Abstract: A computing device receives electronic data generated by a touch-sensitive surface in response to a contact made with the touch-sensitive surface, and a tilt sensor detects a tilt angle of the touch-sensitive surface. The tilt angle is indicative of an angular displacement between a reference plane defined by the touch-sensitive surface in a reference position and a current plane defined by the touch-sensitive surface in a current position. A parameter or other aspect of an automated contact discriminating process is modified based at least in part on the detected tilt angle of the touch-sensitive surface. The contact discriminating process determines whether the contact made with the touch-sensitive surface is intentional or not intentional. In response to determining that the contact is intentional, the electronic data is accepted as valid input for further processing. In response to determining that the contact is not intentional, the electronic data is rejected for further processing.

Abstract: A computing device receives electronic data generated by a touch-sensitive surface in response to a contact made with the touch-sensitive surface, and a tilt sensor detects a tilt angle of the touch-sensitive surface. The tilt angle is indicative of an angular displacement between a reference plane defined by the touch-sensitive surface in a reference position and a current plane defined by the touch-sensitive surface in a current position. A parameter or other aspect of an automated contact discriminating process is modified based at least in part on the detected tilt angle of the touch-sensitive surface. The contact discriminating process determines whether the contact made with the touch-sensitive surface is intentional or not intentional. In response to determining that the contact is intentional, the electronic data is accepted as valid input for further processing. In response to determining that the contact is not intentional, the electronic data is rejected for further processing.

Abstract: An enhanced binder provides flexibility and certainty when selecting a version of a software library to load, and an enhanced loader prevents a library version vulnerable to a security flaw from being loaded. The binder can perform unification, implicit override, and/or redirection. Implicit override searches assembly-specific locations for an implicit_version, and override the previously chosen unification or other version with the implicit_version when the implicit_version is greater. The implicit_version gets updated with the individual assembly, whereas the unification_version gets updated with the framework. Redirection may override the implicit_version. Unlike redirection, an implicit_version does not recite an explicit range and is found outside application configuration files. The implicit_version is specified implicitly by the assembly without an XML declaration.

Abstract: An enhanced binder provides flexibility and certainty when selecting a version of a software library to load, and an enhanced loader prevents a library version vulnerable to a security flaw from being loaded. The binder can perform unification, implicit override, and/or redirection. Implicit override searches assembly-specific locations for an implicit_version, and override the previously chosen unification or other version with the implicit_version when the implicit_version is greater. The implicit_version gets updated with the individual assembly, whereas the unification_version gets updated with the framework. Redirection may override the implicit_version. Unlike redirection, an implicit_version does not recite an explicit range and is found outside application configuration files. The implicit_version is specified implicitly by the assembly without an XML declaration.

Abstract: Embodiments described herein include generating a navigable medical history corresponding to a patient. Reference information related to medical records for the patient is stored in a referenced records database based on a standardized healthcare code in the medical records. The reference information is inserted into the referenced records database by the medical history system. The medical history system generates the navigable medical history associated with the patient based on the reference information.

Abstract: The present invention provides method of manufacture for a printed wiring board. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

Abstract: Embodiments described herein include generating a navigable medical history corresponding to a patient. Reference information related to medical records for the patient is stored in a referenced records database based on a standardized healthcare code in the medical records. The reference information is inserted into the referenced records database by the medical history system. The medical history system generates the navigable medical history associated with the patient based on the reference information.

Abstract: This adaptable humeral implant comprises an anchoring stem (1, 8) and a male insert (6) or a female insert (30, 31) which are able to cooperate with the glenoid cavity or a glenoid implant. It additionally comprises a removable support (5) intended to fit directly or indirectly to the upper end (3) of the anchoring stem (1, 8) and to cooperate with an intermediate neck (7), which is itself provided with means for cooperation with the male or female implant.

Abstract: A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls and a second surface. The first surface is attached to the electrical trace. The dielectric layer substantially covers the one or more sidewalls of the mounting pad and has an uppermost surface that is substantially coplanar with the second surface of the mounting pad.

Abstract: A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls and a second surface. The first surface is attached to the electrical trace. The dielectric layer substantially covers the one or more sidewalls of the mounting pad and has an uppermost surface that is substantially coplanar with the second surface of the mounting pad.

Abstract: An integrated circuit package is processed by electroplating the integrated circuit package. The electroplating is performed without forming plating traces on a conductive surface of a pad side of the integrated circuit package. Pad areas of the integrated circuit package are thus plated with one or more materials. An integrated circuit may be electrically coupled to pad areas on the integrated circuit package. The integrated circuit package can be electroplated by using the one or more current sources coupled to a back plane of the integrated circuit package. The back plane is patterned, wherein the patterning of the back plane occurs after the step of electroplating.

Abstract: This prosthesis for the glenoid cavity of the scapula comprises a seat, intended to be fixed to the glenoid cavity of the patient to be treated by means of anchoring screws, said seat comprising a plate able to receive a male insert, and said seat being able to receive a female insert, said inserts being intended to cooperate with the humeral head of the shoulder joint in question or with a humeral implant fitted in the area of said joint. The outer face of the peripheral rim, with which the seat is provided, is configured as a truncated morse cone able to cooperate with a male insert provided with a bearing surface of complementary shape. The plate of the seat is provided with means intended to cooperate with a female insert in order to ensure that the latter is fixed by clipping into it.

Abstract: This adaptable humeral implant comprises an anchoring stem (1, 8) and a male insert (6) or a female insert (30, 31) which are able to cooperate with the glenoid cavity or a glenoid implant. It additionally comprises a removable support (5) intended to fit directly or indirectly to the upper end (3) of the anchoring stem (1, 8) and to cooperate with an intermediate neck (7), which is itself provided with means for cooperation with the male or female implant.

Abstract: The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

Abstract: An integrated circuit package is processed by electroplating the integrated circuit package. The electroplating is performed without forming plating traces on a conductive surface of a pad side of the integrated circuit package. Pad areas of the integrated circuit package are thus plated with one or more materials. An integrated circuit may be electrically coupled to pad areas on the integrated circuit package. The integrated circuit package can be electroplated by using the one or more current sources coupled to a back plane of the integrated circuit package. The back plane is patterned, wherein the patterning of the back plane occurs after the step of electroplating.

Abstract: The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

Abstract: A method of manufacturing an integrated circuit package such as a BGA package for use with an integrated circuit chip. The integrated circuit package has a substrate formed with a cavity that exposes a lower conductive level in the package so that connections between the integrated circuit chip and the lower conductive level may be formed to reduce the through holes formed in the substrate. As a result, additional signal line interconnections may be included in the substrate circuit package and/or the size of the integrated circuit chip may be decreased. Each of these may be implemented for enhanced electrical performance. The multiple wire bonding tiers in the substrate may also provide greater wire separation that eases wire bonding and subsequent encapsulation processes.

Abstract: The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core with dielectric layers on both sides of the core. The method may include forming electrically connected plating layers on first and second opposing sides of a substrate and electroplating a contact layer over each of the plating layers using the plating layers. The method further includes removing a portion of the plating layers from the first and second opposing sides while leaving the plating layers under the contact layer.

Abstract: An integrated circuit package where the integrated circuit chip is mounted on a conductive slug and electrically coupled to the slug. Besides acting as a heat spreader, the conductive slug may also function as a ground plane. This reduces the need for additional conductive layers and plated through hole connections for forming connections to, for example, ground. As a result, the conductive paths in the internal ground planes are not necessarily cut off by the plated through holes used for interconnecting ground connections thus avoiding some of the electrical performance degradation suffered by prior techniques. In addition, the invention allows more signals to be added and/or the size of the integrated circuit chip to be reduced to enhance electrical performance. It is to be understood that both the foregoing general description and the following detailed description are exemplary, but are not restrictive, of the invention.

Abstract: The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core with dielectric layers on both sides of the core. The method may include forming electrically connected plating layers on first and second opposing sides of a substrate and electroplating a contact layer over each of the plating layers using the plating layers. The method further includes removing a portion of the plating layers from the first and second opposing sides while leaving the plating layers under the contact layer.