Abstract: A method for fabricating a microelectronics fabrication. There is first provided a substrate employed within a microelectronics fabrication. There is then formed horizontally spaced over the substrate a plurality of patterned microelectronics structures. There is then formed over the substrate and the plurality of patterned microelectronics structures a microelectronics layer. The microelectronics layer has a first region of the microelectronics layer interposed between the plurality of patterned microelectronics structures and a second region of the microelectronics layer not interposed between the plurality of microelectronics structures. Finally, there is processed through a grazing angle method the microelectronics layer, where the grazing angle method processes substantially all of the second region of the microelectronics layer without substantially processing the first region of the microelectronics layer.

Abstract: A method is described for filling narrow gaps in a surface that is being overcoated. This has been achieved by heating the overcoating layer to a sufficient extent so that it flows relatively easily. This, in combination with externally applied pressure, causes the overcoating layer to effectively fill any narrow gaps in the surface being coated. Temperature and pressure are applied for a time that is sufficient to allow small quantities of gas that may have become trapped in the gaps to bubble to the surface. In an alternative embodiment, the surface to be coated is subjected to negative pressure prior to application of the coating. This eliminates the possibility of trapping gas in the gaps so a waiting time is no longer necessary.

Abstract: There are disclosed compounds of the formula ##STR1## wherein R.sup.1 and R.sup.2 taken together represent ##STR2## R.sup.3 and R.sup.4 are hydrogen; R.sup.5 is 2-pyridinyl, 2-pyrazinyl, 2-pyrimidinyl, 3-pyridazinyl or any of the foregoing R.sup.5 moieties substituted by lower alkyl, lower alkoxy, halo lower alkyl, cyano, nitro or halo;X, Y and Z are, independently, N, S, O, NR.sup.6, SO, SO.sub.2, CR.sup.6 or CH.sub.2 ;A is lower alkylene, O or S;R.sup.6 is hydrogen, lower alkyl, aryl, aralkyl;m is 3-7;and the pharmaceutically acceptable salts thereof, and their use as antipsychotic/-anxiolytic agents having a low liability for extrapyramidal side effects.

Abstract: An angle-adjustable workpiece seat includes a base having a bottom surface, a top surface having a concave primary supporting surface, a confining surface, a receiving groove and holes, a locking piece having a pressing surface and corresponding holes, threaded elements threaded through corresponding holes of the base and the locking piece for driving the locking piece to laterally translate in the receiving groove, and a sliding member having a top V-shaped positioning surface and a bottom sliding rail complementary to a sliding groove formed by said pressing, primary supporting and confining surfaces and having a primary sliding surface matching against and slidable on the primary supporting surface. The bottom surface can detachably attach thereunder two identical cylinders. The positioning surface can include two plane surfaces each of which detachably attaches thereto a pad piece.