Patents by Inventor Chao Yu

Chao Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250148946
    Abstract: Provided is a display drive system, including: a plurality of drive units and a control unit. The plurality of drive units are connected to a lamp panel, and at least one of the plurality of drive units is configured to drive, during a display stage, the lamp panel to emit light. The control unit is connected to the plurality of drive units, and is configured to detect an operating state of the drive units driving the lamp panel to emit light. In response to detecting that a first drive unit is abnormal, the lamp panel is driven, by a second drive unit, to emit light, wherein the first drive unit is at least one of the drive units driving the lamp panel to emit light, and the second drive unit is at least one of the plurality of drive units other than the first drive unit.
    Type: Application
    Filed: January 9, 2025
    Publication date: May 8, 2025
    Inventors: Chao YU, Enhui GUAN, Zhongkui WAN, Xinyi CHENG, Changlin LENG, Xingqun JIANG, Youxiang XIA
  • Publication number: 20250149488
    Abstract: In an embodiment, a method includes forming a device region along a first substrate; forming an interconnect structure over the device region and the first substrate; forming a metal pillar over the interconnect structure, forming the metal pillar comprising: forming a base layer over the interconnect structure; forming an intermediate layer over the base layer; and forming a capping layer over the intermediate layer; forming a solder region over the capping layer; and performing an etch process to recess sidewalls of the base layer and the capping layer from sidewalls of the intermediate layer and the solder region.
    Type: Application
    Filed: February 23, 2024
    Publication date: May 8, 2025
    Inventors: Wei-Yu Chen, Chao-Wei Chiu, Hsin Liang Chen, Hao-Jan Shih, Hao-Jan Pei, Hsiu-Jen Lin
  • Publication number: 20250146590
    Abstract: An integrated air valve structure includes a main body and two air valves. The main body is formed with two air passages not communicated with each other, a plurality of through holes disposed corresponding to the two air passages, and two valve mounting seats. One valve mounting seat is disposed corresponding to one of the through holes, the other valve mounting seat is disposed corresponding to two of the through holes belonging to the two air passages. The two air valves are disposed on the two valve mounting seats, each air valves includes an air plug facing at least one of the through holes, a valve body assembled with one of the two valve mounting seats for the air plug to move therein, and a coil disposed on the valve body for generating magnetic force to change a position of the air plug.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 8, 2025
    Inventors: Tsun-Hsiang WEN, Chia-Yu YU, Peng ZHAO, Yung-Cheng LIU, Chao-Wen HUANG
  • Publication number: 20250147245
    Abstract: A package assembly and a manufacturing method thereof are provided. The package assembly includes a photonic integrated circuit component, an electric integrated circuit component, a lens and an optical signal port. The photonic integrated circuit component comprises an optical input/output portion configured to transmit and receive optical signal. The electric integrated circuit component is electrically connected to the photonic integrated circuit component. The lens is disposed on a sidewall of the photonic integrated circuit component. The optical signal port is optically coupled to the optical input/output portion.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 8, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Chih Lin, Hsuan-Ting Kuo, Cheng-Yu Kuo, Yen-Hung Chen, Chia-Shen Cheng, Chao-Wei Li, Ching-Hua Hsieh, Wen-Chih Chiou
  • Patent number: 12294023
    Abstract: A device includes a fin protruding from a semiconductor substrate; a gate stack over and along a sidewall of the fin; a gate spacer along a sidewall of the gate stack and along the sidewall of the fin; an epitaxial source/drain region in the fin and adjacent the gate spacer; and a corner spacer between the gate stack and the gate spacer, wherein the corner spacer extends along the sidewall of the fin, wherein a first region between the gate stack and the sidewall of the fin is free of the corner spacer, wherein a second region between the gate stack and the gate spacer is free of the corner spacer.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: May 6, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen-Ping Chen, Kuei-Yu Kao, Shih-Yao Lin, Chih-Han Lin, Ming-Ching Chang, Chao-Cheng Chen
  • Publication number: 20250143003
    Abstract: A method for preparing TOPCon battery substrate and double-sided electroplated TOPcon battery prepared therefrom are provided. The method includes: providing a double-sided grooved silicon matrix of a TOPCon battery; carrying out thermal repair treatment on the silicon matrix; respectively carrying out light injection treatment on the front side and the back side of the silicon matrix after thermal repair treatment, thereby the TOPCon battery substrate is obtained. Thermal repair treatment can greatly increase the overall lattice thermal motion of the silicon substrate, and light is injected into the front side and the back side in the directions of two different light incidence surfaces, so that both the front side and the back side can absorb light, thereby repairing the defects at the interface between the amorphous silicon and the silicon wafer and improving the quality of the PN junctions.
    Type: Application
    Filed: December 27, 2024
    Publication date: May 1, 2025
    Applicant: HUANSHENG PHOTOVOLTAIC (JIANGSU) CO., LTD
    Inventors: Yiwu TANG, Suqiang LI, Kewei LI, Tongzhou GUAN, Chao YU, Nan SONG, Peng WANG, Yan WANG
  • Publication number: 20250140770
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a photonic integrated circuit chip and an electronic integrated circuit chip are disposed on opposite sides of an interposer respectively, and the photonic integrated circuit chip and the electronic integrated circuit chip can accomplish signal connection with each other via a plurality of conductive vias in the interposer directly, thereby reducing the power consumption and transmission delay of the signals transmitted between the circuits.
    Type: Application
    Filed: March 27, 2024
    Publication date: May 1, 2025
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Che-Yu LEE, Chi-Ching HO, Chao-Chiang PU, Yi-Min FU, Po-Yuan SU
  • Publication number: 20250141852
    Abstract: This application provides a signal transmission method, apparatus, and system. The method includes: generating an ultra-wideband signal, where the ultra-wideband signal includes a channel impulse response training sequence (CTS) field, and the CTS field is obtained by separately spreading at least one first preamble symbol based on a pseudo-random sequence; and sending the ultra-wideband signal, where the CTS field is used to determine a channel impulse response. This application can effectively improve ranging and positioning efficiency while implementing secure high-precision ranging and positioning.
    Type: Application
    Filed: December 31, 2024
    Publication date: May 1, 2025
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chao Ma, Qian Yu, Shichang Hu
  • Publication number: 20250135901
    Abstract: This application relates to motor control unit technologies, and in particular, to a motor control unit, a powertrain, and a vehicle. The motor control unit includes a three-phase bridge arm, a capacitor module, and a heat dissipation panel group. The capacitor module includes a capacitor housing and a capacitor core package, and the capacitor housing includes a first sub-housing and a second sub-housing. A gap between the first sub-housing and the second sub-housing forms an accommodating cavity in a first direction, and the accommodating cavity is used to accommodate the capacitor core package. The three-phase bridge arm includes a plurality of power modules. The heat dissipation panel group is configured to dissipate heat for the plurality of power modules.
    Type: Application
    Filed: October 29, 2024
    Publication date: May 1, 2025
    Inventors: Kang YU, Weilong ZHANG, Ziyou XU, Yankun XU, Jiasheng GAO, Chao FAN
  • Patent number: 12285776
    Abstract: Provided are a gravure coating device for preparing a large-width ultrathin metal lithium strip and the preparation method, relating to the technical field of preparation of metal lithium materials.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: April 29, 2025
    Assignee: BEIJING WELION NEW ENERGY TECHNOLOGY CO., LTD.
    Inventors: Wenjun Li, Yongwei Li, Baopeng Hou, Zepeng Ding, Danrong Li, Yafei He, Chao Li, Huigen Yu
  • Patent number: 12288812
    Abstract: A cyclic process including an etching process, a passivation process, and a pumping out process is provided to prevent over etching of the sacrificial gate electrode, particularly when near a high-k dielectric feature. The cyclic process solves the problems of failed gate electrode layer at an end of channel region and enlarges filling windows for replacement gate structures, thus improving channel control. Compared to state-of-art solutions, embodiments of the present disclosure also enlarge volume of source/drain regions, thus improving device performance.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: April 29, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kuei-Yu Kao, Shih-Yao Lin, Chen-Ping Chen, Chih-Chung Chiu, Ke-Chia Tseng, Chih-Han Lin, Ming-Ching Chang, Chao-Cheng Chen
  • Publication number: 20250127362
    Abstract: An autonomous mobile robot control method and apparatus, a device and a readable storage medium. An autonomous mobile robot determines a sound source direction according to a voice signal from a user, and determines moving objects around the autonomous mobile robot itself. The autonomous mobile robot determines, from the moving objects, a target object located in the sound source direction, determines a working area according to the target object, and moves to the working area, and executes a task.
    Type: Application
    Filed: August 1, 2022
    Publication date: April 24, 2025
    Inventors: Minquan DING, Zhu RAO, Chao GAO, Xiaolu YANG, Maoyong CHEN, Yang LIU, Xingbao LIN, Pengfei YUE, Haotian YU, Daliang LI
  • Publication number: 20250133532
    Abstract: An initiating device randomly generates a sending time interval at which the initiating device sends ranging signal frames to a responding device such that an attacker cannot determine a rule of sending the ranging signal by the initiating device to the responding device and cannot send an interference signal at a same moment to perform interference and an attack, thereby enhancing information security of electronic devices during interactive communication.
    Type: Application
    Filed: December 26, 2024
    Publication date: April 24, 2025
    Inventors: Qian Yu, Chao Ma, Shichang Hu
  • Publication number: 20250127829
    Abstract: The present disclosure provides a method for preventing and/or repairing ocular cell damage by using a Streptococcus thermophilus iHA318 strain and its metabolites.
    Type: Application
    Filed: October 18, 2024
    Publication date: April 24, 2025
    Inventors: Meei-Yn Lin, Pin-Chao Huang, Pei-Cheng Lin, Yi-Wen Chen, Chin-Hsiu Yu, Shao-Yu Lee, Tsung-Han Lu
  • Patent number: 12281038
    Abstract: Disclosed is a hot-state efficient filling device and method for a root of a flange of a clarification section of a platinum channel, comprising a material conveying structure. A refractory brick channel is provided outside the clarification section of the platinum channel, the clarification section of the platinum channel includes a platinum body and the flange, a cavity region is provided between the flange and the refractory brick channel, one or more filling observation openings are formed on the refractory brick channel corresponding to the cavity region, a transmission end of the flange penetrates through the one or more filling observation openings, the material conveying structure penetrates through the one or more filling observation openings, an input end of the material conveying structure is provided outside the refractory brick channel, and a reserved distance is arranged between the output end of the material conveying structure and the platinum body.
    Type: Grant
    Filed: December 4, 2024
    Date of Patent: April 22, 2025
    Assignee: CAIHONG DISPLAY DEVICES CO., LTD.
    Inventors: Menglong Wang, Wei Yang, Chao Yu
  • Publication number: 20250127012
    Abstract: A display panel, a method for preparing the same and a display apparatus are provided. The display panel includes: a base substrate, and a plurality of light-emitting devices at a side of the base substrate. The light-emitting devices each includes a first electrode. The first electrode includes: a reflection portion, and a cover portion at a side of the reflection portion facing away from the base substrate. The cover portion covers a front face and a side face of the reflection portion at the side of the reflection portion facing away from the base substrate. The cover portion includes: a first structural layer, and a second structural layer disposed between the first structural layer and the reflection portion. The second structural layer is configured to block the reflection portion from contacting the first structural layer.
    Type: Application
    Filed: November 30, 2022
    Publication date: April 17, 2025
    Inventors: Chao YANG, Zhongxiang YU, Zongshun YANG, Ruquan LI, Hongtao YU, Dongdong SU
  • Patent number: 12278188
    Abstract: Vias, along with methods for fabricating vias, are disclosed that exhibit reduced capacitance and resistance. An exemplary interconnect structure includes a first source/drain contact and a second source/drain contact disposed in a dielectric layer. The first source/drain contact physically contacts a first source/drain feature and the second source/drain contact physically contacts a second source/drain feature. A first via having a first via layer configuration, a second via having a second via layer configuration, and a third via having a third via layer configuration are disposed in the dielectric layer. The first via and the second via extend into and physically contact the first source/drain contact and the second source/drain contact, respectively. A first thickness of the first via and a second thickness of the second via are the same. The third via physically contacts a gate structure, which is disposed between the first source/drain contact and the second source/drain contact.
    Type: Grant
    Filed: June 30, 2023
    Date of Patent: April 15, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Che Lin, Po-Yu Huang, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang, Rueijer Lin, Wei-Jung Lin, Chen-Yuan Kao
  • Publication number: 20250115846
    Abstract: The invention provides an automatic stirring device in the field of fluid machinery and bioreactors, focusing on enhancing fluid control efficiency and consistency in biological cultivation processes. It utilizes a flexible channel body or reactor body to facilitate the flow of nutrient solution along specific channels (such as S-shaped flexible channels or S-shaped loop channels), designed to reduce shear forces and achieve iso-level uniform flow. A power system and monitoring and control system are employed to regulate the flow of nutrient solution and monitor cultivation conditions in real-time, thus supporting various bioprocess cultivation requirements.
    Type: Application
    Filed: October 4, 2024
    Publication date: April 10, 2025
    Inventors: Wen Quan WANG, Lei TANG, Xiu WANG, Xin Yu WEI, Yan YAN, Chao ZHANG
  • Publication number: 20250119322
    Abstract: The present disclosure relates to signal transmission methods, apparatuses, and systems. One example method includes sending a narrow band signal to a receive end, where the narrow band signal is used by the receive end to determine initial time-frequency synchronization information, and sending an ultra-wideband signal to the receive end, where the ultra-wideband signal includes a channel impulse response training sequence (CTS) field, the CTS field is used by the receive end to determine a channel impulse response, the CTS field includes at least one CTS symbol, and the CTS symbol includes at least one first preamble symbol or is generated by spreading at least one first preamble symbol.
    Type: Application
    Filed: December 16, 2024
    Publication date: April 10, 2025
    Inventors: Qian YU, Shichang HU, Chao MA
  • Publication number: 20250120167
    Abstract: A semiconductor device includes a plurality of semiconductor layers vertically separated from one another, a gate structure that comprises a lower portion and an upper portion, a gate spacer that extends along a sidewall of the upper portion of the gate structure and has a bottom surface, and an etch stop layer extends between the portion of the bottom surface of the gate spacer and the top surface of the topmost semiconductor layer.
    Type: Application
    Filed: December 16, 2024
    Publication date: April 10, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuei-Yu Kao, Chao-Cheng Chen, Chih-Han Lin, Chen-Ping Chen, Ming-Ching Chang, Shih-Yao Lin, Chih-Chung Chiu