Patents by Inventor Charles Haluzak

Charles Haluzak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080068697
    Abstract: A method of forming a micro-display includes forming a device that includes forming a partially reflecting layer on a first substrate and forming a plate overlying the partially reflecting layer, and adhering the device to a second substrate.
    Type: Application
    Filed: November 1, 2007
    Publication date: March 20, 2008
    Inventors: Charles Haluzak, Kenneth Faase, John Sterner, Chien-Hua Chen, Kirby Sand, Bao-Sung Yeh, Michael Regan
  • Publication number: 20080029880
    Abstract: This disclosure relates to lids and methods for forming and using them. One embodiment of these lids enables MEMS protected by the lids to be smaller. Another of these lids enables testing of a group of conjoined, lidded MEMS. Also, processes for forming and using these lids are also disclosed. One of these processes forms lids from a lid precursor residing over an assembly MEMS.
    Type: Application
    Filed: October 10, 2007
    Publication date: February 7, 2008
    Inventors: Chien-Hua Chen, David Craig, Charles Haluzak
  • Publication number: 20070188551
    Abstract: A method of bonding two semiconductor substrates to form a printhead includes aligning a top surface of a first substrate with a second substrate, wherein the first substrate has a fluid channel in the top surface, heating the first and second substrates to a first temperature in a partial vacuum, and placing the top surface of the first substrate in contact with the second substrate to form a bond.
    Type: Application
    Filed: July 27, 2006
    Publication date: August 16, 2007
    Inventors: Chien-Hua Chen, Charles Haluzak
  • Publication number: 20070087462
    Abstract: A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. The method continues with depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via. The method also includes covering the array of MEMS devices and the conductive material with a passivation layer.
    Type: Application
    Filed: October 14, 2005
    Publication date: April 19, 2007
    Inventors: Charles Haluzak, Chien-Hua Chen, David Craig
  • Publication number: 20070042565
    Abstract: A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.
    Type: Application
    Filed: February 8, 2006
    Publication date: February 22, 2007
    Inventors: Mark Smith, William Boucher, Charles Haluzak
  • Publication number: 20070023890
    Abstract: One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and hermetically sealing the membrane.
    Type: Application
    Filed: July 28, 2005
    Publication date: February 1, 2007
    Inventors: Charles Haluzak, John Sterner, Kirby Sand
  • Publication number: 20070023850
    Abstract: A first surface is bonded to a second surface. The first surface and the second surface are plasma treated. Only the first surface is wet treated. The first surface and the second surface are joined together to bond the first surface to the second surface.
    Type: Application
    Filed: July 30, 2005
    Publication date: February 1, 2007
    Inventors: Chien-Hua Chen, Charles Haluzak, Tracy Forrest
  • Publication number: 20070026559
    Abstract: A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
    Type: Application
    Filed: July 29, 2005
    Publication date: February 1, 2007
    Inventors: Charles Haluzak, Arthur Piehl, Chien-Hua Chen, Jennifer Shih
  • Publication number: 20060292748
    Abstract: A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
    Type: Application
    Filed: June 6, 2006
    Publication date: December 28, 2006
    Inventors: Charles Haluzak, Martha Truninger, Donald Michael
  • Publication number: 20060243387
    Abstract: A drop generator includes a substrate, and a mandrel that is disposed on the substrate for shaping the drop generator chamber. The mandrel is covered by the orifice member and thereafter removed.
    Type: Application
    Filed: June 30, 2006
    Publication date: November 2, 2006
    Inventors: Charles Haluzak, Kenneth Trueba, Terry McMahon, Donald Schulte
  • Publication number: 20060237810
    Abstract: In one embodiment, a method for making a cover for a micro-device package includes forming a layer of silicon on a transparent substrate and selectively removing parts of the silicon layer to form a bonding ring and an alignment target.
    Type: Application
    Filed: April 21, 2005
    Publication date: October 26, 2006
    Inventors: Kirby Sand, Charles Haluzak, Chien-Hua Chen
  • Publication number: 20060228869
    Abstract: A MEMS article is made by forming a MEMS device on a first substrate, providing a second substrate, depositing a layer of etchable dielectric material, forming at least one lateral post-bond release-etch port by a damascene process using a sacrificial material, and bonding the two substrates together.
    Type: Application
    Filed: April 11, 2005
    Publication date: October 12, 2006
    Applicant: Hewlett-Packard Development Company, L.P. Intellectual Property Administration
    Inventors: Charles Haluzak, Jeffrey Pollard
  • Publication number: 20060163712
    Abstract: A MEMS package includes a first substrate having a bonding surface and a second substrate having a polished bonding surface facing the bonding surface of the first substrate. The MEMS package further includes a polished layer of bonding substrate material deposited onto the bonding surface of the first substrate and fusion bonded to the polished bonding surface of the second substrate.
    Type: Application
    Filed: April 5, 2006
    Publication date: July 27, 2006
    Inventors: Chien-Hua Chen, Charles Haluzak
  • Publication number: 20060146426
    Abstract: A micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package, the secondary package comprising a seal and a second transparent lid; and an optical material disposed between the first transparent lid and the second transparent lid, where the optical material is a solid or liquid. An alternatively micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package; and a desiccant or getter material disposed inside the secondary package with the modulator package.
    Type: Application
    Filed: January 4, 2005
    Publication date: July 6, 2006
    Inventors: Chien-Hua Chen, David Craig, Charles Haluzak
  • Publication number: 20060134490
    Abstract: An economical and easy to manufacture miniaturized fuel cell having fuel chambers formed from a substrate, such as a silicon wafer, to define a plurality of elongate fuel chambers in fluid-communication with each other within the substrate. Elongate electrolytes, anodes and cathodes extend along the fuel chambers to maximize the effective electrolyte surface area, thereby increasing the amount of electrical current generated by the fuel cell. The elongate fuel chambers are preferably patterned within the substrate in a mirror image configuration such that two thin-film substrates my be joined together to define fuel chambers having two elongate electrolyte, anode, and cathode portions extending therealong.
    Type: Application
    Filed: December 23, 2005
    Publication date: June 22, 2006
    Inventor: Charles Haluzak
  • Publication number: 20060094143
    Abstract: A method of forming a micro-display includes forming a device that includes forming a partially reflecting layer on a first substrate and forming a plate overlying the partially reflecting layer, and adhering the device to a second substrate.
    Type: Application
    Filed: October 29, 2004
    Publication date: May 4, 2006
    Inventors: Charles Haluzak, Kenneth Faase, John Sterner, Chien-Hua Chen, Kirby Sand, Bao-Sung Yeh, Michael Regan
  • Publication number: 20060094149
    Abstract: This disclosure relates to lids and methods for forming and using them. One embodiment of these lids enables MEMS protected by the lids to be smaller. Another of these lids enables testing of a group of conjoined, lidded MEMS. Also, processes for forming and using these lids are also disclosed. One of these processes forms lids from a lid precursor residing over an assembly MEMS.
    Type: Application
    Filed: October 29, 2004
    Publication date: May 4, 2006
    Inventors: Chien-Hua Chen, David Craig, Charles Haluzak
  • Publication number: 20060082737
    Abstract: A micro-display has a device chip with a transparent layer overlying one or more micro-electromechanical system devices. A transparent cover overlies the transparent layer. An index-of-refraction-matching medium is interposed between the transparent layer and the transparent cover. An index of refraction of the index-of-refraction-matching medium is substantially equal to an index of refraction of the transparent layer and the transparent cover.
    Type: Application
    Filed: October 20, 2004
    Publication date: April 20, 2006
    Inventors: John Sterner, Charles Haluzak, William Boucher, Scott Lerner, James Ring, Brett Dahlgren, Chien-Hua Chen, Arthur Piehl, Quan Qi
  • Publication number: 20060081994
    Abstract: An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.
    Type: Application
    Filed: January 18, 2005
    Publication date: April 20, 2006
    Inventors: David Craig, Chien-Hua Chen, Charles Haluzak, Ronnie Yenchik
  • Publication number: 20060081643
    Abstract: A method of delivering fluid can include using electro-wetting effects to pick-up, transport, and/or deliver discrete volumes of fluid. Voltage can be applied across a fluid contact area having a conductive substrate and a dielectric material with an outer surface. The outer surface can have a native interfacial surface tension state and a voltage induced second state having a reduction in interfacial surface tension. A fluid can be contacted such that a volume of fluid adheres to the outer surface of the fluid contact area when the voltage is applied. Subsequently, the voltage can be adjusted such that at least a portion of the volume of fluid is delivered to a receiving location.
    Type: Application
    Filed: September 16, 2005
    Publication date: April 20, 2006
    Inventors: Charles Haluzak, Bradley Bower