Abstract: Technology is disclosed for recovering the consistency of a RAID (Redundant Array of Independent Disks) metadata database when data corruption is detected in the RAID metadata database. The RAID metadata database includes super sectors, stage sectors, and a data region. Valid data within the data region is a contiguous set of sectors extending from a head sector to a tail sector. In response to data corruption in one of the two super sectors, a set of pointers contained in the other super sector is used to identify the head sector and tail sector. In response to data corruption in both super sectors, the head sector and tail sector are located based on the contents of the sectors in the data region. Techniques are also disclosed for recovering consistency when the data corruption occurs in the stage sectors and/or data region.

Abstract: Technology is disclosed for recovering the consistency of a RAID (Redundant Array of Independent Disks) metadata database when data corruption is detected in the RAID metadata database. The RAID metadata database includes super sectors, stage sectors, and a data region. Valid data within the data region is a contiguous set of sectors extending from a head sector to a tail sector. In response to data corruption in one of the two super sectors, a set of pointers contained in the other super sector is used to identify the head sector and tail sector. In response to data corruption in both super sectors, the head sector and tail sector are located based on the contents of the sectors in the data region. Techniques are also disclosed for recovering consistency when the data corruption occurs in the stage sectors and/or data region.

Abstract: Technology for configuration metadata recovery that detects a reliability failure regarding configuration metadata stored in non-volatile data storage of a data storage system. The configuration metadata indicates how a metadata database is stored in the non-volatile data storage of the data storage system. In response to detection of the reliability failure regarding the configuration metadata, the technology identifies valid generations of the configuration metadata that are currently stored in the non-volatile data storage of the data storage system, and determines a user-selected one of the valid generations of the configuration metadata. The metadata database is accessed based on the user-selected one of the valid generations of the configuration metadata.

Abstract: A method of managing storage resources is provided. The method includes (a) storing data in an array of storage extents on respective storage drives of a plurality of storage drives, the array of storage extents having a first level of redundancy; and (b) in accordance with a storage management policy, adjusting the array of storage extents to have a second level of redundancy by changing the array of storage extents from having a first number of storage extents on respective storage drives to having a second number of storage extents on respective storage drives, the second level of redundancy providing a different tolerance for failure than the first level of redundancy. An apparatus, system, and computer program product for performing a similar method are also provided.

Abstract: Embodiments of the present disclosure provide a method, apparatus and computer readable medium for managing a plurality of disks. The method includes in response to receiving a write request for a first stripe of a redundant array of independent disks (RAID), searching for extents mapped to the first stripe. The RAID is created on a plurality of extents obtained by dividing a plurality of disks. The method further includes, in response to the extents mapped to the first stripe being missed, selecting a first set of extents in a free state from the plurality of extents of the plurality of disks. The method further includes mapping the first stripe to the first set of extents.

Abstract: A method of managing storage resources is provided. The method includes (a) storing data in an array of storage extents on respective storage drives of a plurality of storage drives, the array of storage extents having a first level of redundancy; and (b) in accordance with a storage management policy, adjusting the array of storage extents to have a second level of redundancy by changing the array of storage extents from having a first number of storage extents on respective storage drives to having a second number of storage extents on respective storage drives, the second level of redundancy providing a different tolerance for failure than the first level of redundancy. An apparatus, system, and computer program product for performing a similar method are also provided.

Abstract: Embodiments of the present disclosure provide a method, apparatus and computer readable medium for managing a plurality of disks. The method includes in response to receiving a write request for a first stripe of a redundant array of independent disks (RAID), searching for extents mapped to the first stripe. The RAID is created on a plurality of extents obtained by dividing a plurality of disks. The method further includes, in response to the extents mapped to the first stripe being missed, selecting a first set of extents in a free state from the plurality of extents of the plurality of disks. The method further includes mapping the first stripe to the first set of extents.

Abstract: Embodiments are directed to a methods and systems for nucleic acid detection using enzymatic reactions on a microarray. In one embodiment, a probe comprising a probe nucleotide sequence and a substantially homogenous sequence extender portion is provided on the surface of a microarray. The probe nucleotide sequence is hybridized to the complementary target nucleotide sequence. A solution containing enzymes and detection elements is applied to the hybridized probe structure. The enzyme determines the composition of the nucleotide structure of the extender and creates a complementary homogenous sequence extender structure between the target nucleotide sequence and the microarray surface structure. The detection elements in the solution are bound to the extender structure, thus allowing detection using an appropriate detector system.

Abstract: The present invention relates to methods and compositions for controlling the expression of a target gene, whereby an intron cassette such as INT9, an intronic mec-2-derived element, is incorporated into the target gene and expression of the product of the target gene is conditional upon functional expression of the RNA processing protein, mec-8.

Abstract: The present invention relates to the use of split fluorescent proteins to determine whether promoters are coordinately active, whereby the transcriptional expression of incomplete portions of a fluorescent protein is controlled by different promoters and coordinate (not necessarily contemporaneous) promoter activity results in the reconstitution of a fluorescent protein. The present invention, in non-limiting embodiments, may be used to selectively label cells and cell structures in vivo and to demonstrate changes in promoter activity (for example, in developmental biology and drug discovery applications).

Abstract: An internally disposed cooling device is provided. The cooling device includes a cooling member and a docket member. The cooling member includes a first cooling unit, a second unit and a cryogenic element. The cryogenic element has a cold surface that contacts the first cooling unit, and a hot surface that contacts the second cooling unit. Since the cold surface of the cryogenic element has a temperature much lower than that of the room temperature, the first cooling unit can thus produce cold and dry air to cool down the electronic apparatus. Meanwhile, the second cooling unit is employed to dissipate heat generated from the cryogenic element.

Abstract: A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.

Abstract: A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure has a back plate disposed underneath the printed circuit board and a plurality of fitting columns, wherein the back plate is perforated with a plurality of holes and each of the fitting columns has an elongate hollow tube and an insertion member projecting from a periphery of one end of the hollow tube. The hollow tube has a threaded internal sidewall and the insertion member has a shape conformal to the respective holes at which the fitting columns are fixed to the back plate.

Abstract: A heat pipe heat sink with a holeless fin module is disclosed in the present invention. Because of the holeless arrangement the heat pipe heat sink is much more convenient for manufacturing. The heat generated by an electrical component can quickly be transferred into the heat pipe and uniformly distributed to each of the heat dissipating fins. The heat pipe heat sink includes a heat dissipating fin module, a heat conducting member, one or more heat pipes installed on the heat conducting member, and a heat conducting plate which is thermally connected to the heat conducting member and the electrical component. The end surface of the heat conducting member with the heat pipe installed thereon is convenient for application of an adhesive because the end surface and the pipe wall of the heat pipe are exposed outside of the heat dissipating fin module before any combination takes place.

Abstract: A method for fabricating a thermoelectric heat dissipation device including the steps of providing a base plate, a thermoelectric semiconductive element connected to the base plate and a heat sink in form of plates or fins with one surface coated an electric insulation coating and patterned conductive lines, and adhering the heat sink to the thermoelectric semiconductive element. Accrodingly, the thermoelectric heat dissipation device is provided including the theremoelectric semiconductive element as a cryogenic chip and the heat sink. The cooling surface of the cryogenic chip is directly electrically connected to the heat sink which is in form of plates or fins, and the other surface of the cryogenic chip is adhered to the base plate. The base plate of the device is utilized to connect with the surface of an electronic component for heat transfer.

Abstract: An internally disposed cooling device is provided. The cooling device includes a cooling member and a docket member. The cooling member includes a first cooling unit, a second unit and a cryogenic element. The cryogenic element has a cold surface that contacts the first cooling unit, and a hot surface that contacts the second cooling unit. Since the cold surface of the cryogenic element has a temperature much lower than that of the room temperature, the first cooling unit can thus produce cold and dry air to cool down the electronic apparatus. Meanwhile, the second cooling unit is employed to dissipate heat generated from the cryogenic element.

Abstract: A heat dissipating device includes a fastening structure and a heat sink. The heat sink has a thermal conductive base which has a top surface and two T-shape slots formed at two opposing ends of the top surface. The fastening structure has a pair of brackets. Each of the brackets has a planar plate and a T-shape arm to be inserted into the corresponding T-shape slot. The T-shape arms are hinged with one end of the planar plates, such that when the T-shape arms are inserted into the T-shape slots, the planar plates extend horizontally at a level lower than the top surface of the base. Each of the planar plates has a through hole through which the fastening structure can be mounted to a board by a fastener.

Abstract: An air-conditioning heat dissipation system includes a heat dissipation device and an enclosure. The heat dissipation device has a top and a bottom heat sinks secured to each other and a cryogenic chip sandwiched between the top and bottom heat sinks. The enclosure has a box assembly and a planar assembly extending from one side of the box assembly. The box assembly is operative to receive the heat dissipation device therein, and the planar assembly includes a channel having one end in communication with the box assembly and the other end open to external.

Abstract: A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.

Abstract: A fastening structure used for fastening a heat sink to a heat generating device formed on a board is disclosed. The heat sink has a plurality of vertically extending fins spaced by each other by a first gap, and the fastening structure has a pair of blocking members applied to two outermost fins of the heat sink. Each of the blocking members has a horizontal plate, a pair of arms extending from two opposing sides of the horizontal plate, a vertical plate extending perpendicularly from one end of the horizontal plate, a pair of wings extending from two opposing sides of the vertical plates, and a pair of resilient flaps extending from top edges of the wings. Each of the arms is terminated with a hook, and each of the block members further has a pair of loops formed on the board, such that by engaging the hooks with the loops, the fastening structure secures the heat sink to the heat generating device on the board.