Abstract: An active matrix microfluidic platform employs thin film transistor active (“TFT”) matrix liquid crystal display technology to manipulate small samples of fluid for chemical, biochemical, or biological assays without moving parts, for example, using a two-dimensional matrix array of drive electrodes. The active matrix microfluidic platform may employ existing active matrix addressing schemes and/or commercial “off-the-shelf” animation software to program assay protocols. A feedback subsystem may determine an actual location of a fluid in the microfluidic structure, and provides location information to for display, for example, on an active matrix display, and/or to control movement of one or more fluid bodies in the microfluidic structure.

Abstract: This invention discloses a manufacturing method and a device for an air blown chip heat dissipation. This heat dissipation device includes an air stream produce device, a plurality of heat sink fins, a heat dissipation slip and a heat pipe. The heat dissipation slip is often used in conducting the heat from a chip. The heat dissipation slip can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.

Abstract: This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board structure includes a laminated structure. The laminated structure comprises an electric conduction layer and an insulation layer. The electric conduction layer can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element. The insulation layer can be made of thermal conduction material as well, combining a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method.

Abstract: This invention discloses a manufacturing process method and a structure for a heat conduction interface material. This heat conduction interface material is often used as a buffer interface between chips and heat dissipation devices and is conducted the waste heat from the chips. The heat conduction interface material can be combined a plastic material and a bracket structure of carbon element. The corresponding manufacturing process method for this heat conduction interface material comprises a mixed process that is composed of a plastic material and a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity, so as to improve the efficiency of heat conduction. The bracket structure of carbon element can be mixed into the metal and resins.

Abstract: This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.

Abstract: An microfluidic platform employs a two-dimensional matrix array of drive electrodes and at least one ground line on a bottom substrate, eliminating the need for a top plate or cover, to allow easy access to the active surface of the microfluidic platform. The open microfluidic platform may, for example, allow the depositing of samples via an array of pipettes or other automated deliver systems, and/or the use of standard video equipment to focus on the active surface to track positions of fluid bodies. A user may move fluid bodies and perform operations in real time and/or create animation files for later execution using a pointing device and a display device such as a monitor.