Patents by Inventor Chao-Wei Li

Chao-Wei Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11403939
    Abstract: A traffic condition prediction system and a traffic condition prediction method are disclosed. The method includes: determining a center of circle in a surveillance image of a target traffic scene; determining a first circle based on the center of circle and a first radius; extracting a plurality of first feature points along the circumference of the first circle according to a first preset sampling frequency; generating a scene feature of the target traffic scene at least based on the first feature points; determining whether the scene feature and a scene feature of another traffic scene are similar; and when determining that they are similar, predicting traffic condition of the target traffic scene through a prediction model used for predicting traffic condition of the other traffic scene. The scene feature of the target traffic scene and that of the other traffic scene are generated in a same way.
    Type: Grant
    Filed: September 12, 2020
    Date of Patent: August 2, 2022
    Assignee: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Yen-Lin Chen, Hsiu-Chih Chen, Chao-Wei Yu, Chieh-Min Chang, Meng-Tsan Li
  • Patent number: 10824034
    Abstract: A display module includes a display panel and an electronically controlled shutter including polarizers, conductive layers, supporting members, and a display medium layer. Each pixel of the display panel has a first edge and a second edge. A shape unit composed of any four supporting members adjacent to one another has a third edge and a fourth edge. An angle between the third edge and the first edge is larger than or equal to 0 degrees. An angle between the fourth edge and the second edge is larger than 0 degrees. Lengths of the first, second, third, and fourth edges are respectively X, Y, X?, and Y?. Any four supporting members adjacent to one another satisfy at least one of Condition 1: X?>X and X??nX; and Condition 2: Y?>Y and Y??nY, wherein n is a positive integer.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: November 3, 2020
    Assignee: Au Optronics Corporation
    Inventors: Chao-Wei Li, Ju-Chin Chen, Syuan-Ling Yang
  • Publication number: 20200201093
    Abstract: The present invention provides a polarizer module and an operation method thereof. The polarizer module includes a bifacial reflective polarizer, a first liquid crystal layer, a second liquid crystal layer, a first polarizer, and a second polarizer. The bifacial reflective polarizer has a first surface and a second surface opposite to each other. The first liquid crystal layer and the second liquid crystal layer are disposed on the first surface and the second surface respectively. The first polarizer and the second polarizer are disposed on the first liquid crystal layer and the second liquid crystal layer respectively.
    Type: Application
    Filed: August 7, 2019
    Publication date: June 25, 2020
    Applicant: Au Optronics Corporation
    Inventors: Syuan-Ling Yang, Guan-Yu Chen, Chao-Wei Li
  • Patent number: 9052418
    Abstract: A light source module optically coupled to an optical fiber which has a light incident surface is provided. The light source module includes a plurality of light sources and a concentrator. The light sources surround an axis, and the axis passes through a center of the light incident surface and is perpendicular to the light incident surface. Each of the light sources is capable of emitting a beam along a transmitting path toward the axis. The concentrator is disposed at the axis and includes a curvy reflective surface located on the transmitting paths for reflecting the beams to the light incident surface of the optical fiber.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: June 9, 2015
    Assignees: Industrial Technology Research Institute, KARL STORZ GmbH&Co.KG
    Inventors: Hsueh-Chih Chang, Hung-Lieh Hu, Chao-Wei Li
  • Publication number: 20150098240
    Abstract: A light source module optically coupled to an optical fiber which has a light incident surface is provided. The light source module includes a plurality of light sources and a concentrator. The light sources surround an axis, and the axis passes through a center of the light incident surface and is perpendicular to the light incident surface. Each of the light sources is capable of emitting a beam along a transmitting path toward the axis. The concentrator is disposed at the axis and includes a curvy reflective surface located on the transmitting paths for reflecting the beams to the light incident surface of the optical fiber.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 9, 2015
    Applicants: KARL STORZ GmbH&Co.KG, Industrial Technology Research Institute
    Inventors: Hsueh-Chih Chang, Hung-Lieh Hu, Chao-Wei Li
  • Patent number: 8979313
    Abstract: A semiconductor light source device is provided. The semiconductor light source device includes a light guide, at least one semiconductor light source set and at least one light transformation coupler. The light transformation coupler is disposed between the semiconductor light source set and the light guide for guiding the light emitted from the semiconductor light source set to the light guide. The light transformation coupler has an inclined surface and a curved surface. The inclined surface is a multi-level inclined surface with several slopes.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: March 17, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Hsing Lee, Hung-Lieh Hu, Ya-Hui Chiang, Chao-Wei Li, Chen-Kun Chen
  • Patent number: 8926130
    Abstract: An illumination device including a base, a heat dissipation member, at least one flexible printed circuit board (FPC), and a plurality of light-emitting elements is provided. The heat dissipation member disposed on the base has a central axis, a plurality of holding curvy surfaces and a plurality of heat dissipation channels extending along the central axis, wherein the holding curvy surfaces and the heat dissipation channels are staggered and arranged about the central axis, and each of the holding curvy surfaces radially extends along the central axis. The flexible printed circuit board is disposed on the holding curvy surfaces. The light-emitting elements are disposed on the flexible printed circuit board. An assembling method of the illumination device is also provided.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: January 6, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Chao-Wei Li, Hung-Lieh Hu, Chun-Chuan Lin, Chen-Peng Hsu, Hsin-Hsiang Lo, Ji-Feng Chen
  • Patent number: 8814418
    Abstract: A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: August 26, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Da Shaw, Ya-Hui Chiang, Hung-Lieh Hu, Hsin-Yun Tsai, Chun-Hsing Lee, Chao-Wei Li
  • Patent number: 8698166
    Abstract: A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: April 15, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Hsueh-Chih Chang, Rong Xuan, Chao-Wei Li, Chih-Hao Hsu
  • Patent number: 8692274
    Abstract: A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: April 8, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chao-Wei Li, Chen-Peng Hsu, Yao-Jun Tsai, Hung-Lieh Hu
  • Publication number: 20130176748
    Abstract: A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.
    Type: Application
    Filed: August 2, 2012
    Publication date: July 11, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: CHENG-DA SHAW, YA-HUI CHIANG, HUNG-LIEH HU, HSIN-YUN TSAI, CHUN-HSING LEE, CHAO-WEI LI
  • Publication number: 20130168714
    Abstract: A light emitting diode package structure is provided, including a substrate, a seal assembly, an optical element, at least one light emitting diode chip, and a packaging material layer. The seal assembly is disposed on the substrate. The optical element is disposed on the seal assembly, and an enclosed space is formed between the optical element, the seal assembly, and the substrate. The light emitting diode chip is disposed on the substrate and located in the enclosed space. The packaging material layer is located in the enclosed space and at least disposed on an upper surface of the light emitting diode chip, wherein the packaging material layer includes a liquid with high viscosity and a plurality of solid particles, and the viscosity of the liquid with high viscosity is more than 3000 mPa┬Ěs.
    Type: Application
    Filed: October 3, 2012
    Publication date: July 4, 2013
    Inventors: Chao-Wei Li, Hung-Lieh Hu
  • Publication number: 20130114243
    Abstract: A ceiling fixture including a first heat dissipation structure, a circuit board and a flexible light source is provided. The first heat dissipation structure has a curved surface, a containing cavity and a plurality of heat dissipation channels. Each heat dissipation channel is connected to the containing cavity and the external environment. The circuit board is disposed in the containing cavity and contacts the first heat dissipation structure. The flexible light source is disposed on the curved surface.
    Type: Application
    Filed: March 2, 2012
    Publication date: May 9, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Mu-Tao Chu, Hung-Lieh Hu, Chao-Wei Li, Hsin-Hsiang Lo, Chen-Kun Chen
  • Publication number: 20130114252
    Abstract: An illumination device including a base, a light bar, and a cover is provided. The base has a cavity. The light bar is disposed at the bottom of the cavity and includes a plurality of dot light sources arranged along a first axial direction. The cover is assembled to the base for correspondingly covering the light bar and has a plurality of openings. The distribution density of the openings increases from a corresponding location of a dot light source towards two opposite ends along the first axial direction. A light source and a light module are also provided. Another illumination device including a base and a plurality of light sources is further provided.
    Type: Application
    Filed: March 2, 2012
    Publication date: May 9, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Hsiang Lo, Chun-Chuan Lin, Kuo-Tung Tiao, Chao-Wei Li, Hung-Lieh Hu, Chen-Kun Chen
  • Publication number: 20130010463
    Abstract: An illumination device including a base, a heat dissipation member, an FPC board and a plurality of light-emitting elements is provided. The heat dissipation member is disposed on the base. The heat dissipation member has a center axis and a curved surface. The center axis passes through the base and the curved surface surrounds the center axis. The FPC board is disposed on the curved surface. The light-emitting elements are disposed on the FPC board.
    Type: Application
    Filed: March 2, 2012
    Publication date: January 10, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chao-Wei Li, Cheng-Da Shaw, Hung-Lieh Hu, Yi-Jen Chan
  • Publication number: 20130010472
    Abstract: An illumination device including a base, a heat dissipation member, at least one flexible printed circuit board (FPC), and a plurality of light-emitting elements is provided. The heat dissipation member disposed on the base has a central axis, a plurality of holding curvy surfaces and a plurality of heat dissipation channels extending along the central axis, wherein the holding curvy surfaces and the heat dissipation channels are staggered and arranged about the central axis, and each of the holding curvy surfaces radially extends along the central axis. The flexible printed circuit board is disposed on the holding curvy surfaces. The light-emitting elements are disposed on the flexible printed circuit board. An assembling method of the illumination device is also provided.
    Type: Application
    Filed: March 2, 2012
    Publication date: January 10, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chao-Wei Li, Hung-Lieh Hu, Chun-Chuan Lin, Chen-Peng Hsu, Hsin-Hsiang Lo, Ji-Feng Chen
  • Patent number: 8349627
    Abstract: The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: January 8, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Yao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
  • Publication number: 20120199862
    Abstract: A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.
    Type: Application
    Filed: April 17, 2012
    Publication date: August 9, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chao-Wei Li, Chen-Peng Hsu, Yao-Jun Tsai, Hung-Lieh Hu
  • Publication number: 20120168801
    Abstract: A light-emitting device package structure includes a carrier, at least one light-emitting device and a magnetic element. The magnetic element aids in enhancing overall luminous output efficiency.
    Type: Application
    Filed: July 10, 2009
    Publication date: July 5, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Rong Xuan, Chao-Wei Li, Hung-Lieh Hu, Mu-Tao Chu, Chih-Hao Hsu, Jenq-Dar Tsay
  • Patent number: D685508
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: July 2, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Chao-Wei Li, Hung-Lieh Hu, Cheng-Da Shaw, Chen-Peng Hsu