Abstract: The present disclosure is directed to a device for displaying the estimated drying time of an applied layer of a coating composition that is based on the input of several process variables that can include temperature, humidity, film build, air velocity, altitude, the type of coating composition or a combination thereof. The disclosed device provides an input for one or more of the process variables, a network or algorithm for computing the estimated drying time based on the input process variables, and an output device for displaying the estimated drying time.

Abstract: The present invention is directed to a method for controlling the viscosity of a sprayable mixture. The sprayable mixture forms a layer of a coating composition on an applied substrate and forms crosslinked network after drying and curing the layer. The dried and cured composition provides the substrate with a coating having a good appearance.

Abstract: The present invention is directed to a method for producing a sprayable composition on a substrate. The method comprises a step of introducing a crosslinking component into an atomized stream of a lacquer composition to improve the physical properties of an applied layer of lacquer composition while maintaining the excellent pot life properties. This invention is also directed to a delivery device and a system for introducing the catalyst into the atomized coating composition.

Abstract: The present disclosure relates to a method for producing a sprayable mixture containing protected crosslinkable groups. The sprayable mixture has a substantially consistent viscosity and can produce a crosslinked coating composition having a good appearance useful in the painting industry.

Abstract: The present invention is directed to a delivery device and a system for introducing a second component into an atomized composition. The present invention is particularly directed to a delivery device and a system for introducing a catalyst into an atomized coating composition.

Abstract: The present invention is directed to a method for introducing a catalyst into an atomized coating composition. This invention is also directed to a delivery device and a system for introducing the catalyst into the atomized coating composition.

Abstract: A motorized bicycle storage and retrieval assembly for loading, storing and unloading bikes. The storage assembly is mountable within or to the top of existing bicycle storage racks. The storage assembly has a frame, a lower track, an upper track and a motor assembly and windable cable interconnects the lower and upper trolley track. The upper track has front and rear bike wheel securement structures which secure a bike to the upper track. A plate assembly is provided to pivot the upper trolley track with respect to the lower trolley track to load and unload bikes. The motorized assembly includes a gear reduction device, a brake device, a wound cable and a switch mechanism to operate the bicycle storage assembly. Further, a safety mechanism is provided to lock the upper track to the lower track.

Abstract: The present invention is directed to a method for introducing a catalyst into an atomized coating composition. This invention is also directed to a delivery device and a system for introducing the catalyst into the atomized coating composition.

Abstract: Methods and systems for removing protective films from microfeature workpieces are disclosed herein. One particular embodiment of such a method comprises separating at least a portion of a protective tape from a workpiece to which the protective tape is attached with a separator configured to drive against an interface between the protective tape and the workpiece. The method further includes engaging the portion of the protective tape detached from the workpiece with a removal system.

Abstract: A board-type game to be played by two or more players. The game includes lasers where players selectively divert the path of the laser beams. The board apparatus comprises a surface, bounded by a frame, over which laser beams are directed down symbolic rows and columns which constitute a matrix of squares. Each square is a subregion of the surface piece, and is bounded along its four sides by raised edges which are parallel and perpendicular rows and columns of the board. The raised edges, creating recessed squares, assist in orienting the playing pieces. Playing pieces may contain no mirror, one mirror, or two mirrors (oriented back-to-back to produce separate surfaces reflecting in opposite directions). Playing pieces are placed in a predetermined “starting” configuration on the squares of the gridded surface piece. Depending on whether a playing piece contains a mirror or not, said piece may reflect an incident laser beam from a row to a column or from a column to a row.

Abstract: A folded interposer used to achieve a high density semiconductor package is disclosed. The folded interposer is comprised of a thin, flexible material that can be folded around one or multiple semiconductor dice in a serpentine fashion. The semiconductor dice are then attached to a substrate through electrical contacts on the interposer. The folded interposer allows multiple semiconductor dice to be efficiently stacked in a high density semiconductor package by reducing the unused or wasted space between stacked semiconductor dice. Vias extending through the folded interposer provide electrical communication between the semiconductor dice and the substrate. The present invention also relates to a method of packaging semiconductor dice in a high density arrangement and a method of forming the high density semiconductor package.

Abstract: Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric material disposed on a surface thereof, surrounding but not covering interconnect elements, such as bond pads, on that surface. A second semiconductor component substrate, such as a carrier substrate with interconnect elements such as terminal pads, is adhered to the first semiconductor component substrate, forming a semiconductor package assembly having interconnect voids between the corresponding interconnect elements. A flowable conductive material is then injected into each interconnect void using an injection needle that passes through one of the substrates into the interconnect void, forming a conductive interconnect between the bond pads and terminal pads of the substrates.

Abstract: Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric material disposed on a surface thereof, surrounding but not covering interconnect elements, such as bond pads, on that surface. A second semiconductor component substrate, such as a carrier substrate with interconnect elements such as terminal pads, is adhered to the first semiconductor component substrate, forming a semiconductor package assembly having interconnect voids between the corresponding interconnect elements. A flowable conductive material is then injected into each interconnect void using an injection needle that passes through one of the substrates into the interconnect void, forming a conductive interconnect between the bond pads and terminal pads of the substrates.

Abstract: Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric material disposed on a surface thereof, surrounding but not covering interconnect elements, such as bond pads, on that surface. A second semiconductor component substrate, such as a carrier substrate with interconnect elements such as terminal pads, is adhered to the first semiconductor component substrate, forming a semiconductor package assembly having interconnect voids between the corresponding interconnect elements. A flowable conductive material is then injected into each interconnect void using an injection needle that passes through one of the substrates into the interconnect void, forming a conductive interconnect between the bond pads and terminal pads of the substrates.

Abstract: A dispensing apparatus includes recirculating systems though which the dispersants are recirculated to prevent settling of solid components, such as pigments that may be present in the dispersants. The apparatus includes dispensers located on a movable table positioned inside a frame assembly of the apparatus. The table is positioned to dispense a selected dispersant into a container placed atop a weighing scale through the dispenser selected in accordance with a recipe. The weight of the selected dispersant is monitored by the weighing scale and once a desired amount of the selected dispersant is dispensed, a signal is received by the apparatus from the weighing scale to switch off the dispensing of the dispersant. The table is then moved to deliver the next dispersant, required in the recipe. The process is continued until all the desired dispersants are dispensed in the container to form the composition, such as an automotive paint.

Abstract: The present invention is directed to a dispensing apparatus used in gravimetrically dispensing accurate predetermined amounts of dispersants, particulates, or a combination thereof. The apparatus includes recirculating systems though which the dispersants are recirculated to prevent settling of solid components, such as pigments that may be present in the dispersants. The apparatus includes dispensers located on a movable table positioned inside a frame assembly of the apparatus. The table is positioned to dispense a selected dispersant into a container placed atop a weighing scale through the dispenser selected in accordance with a recipe. The weight of the selected dispersant is monitored by the weighing scale and once a desired amount of the selected dispersant is dispensed, a signal is received by the apparatus from the weighing scale to switch off the dispensing of the dispersant. The table is then moved to deliver the next dispersant, required in the recipe.

Abstract: A semiconductor lead frame, a semiconductor package, and a method for fabricating semiconductor packages, are provided. The lead frame includes side rails and multiple patterns of lead fingers. The lead frame also includes die mounting paddles associated with the patterns of lead fingers, and support members that attach the mounting paddles to the side rails. The mounting paddles include stiffening members such as indentations, ridges or corrugations formed in a die mounting surface thereof. The stiffening members prevent bowing of the mounting paddles, provide an increased surface area for bonding dice to the mounting paddles, and allow the mounting paddles to flex to accommodate thermal stresses. The support members for the mounting paddles can also have a stiffening cross sectional configuration to help maintain a planar orientation and location of the mounting paddles.

Abstract: The present invention is embodied in a method for screen printing a target object, such as a substrate, which allows for the removal of a misaligned screen printed pattern without causing damage to the target object. A removable barrier layer is applied to the substrate and the pattern screen printed on the removable barrier layer. If the pattern is not properly aligned, the removable barrier layer with the screen printed pattern attached is removed from the substrate and the substrate can be reprinted. If the pattern is properly aligned, only the removable barrier layer is removed and the pattern drops onto and adheres to the substrate.

Abstract: A closed loop conveyor for viscid material is provided with a plurality of spaced, planar conveying flights within a material conveying conduit. The flights are mounted on an endless transporting chain and are moved from one or more charge stations where material is loaded into the conduit to one or more gravity discharge stations where the material falls out of the conveyor. At the discharge station the planar conveying flights are scraped clean by a rotatable assembly. The assembly preferably comprises a circular plate mounted for rotation in a generally vertical plane adjacent to the conveying path and about a substantially horizontal axis. A number of scraper blades are mounted on the circular plate substantially uniformly, peripherally spaced from one another and extend away from one side of the plate in a generally horizontal direction toward a conveying path defined by movement of the flights.