Patents by Inventor Chao-Wei Li
Chao-Wei Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8814418Abstract: A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.Type: GrantFiled: August 2, 2012Date of Patent: August 26, 2014Assignee: Industrial Technology Research InstituteInventors: Cheng-Da Shaw, Ya-Hui Chiang, Hung-Lieh Hu, Hsin-Yun Tsai, Chun-Hsing Lee, Chao-Wei Li
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Patent number: 8698166Abstract: A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.Type: GrantFiled: July 16, 2010Date of Patent: April 15, 2014Assignee: Industrial Technology Research InstituteInventors: Hsueh-Chih Chang, Rong Xuan, Chao-Wei Li, Chih-Hao Hsu
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Patent number: 8692274Abstract: A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.Type: GrantFiled: April 17, 2012Date of Patent: April 8, 2014Assignee: Industrial Technology Research InstituteInventors: Chao-Wei Li, Chen-Peng Hsu, Yao-Jun Tsai, Hung-Lieh Hu
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Publication number: 20130176748Abstract: A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.Type: ApplicationFiled: August 2, 2012Publication date: July 11, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: CHENG-DA SHAW, YA-HUI CHIANG, HUNG-LIEH HU, HSIN-YUN TSAI, CHUN-HSING LEE, CHAO-WEI LI
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Publication number: 20130168714Abstract: A light emitting diode package structure is provided, including a substrate, a seal assembly, an optical element, at least one light emitting diode chip, and a packaging material layer. The seal assembly is disposed on the substrate. The optical element is disposed on the seal assembly, and an enclosed space is formed between the optical element, the seal assembly, and the substrate. The light emitting diode chip is disposed on the substrate and located in the enclosed space. The packaging material layer is located in the enclosed space and at least disposed on an upper surface of the light emitting diode chip, wherein the packaging material layer includes a liquid with high viscosity and a plurality of solid particles, and the viscosity of the liquid with high viscosity is more than 3000 mPa·s.Type: ApplicationFiled: October 3, 2012Publication date: July 4, 2013Inventors: Chao-Wei Li, Hung-Lieh Hu
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Publication number: 20130114252Abstract: An illumination device including a base, a light bar, and a cover is provided. The base has a cavity. The light bar is disposed at the bottom of the cavity and includes a plurality of dot light sources arranged along a first axial direction. The cover is assembled to the base for correspondingly covering the light bar and has a plurality of openings. The distribution density of the openings increases from a corresponding location of a dot light source towards two opposite ends along the first axial direction. A light source and a light module are also provided. Another illumination device including a base and a plurality of light sources is further provided.Type: ApplicationFiled: March 2, 2012Publication date: May 9, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsiang Lo, Chun-Chuan Lin, Kuo-Tung Tiao, Chao-Wei Li, Hung-Lieh Hu, Chen-Kun Chen
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Publication number: 20130114243Abstract: A ceiling fixture including a first heat dissipation structure, a circuit board and a flexible light source is provided. The first heat dissipation structure has a curved surface, a containing cavity and a plurality of heat dissipation channels. Each heat dissipation channel is connected to the containing cavity and the external environment. The circuit board is disposed in the containing cavity and contacts the first heat dissipation structure. The flexible light source is disposed on the curved surface.Type: ApplicationFiled: March 2, 2012Publication date: May 9, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Mu-Tao Chu, Hung-Lieh Hu, Chao-Wei Li, Hsin-Hsiang Lo, Chen-Kun Chen
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Publication number: 20130010472Abstract: An illumination device including a base, a heat dissipation member, at least one flexible printed circuit board (FPC), and a plurality of light-emitting elements is provided. The heat dissipation member disposed on the base has a central axis, a plurality of holding curvy surfaces and a plurality of heat dissipation channels extending along the central axis, wherein the holding curvy surfaces and the heat dissipation channels are staggered and arranged about the central axis, and each of the holding curvy surfaces radially extends along the central axis. The flexible printed circuit board is disposed on the holding curvy surfaces. The light-emitting elements are disposed on the flexible printed circuit board. An assembling method of the illumination device is also provided.Type: ApplicationFiled: March 2, 2012Publication date: January 10, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chao-Wei Li, Hung-Lieh Hu, Chun-Chuan Lin, Chen-Peng Hsu, Hsin-Hsiang Lo, Ji-Feng Chen
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Publication number: 20130010463Abstract: An illumination device including a base, a heat dissipation member, an FPC board and a plurality of light-emitting elements is provided. The heat dissipation member is disposed on the base. The heat dissipation member has a center axis and a curved surface. The center axis passes through the base and the curved surface surrounds the center axis. The FPC board is disposed on the curved surface. The light-emitting elements are disposed on the FPC board.Type: ApplicationFiled: March 2, 2012Publication date: January 10, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chao-Wei Li, Cheng-Da Shaw, Hung-Lieh Hu, Yi-Jen Chan
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Patent number: 8349627Abstract: The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.Type: GrantFiled: December 22, 2010Date of Patent: January 8, 2013Assignee: Industrial Technology Research InstituteInventors: Yao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Publication number: 20120199862Abstract: A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.Type: ApplicationFiled: April 17, 2012Publication date: August 9, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chao-Wei Li, Chen-Peng Hsu, Yao-Jun Tsai, Hung-Lieh Hu
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Publication number: 20120168801Abstract: A light-emitting device package structure includes a carrier, at least one light-emitting device and a magnetic element. The magnetic element aids in enhancing overall luminous output efficiency.Type: ApplicationFiled: July 10, 2009Publication date: July 5, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Rong Xuan, Chao-Wei Li, Hung-Lieh Hu, Mu-Tao Chu, Chih-Hao Hsu, Jenq-Dar Tsay
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Patent number: 8178890Abstract: A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.Type: GrantFiled: October 8, 2009Date of Patent: May 15, 2012Assignee: Industrial Technology Research InstituteInventors: Chao-Wei Li, Chien-Peng Hsu, Yao-Jun Tsai, Hung-Lieh Hu
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Publication number: 20120099303Abstract: A correlated color temperature (CCT) modulating method including following steps is provided. A white LED light source is modulated to emit a first white light. At least one LED light source is modulated to emit a second white light, wherein the second white light includes at least one broad-spectrum monochromatic light. The first white light and the second white light are mixed to produce a third white light. The color rendering index (CRI) of the third white light is greater than those of the first white light and the second white light, and the color coordinates of the first white light, the second white light, and the third white light are different from each other. Furthermore, an LED light source module and a package structure thereof are also provided.Type: ApplicationFiled: December 29, 2010Publication date: April 26, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chao-Wei Li, Ai-Lien Chang, Hsiang-Chi Chung, Ji-Feng Chen, Hung-Lieh Hu
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Patent number: 8115218Abstract: A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.Type: GrantFiled: July 13, 2009Date of Patent: February 14, 2012Assignee: Industrial Technology Research InstituteInventors: Yao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Publication number: 20120012868Abstract: A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.Type: ApplicationFiled: July 16, 2010Publication date: January 19, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsueh-Chih Chang, Rong Xuan, Chao-Wei Li, Chih-Hao Hsu
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Publication number: 20110092002Abstract: The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.Type: ApplicationFiled: December 22, 2010Publication date: April 21, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Patent number: 7923746Abstract: The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.Type: GrantFiled: May 26, 2008Date of Patent: April 12, 2011Assignee: Industrial Technology Research InstituteInventors: Yao-Jun Tsai, Chen-Peng Hsu, Chao-Wei Li, Hung-Lieh Hu
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Publication number: 20100213479Abstract: A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.Type: ApplicationFiled: October 8, 2009Publication date: August 26, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chao-Wei Li, Chen-Peng Hsu, Yao-Jun Tsai, Hung-Lieh Hu
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Patent number: D685508Type: GrantFiled: September 4, 2012Date of Patent: July 2, 2013Assignee: Industrial Technology Research InstituteInventors: Chao-Wei Li, Hung-Lieh Hu, Cheng-Da Shaw, Chen-Peng Hsu