Abstract: A method of forming a micro-display includes forming a device that includes forming a partially reflecting layer on a first substrate and forming a plate overlying the partially reflecting layer, and adhering the device to a second substrate.

Abstract: This disclosure relates to lids and methods for forming and using them. One embodiment of these lids enables MEMS protected by the lids to be smaller. Another of these lids enables testing of a group of conjoined, lidded MEMS. Also, processes for forming and using these lids are also disclosed. One of these processes forms lids from a lid precursor residing over an assembly MEMS.

Abstract: A method of bonding two semiconductor substrates to form a printhead includes aligning a top surface of a first substrate with a second substrate, wherein the first substrate has a fluid channel in the top surface, heating the first and second substrates to a first temperature in a partial vacuum, and placing the top surface of the first substrate in contact with the second substrate to form a bond.

Abstract: A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. The method continues with depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via. The method also includes covering the array of MEMS devices and the conductive material with a passivation layer.

Abstract: A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.

Abstract: One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and hermetically sealing the membrane.

Abstract: A first surface is bonded to a second surface. The first surface and the second surface are plasma treated. Only the first surface is wet treated. The first surface and the second surface are joined together to bond the first surface to the second surface.

Abstract: A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.

Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

Abstract: A drop generator includes a substrate, and a mandrel that is disposed on the substrate for shaping the drop generator chamber. The mandrel is covered by the orifice member and thereafter removed.

Abstract: In one embodiment, a method for making a cover for a micro-device package includes forming a layer of silicon on a transparent substrate and selectively removing parts of the silicon layer to form a bonding ring and an alignment target.

Abstract: A MEMS article is made by forming a MEMS device on a first substrate, providing a second substrate, depositing a layer of etchable dielectric material, forming at least one lateral post-bond release-etch port by a damascene process using a sacrificial material, and bonding the two substrates together.

Abstract: A MEMS package includes a first substrate having a bonding surface and a second substrate having a polished bonding surface facing the bonding surface of the first substrate. The MEMS package further includes a polished layer of bonding substrate material deposited onto the bonding surface of the first substrate and fusion bonded to the polished bonding surface of the second substrate.

Abstract: A micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package, the secondary package comprising a seal and a second transparent lid; and an optical material disposed between the first transparent lid and the second transparent lid, where the optical material is a solid or liquid. An alternatively micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package; and a desiccant or getter material disposed inside the secondary package with the modulator package.

Abstract: An economical and easy to manufacture miniaturized fuel cell having fuel chambers formed from a substrate, such as a silicon wafer, to define a plurality of elongate fuel chambers in fluid-communication with each other within the substrate. Elongate electrolytes, anodes and cathodes extend along the fuel chambers to maximize the effective electrolyte surface area, thereby increasing the amount of electrical current generated by the fuel cell. The elongate fuel chambers are preferably patterned within the substrate in a mirror image configuration such that two thin-film substrates my be joined together to define fuel chambers having two elongate electrolyte, anode, and cathode portions extending therealong.

Abstract: This disclosure relates to lids and methods for forming and using them. One embodiment of these lids enables MEMS protected by the lids to be smaller. Another of these lids enables testing of a group of conjoined, lidded MEMS. Also, processes for forming and using these lids are also disclosed. One of these processes forms lids from a lid precursor residing over an assembly MEMS.

Abstract: A method of forming a micro-display includes forming a device that includes forming a partially reflecting layer on a first substrate and forming a plate overlying the partially reflecting layer, and adhering the device to a second substrate.

Abstract: A micro-display has a device chip with a transparent layer overlying one or more micro-electromechanical system devices. A transparent cover overlies the transparent layer. An index-of-refraction-matching medium is interposed between the transparent layer and the transparent cover. An index of refraction of the index-of-refraction-matching medium is substantially equal to an index of refraction of the transparent layer and the transparent cover.

Abstract: A method of delivering fluid can include using electro-wetting effects to pick-up, transport, and/or deliver discrete volumes of fluid. Voltage can be applied across a fluid contact area having a conductive substrate and a dielectric material with an outer surface. The outer surface can have a native interfacial surface tension state and a voltage induced second state having a reduction in interfacial surface tension. A fluid can be contacted such that a volume of fluid adheres to the outer surface of the fluid contact area when the voltage is applied. Subsequently, the voltage can be adjusted such that at least a portion of the volume of fluid is delivered to a receiving location.

Abstract: An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.