to the substrate, a lid attached to the substrate, and a first composite metal feature between the semiconductor package component and the lid. The first composite metal feature may include a first metal feature having a first material and a second metal feature having a second material. The first material may be an intermetallic compound. The second material may be different from the first material.

Abstract: A terrestrial UE may receive at least one of a PEI or a paging indication based on a configuration for a search space associated with the at least one of the PEI or the paging indication and transmit a message to a network node via an aircraft-based relay node based on the at least one of the PEI or the paging indication. The relay node may transmit the at least one of the PEI or the paging indication to the terrestrial UE or receive the at least one of the PEI or the paging indication from an NTN device. The relay node may receive the message from the terrestrial UE based on the at least one of the PEI or the paging indication and relay the message to the network node after receiving the message from the terrestrial UE.

Abstract: A pixel driving circuit includes a first transistor, a second transistor, and a first capacitor. The first transistor is configured to receive a data signal and drive a light emitting element based on the data signal. The first transistor includes a first gate terminal, a first source terminal, and a first drain terminal. The second transistor includes a second gate terminal receiving a first bias signal from a first bias source, a second source terminal coupled to the first transistor, and a second drain terminal coupled to the light emitting element. The first capacitor is disposed between the first gate terminal and the second gate terminal. The first transistor and the second transistor are different types of transistors.

Abstract: A package assembly and a manufacturing method thereof are provided. The package assembly includes a photonic integrated circuit component, an electric integrated circuit component, a lens and an optical signal port. The photonic integrated circuit component comprises an optical input/output portion configured to transmit and receive optical signal. The electric integrated circuit component is electrically connected to the photonic integrated circuit component. The lens is disposed on a sidewall of the photonic integrated circuit component. The optical signal port is optically coupled to the optical input/output portion.

Abstract: In an embodiment, a method includes forming a device region along a first substrate; forming an interconnect structure over the device region and the first substrate; forming a metal pillar over the interconnect structure, forming the metal pillar comprising: forming a base layer over the interconnect structure; forming an intermediate layer over the base layer; and forming a capping layer over the intermediate layer; forming a solder region over the capping layer; and performing an etch process to recess sidewalls of the base layer and the capping layer from sidewalls of the intermediate layer and the solder region.

Abstract: Certain aspects of the present disclosure provide techniques for method for wireless communications by a network entity, generally including transmitting, to a user equipment (UE) while the network entity is deployed on an aerial platform, a periodic beam switching configuration and receiving, from the UE, a report with beam measurement results in accordance with the periodic beam switching configuration.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may generate multiple channel state information (CSI) reports that are linked together for coherent joint transmission (CJT) with multiple transmit receive points (TRPs). The UE may transmit the multiple CSI reports that are linked. Numerous other aspects are described.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive, from a base station, an indication that a plurality of physical downlink shared channel (PDSCH) communications are associated for purposes of demodulation reference signal bundling. The UE may determine whether a phase continuity is to be maintained for the plurality of PDSCH communications based at least in part on respective quasi-co-location assumptions for the plurality of PDSCH communications. The UE may process the plurality of PDSCH communications based at least in part on whether the phase continuity is to be maintained Numerous other aspects are provided.

Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive from a network entity, a control message triggering the UE to provide a time-domain aperiodic channel state information (A-CSI) report for indicating time-domain channel state information (CSI) associated with CSI reference signal (CSI-RS) resources within an observation window, where a beginning of the observation window is based on when the control message is received. The UE may perform performing measurements of channel state information reference signals (CSI-RSs) received via the CSI-RS resources that occur within the observation window. The UE may then transmit, to the network entity based on the control message, the time-domain A-CSI report indicating measured time-domain CSI associated with the observation window, where the measured time-domain CSI is based on the measurements.

Abstract: A package structure is provided. The package structure comprises a package substrate, an electronic device, a thermal interface material (TIM), a lid and an insulating encapsulant. The electronic device is disposed on and electrically connected to the package substrate. The TIM is disposed on the electronic device. The lid is disposed on the TIM. The insulating encapsulant is disposed on the package substrate and laterally encapsulates the electronic device and the TIM. A lateral dimension of the TIM is greater than a lateral dimension of the electronic device.

Abstract: Methods, systems, and devices for wireless communications are described. Some wireless communications systems may support emergency messaging using a mobile relay. For example, a first user equipment (UE), may transmit a first emergency message indicating a request for relaying a second emergency message to one or more network entities, the first UE being out-of-coverage of a network entity. The first UE may receive, from a second UE associated with an aircraft, a feedback message in response to the first emergency message and may transmit, to the second UE, a second emergency message based on receiving the feedback message. The second UE may receive the second emergency message and transmit, over an air-to-ground wireless communications network, an indication based on the first emergency message and the second emergency message.

Abstract: The apparatus may be configured to transmit (or receive) CSI including a first CSI part (CSI part 1) having a fixed payload size and a second CSI part (CSI part 2) having a variable payload size indicated in the CSI part 1, at least one of the CSI part 1 or the CSI part 2 indicating one or more TRPs and to transmit (or receive) data in a CJT using the one or more TRPs indicated in the at least one of the CSI part 1 or the CSI part 2.

Abstract: A method for training a contrastive learning model, acquiring an optimization item, and pushing information includes: obtaining sample data including first category information and query information; predicting a correlation between the first category information and the query information using the contrastive learning model; establishing a loss function based on the prediction results, wherein the loss function is configured to characterize accuracy of the prediction results; optimizing the loss function based on a semantic relationship between the first category information and second category information, wherein the first category information and the second category information correspond to different semantic information in a category tree, and the semantic relationship is related to relative positions of the first category information and the second category information within the category tree; and training the contrastive learning model based on the optimized loss function.

Abstract: Methods, systems, and devices for wireless communications are described. Generally, the described techniques provide for a first transmission from a first device to be received at a second device. The second device may determine one or more interference parameters (e.g., a maximum allowable interference power) for receiving the first transmission from the first device, and the second device may transmit an indication of the one or more interference parameters using a full-duplex operation (e.g., using resources overlapping with resources used to receive the first transmission). The third device may receive the indication of the one or more interference parameters and determine transmission parameters (e.g., a maximum transmit power) for communicating with a fourth device based on the one or more interference parameters. The third device may transmit a second transmission to the fourth device based on the transmission parameters.

Abstract: Certain aspects of the present disclosure provide techniques for port selection for channel state feedback with analog feedforward. A method that may be performed by a user equipment (UE) includes selecting one or more channel state information reference signals (CSI-RS) ports, of a plurality of CSI-RS ports, for the UE to report CSI. The port selection includes selecting any of the plurality of CSI-RS ports for selecting CSI-RS based on a grouping of the plurality of CSI-RS ports. The UE determines a precoding matrix indicator (PMI) formed by a linear combination of the one or more selected CSI-RS ports. The UE computes at least wideband linear combination coefficients for the selected CSI-RS ports. The UE provides the selected one or more CSI-RS ports and the computed wideband linear combination coefficients to a base station (BS) in a CSI report.

Abstract: Methods, systems, and devices for wireless communications are described. Generally, the described techniques provide for a user equipment (UE) receiving, from a base station, one or more random access channel (RACH) configurations. The RACH configurations may allocate resources for a contention-based RACH procedure for accessing a wireless network. Based on the RACH configurations, the UE may determine a set of random access occasions for an association period. From the set of random access occasions, the UE may map one or more indices of a plurality of synchronization signal blocks to one or more random access occasions. Using the one or more random access occasions, the UE may transmit a random access sequence, including one or more repetitions of the random access sequence to the base station to access the wireless network.

Abstract: The present disclosure discloses a power management circuit, a chip and an upgrade method therefor, and a server. In the circuit, one terminal of a micro controller unit is connected to a control board and a processor of the chip, and the other terminal of the micro controller unit is connected to a power management integrated circuit unit, a voltage conversion unit, and a voltage regulator unit. The micro controller unit receives operation instructions sent by the control board and the processor, stores the operation instructions, reads a power-on/off operation instruction in the operation instructions that is sent by the control board, and sends the power-on/off operation instruction to the power management integrated circuit unit to enable the power management integrated circuit unit performs corresponding control on the voltage conversion unit and the voltage regulator unit to complete a power-on/off operation on the processor.

Abstract: A UE may identify a first set of preserved resources of one or more sets of preserved resources. An aircraft-borne device may identify a first set of preserved resources of one or more sets of preserved resources. The first set of preserved resources may be associated with a time domain starting point, a time domain duration, and a frequency domain resource allocation. The UE may transmit, to an aircraft-borne device and the aircraft-borne device may, receive from the UE, over at least part of the first set of preserved resources, a synchronization signal and a first payload message. The first payload message may include a first emergency message and may be transmitted and received via one of a first PUSCH, a first PSSCH, or a PSCCH. The aircraft-borne device may forward, to a base station or another aircraft-borne device, at least the first emergency message.

Abstract: A semiconductor device includes a substrate; at least one trench located at a top surface of the substrate; and a first dielectric layer, a second dielectric layer and a third dielectric layer that are sequentially stacked on an inner wall of each of the at least one trench. A topmost surface of the first dielectric layer is lower than a topmost surface of the second dielectric layer and the top surface of the substrate, to form a first groove between the second dielectric layer and the substrate. An edge corner between the top surface of the substrate and the inner wall of each of the at least one trench is in a shape of a fillet curve. The fillet structure is smooth and round without a sharp corner, reducing point discharge and improving reliability of the shallow trench isolation structure.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.