Patents by Inventor Chaodong Xiao

Chaodong Xiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making an electronic component using reworkable underfill encapsulants
    Patent number: 6180187
    Abstract: A method is disclosed for preparing an electronic assembly using a reworkable underfill encapsulant in which the encapsulant is cured in situ from a curable composition comprising one or more mono-functional maleimide compounds, or one or more mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: January 30, 2001
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Bodan Ma, Quinn K. Tong, Chaodong Xiao
  • Adhesive paste for semiconductors
    Patent number: 6165613
    Abstract: This invention is an adhesive paste that consists essentially of a polymeric resin in particulate form and a carrier for the resin. The polymeric resin is present as particles with a particles size of 50 microns or smaller, is insoluble in the carrier at ambient temperature, and is soluble in the carrier at a temperature above ambient temperature. The carrier either reacts with the resin to form a covalent bond, or vaporizes from the adhesive paste, at a temperature above the temperature at which the resin is soluble in the carrier. The paste contains no inorganic fillers, holds its geometry on application, and fuses to a void-free bond.
    Type: Grant
    Filed: March 9, 1999
    Date of Patent: December 26, 2000
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Christine Puglisi, Gregory Krieger, David Shenfield, Richard Kuder, Chaodong Xiao
  • Method of making an electronic component using reworkable underfill encapsulants
    Patent number: 6057381
    Abstract: A method is disclosed for preparing an electronic assembly using a reworkable underfill encapsulant in which the encapsulant is cured in situ from a curable composition comprising one or more mono-functional maleimide compounds, or one or more mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: May 2, 2000
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Bodan Ma, Quinn K. Tong, Chaodong Xiao