Patents by Inventor Charles Cohn

Charles Cohn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6465882
    Abstract: An integrated circuit package such as a BGA package for use with an integrated circuit chip. The integrated circuit package has substrate with a cavity that exposes a lower conductive level in the package so that connections between the integrated circuit chip and the lower conductive level may be formed to reduce the through holes formed in the substrate. As a result, additional signal line interconnections may be included in the substrate circuit package and/or the size of the integrated circuit chip may be decreased. Each of these may be implemented for enhanced electrical performance. The multiple wire bonding tiers in the substrate may also provide greater wire separation that eases wire bonding and subsequent encapsulation processes.
    Type: Grant
    Filed: July 21, 2000
    Date of Patent: October 15, 2002
    Assignee: Agere Systems Guardian Corp.
    Inventors: Charles Cohn, Donald Earl Hawk, Jr.
  • Patent number: 5926696
    Abstract: A pad grid array plastic package includes a laminated plastic body with a centrally located cavity, an IC unit secured within the cavity, and an encapsulating organic polymer, such as epoxy, enclosing the cavity. The laminated body includes a substrate and a structural member on top of the substrate and having a centrally located aperture forming the cavity. The substrate is provided with metal patterns on both planar surfaces thereof, through-plated vias electrically connecting the metal patterns, and a grid array of contact pads on the bottom surface of the substrate, electrically connected to the metal pattern. The structural member provides strength and rigidity to the laminate and is sufficiently thick to enable protection of the IC unit when the cavity is enclosed with the encapsulating polymer. Also disclosed is a method of making the package and a laminate with the cavity, metal patterns and grid pad array for use in assembling the package.
    Type: Grant
    Filed: May 30, 1996
    Date of Patent: July 20, 1999
    Assignee: Lucent Technologies Inc.
    Inventors: George Addis Baxter, Charles Cohn, Theodore Joseph Sattler, Lakshmendra S. Saxena
  • Patent number: 5299090
    Abstract: A housed integrated circuit unit package is provided with a heat sink for removal and dissipation of heat from electronic circuits housed in packages. The heat sink, mounted on an outer surface of the package, includes a plurality of pins secured at one end with a retainer and flared out at the other end into a starburst or bouquet configuration, the pins being in the form of rods selected from solid cylinders and tubes. The bottom of the retainer-bound end is coated with a securing substance, such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing a plurality of elongated rods by retainers placed at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer, and flaring the rods at the other free end of the cut-off rods into a starburst-like configuration.
    Type: Grant
    Filed: June 29, 1993
    Date of Patent: March 29, 1994
    Assignee: AT&T Bell Laboratories
    Inventors: Kevin J. Brady, Charles Cohn
  • Patent number: 5102829
    Abstract: This invention is a simple and effective process of producing a plastic pin grid array package having an encapsulated device and a heat sink forming a unitary component of a main planar body of the package. The process includes fabrication of a laminated planar main body having outer plastic sheets provided with metallizations, a metal sheet of high thermal conductivity, and plastic sheets positioned intermediate the outer plastic sheets and the metal sheet, the metal sheet having clearance holes filled with plugs of the material of the intermediate plastic sheets, a plurality of plated-through holes (PTHs) formed in the main body and terminal pins secured in the PTHs. Some of the PTHs contacting the metal sheet and some passing through the plugs in the clearance holes out of contact with the metal sheet. The device, such as an integrated circuit chip, mounted in a recessed cavity in the main body, is in contact with the metal heat-sink.
    Type: Grant
    Filed: July 22, 1991
    Date of Patent: April 7, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: Charles Cohn
  • Patent number: 4916522
    Abstract: An integrated circuit package uses an encapsulant frame which prevents the encapsulant used to seal the integrated circuit chip from the ambient atmosphere from flowing to unwanted areas and to permit the encapsulant to be deposited with a controllable depth.
    Type: Grant
    Filed: April 21, 1988
    Date of Patent: April 10, 1990
    Assignee: American Telephone and Telegraph Company , AT & T Bell Laboratories
    Inventor: Charles Cohn