Patents by Inventor Charles I. Grosjean
Charles I. Grosjean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11677379Abstract: A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.Type: GrantFiled: December 7, 2021Date of Patent: June 13, 2023Assignee: SiTime CorporationInventors: Joseph C. Doll, Nicholas Miller, Charles I. Grosjean, Paul M. Hagelin, Ginel C. Hill
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Patent number: 11646698Abstract: In an integrated circuit device having a microelectromechanical-system (MEMS) resonator and a temperature transducer, a clock signal is generated by sensing resonant mechanical motion of the MEMS resonator and a temperature signal indicative of temperature of the MEMS resonator is generated via the temperature transducer. The clock signal and the temperature signal are output from the integrated circuit device concurrently.Type: GrantFiled: December 23, 2021Date of Patent: May 9, 2023Assignee: SiTime CorporationInventors: Sassan Tabatabaei, Kamran Souri, Saleh Heidary Shalmany, Charles I. Grosjean
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Patent number: 11618675Abstract: A semiconductor device includes a first silicon layer disposed between second and third silicon layers and separated therefrom by respective first and second oxide layers. A cavity within the first silicon layer is bounded by interior surfaces of the second and third silicon layers, and a passageway extends through the second silicon layer to enable material removal from within the semiconductor device to form the cavity. A metal feature is disposed within the passageway to hermetically seal the cavity.Type: GrantFiled: December 6, 2021Date of Patent: April 4, 2023Assignee: SiTime CorporationInventors: Michael Julian Daneman, Charles I. Grosjean, Paul M. Hagelin
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Patent number: 11609136Abstract: Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.Type: GrantFiled: April 2, 2022Date of Patent: March 21, 2023Assignee: SiTime CorporationInventors: Paul M. Hagelin, Charles I. Grosjean, Lev Goncharov
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Patent number: 11584642Abstract: Multiple degenerately-doped silicon layers are implemented within resonant structures to control multiple orders of temperature coefficients of frequency.Type: GrantFiled: April 29, 2020Date of Patent: February 21, 2023Assignee: SiTime CorporationInventors: Charles I. Grosjean, Nicholas Miller, Paul M. Hagelin, Ginel C. Hill, Joseph C. Doll
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Publication number: 20220360218Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: ApplicationFiled: May 25, 2022Publication date: November 10, 2022Inventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
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Patent number: 11488930Abstract: First and second contacts are formed on first and second wafers from disparate first and second conductive materials, at least one of which is subject to surface oxidation when exposed to air. A layer of oxide-inhibiting material is disposed over a bonding surface of the first contact and the first and second wafers are positioned relative to one another such that a bonding surface of the second contact is in physical contact with the layer of oxide-inhibiting material. Thereafter, the first and second contacts and the layer of oxide-inhibiting material are heated to a temperature that renders the first and second contacts and the layer of oxide-inhibiting material to liquid phases such that at least the first and second contacts alloy into a eutectic bond.Type: GrantFiled: December 30, 2020Date of Patent: November 1, 2022Assignee: SiTime CorporationInventors: Paul M. Hagelin, Charles I. Grosjean
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Publication number: 20220337218Abstract: A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.Type: ApplicationFiled: June 23, 2022Publication date: October 20, 2022Inventors: Joseph C. Doll, Nicholas Miller, Charles I. Grosjean, Paul M. Hagelin, Ginel C. Hill
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Patent number: 11469734Abstract: A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.Type: GrantFiled: June 30, 2021Date of Patent: October 11, 2022Assignee: SiTime CorporationInventors: Paul M. Hagelin, Charles I. Grosjean
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Publication number: 20220291065Abstract: Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.Type: ApplicationFiled: April 2, 2022Publication date: September 15, 2022Inventors: Paul M. Hagelin, Charles I. Grosjean, Lev Goncharov
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Patent number: 11374535Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: GrantFiled: November 29, 2019Date of Patent: June 28, 2022Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
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Publication number: 20220162063Abstract: A semiconductor device includes a first silicon layer disposed between second and third silicon layers and separated therefrom by respective first and second oxide layers. A cavity within the first silicon layer is bounded by interior surfaces of the second and third silicon layers, and a passageway extends through the second silicon layer to enable material removal from within the semiconductor device to form the cavity. A metal feature is disposed within the passageway to hermetically seal the cavity.Type: ApplicationFiled: December 6, 2021Publication date: May 26, 2022Inventors: Michael Julian Daneman, Charles I. Grosjean, Paul M. Hagelin
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Publication number: 20220166403Abstract: A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.Type: ApplicationFiled: December 7, 2021Publication date: May 26, 2022Inventors: Joseph C. Doll, Nicholas Miller, Charles I. Grosjean, Paul M. Hagelin, Ginel C. Hill
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Patent number: 11320329Abstract: Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of a sensed property, such as regional contact forces, ambient conditions and/or environmental composition. The resonant MEMS sensors generate signals that oscillate at respective frequencies corresponding to the sensed property, increasing or decreasing in frequency in response to an increase or decrease in that property to effect a frequency-modulated digital output.Type: GrantFiled: September 12, 2017Date of Patent: May 3, 2022Assignee: SiTime CorporationInventors: Paul M. Hagelin, Charles I. Grosjean, Lev Goncharov
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Patent number: 11312622Abstract: A semiconductor device includes first and second exposed electrical contacts and a cavity having a microelectromechanical system (MEMS) structure therein. A conductive path extends from the first exposed electrical contact to the cavity and an over-voltage protection element electrically is coupled between the first and second exposed electrical contacts.Type: GrantFiled: June 29, 2020Date of Patent: April 26, 2022Assignee: SiTime CorporationInventors: Nicholas Miller, Ginel C. Hill, Charles I. Grosjean, Michael Julian Daneman, Paul M. Hagelin, Aaron Partridge
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Patent number: 11245361Abstract: In an integrated circuit device having a microelectromechanical-system (MEMS) resonator and a temperature transducer, a clock signal is generated by sensing resonant mechanical motion of the MEMS resonator and a temperature signal indicative of temperature of the MEMS resonator is generated via the temperature transducer. The clock signal and the temperature signal are output from the integrated circuit device concurrently.Type: GrantFiled: October 1, 2020Date of Patent: February 8, 2022Assignee: SiTime CorporationInventors: Sassan Tabatabaei, Kamran Souri, Saleh Heidary Shalmany, Charles I. Grosjean
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Patent number: 11228298Abstract: A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.Type: GrantFiled: January 10, 2019Date of Patent: January 18, 2022Assignee: SiTime CorporationInventors: Joseph C. Doll, Nicholas Miller, Charles I. Grosjean, Paul M. Hagelin, Ginel C. Hill
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Patent number: 11220425Abstract: A semiconductor device includes a first silicon layer disposed between second and third silicon layers and separated therefrom by respective first and second oxide layers. A cavity within the first silicon layer is bounded by interior surfaces of the second and third silicon layers, and a passageway extends through the second silicon layer to enable material removal from within the semiconductor device to form the cavity. A metal feature is disposed within the passageway to hermetically seal the cavity.Type: GrantFiled: May 21, 2020Date of Patent: January 11, 2022Assignee: SiTime CorporationInventors: Michael Julian Daneman, Charles I. Grosjean, Paul M. Hagelin
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Patent number: 11218984Abstract: In various time-transfer systems, one or more fixed-position time beacons broadcast radio-frequency (RF) time-transfer messages to time-keeping modules disposed in remote radio heads and other strategic locations to achieve highly reliable and accurate synchronized time, phase, and frequency transfer over a metropolitan or other wide-field area.Type: GrantFiled: October 17, 2019Date of Patent: January 4, 2022Assignee: SiTime CorporationInventors: Markus Lutz, Sassan Tabatabaei, Charles I. Grosjean, Paul M. Hagelin, Aaron Partridge
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Patent number: 11082024Abstract: A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.Type: GrantFiled: December 4, 2019Date of Patent: August 3, 2021Assignee: SiTime CorporationInventors: Paul M. Hagelin, Charles I. Grosjean