Abstract: A fastening structure used for fastening a heat sink to a heat generating device formed on a board is disclosed. The heat sink has a plurality of vertically extending fins spaced by each other by a first gap, and the fastening structure has a pair of blocking members applied to two outermost fins of the heat sink. Each of the blocking members has a horizontal plate, a pair of arms extending from two opposing sides of the horizontal plate, a vertical plate extending perpendicularly from one end of the horizontal plate, a pair of wings extending from two opposing sides of the vertical plates, and a pair of resilient flaps extending from top edges of the wings. Each of the arms is terminated with a hook, and each of the block members further has a pair of loops formed on the board, such that by engaging the hooks with the loops, the fastening structure secures the heat sink to the heat generating device on the board.

Abstract: A heat dissipating device which has a fastening structure and a heat sink is disclosed. The heat sink has a thermal conductive base which has a top surface and two T-shape slots formed at two opposing ends of the top surface. The fastening structure has a pair of brackets. Each of the brackets has a planar plate and a T-shape arm to be inserted into the corresponding T-shape slot. The T-shape arms are hinged with one end of the planar plates, such that when the T-shape arms are inserted into the T-shape slots, the planar plates extend horizontally at a level lower than the top surface of the base. Each of the planar plates has a through hole through which the fastening structure can be mounted to a board by a fastener. Preferably, the heat sink further has a plurality of fins mounted to the top surface of the base. Each of the fins has a notch recessed from a bottom edge thereof.

Abstract: A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure has a back plate disposed underneath the printed circuit board and a plurality of fitting columns, wherein the back plate is perforated with a plurality of holes and each of the fitting columns has an elongate hollow tube and an insertion member projecting from a periphery of one end of the hollow tube. The hollow tube has a threaded internal sidewall and the insertion member has a shape conformal to the respective holes at which the fitting columns are fixed to the back plate.

Abstract: A fastening device for heat slug includes a frame, two projections and a heat slug. The frame defines an accommodating space therein. The projections are formed on the frame. The heat slug has a plurality of shoulders and is located in the accommodating space. The frame abuts against the shoulders of the heat slug. Thereby the fastening device of the invention is compatible with different types of CPU such as Pentium IV and K7 types.

Abstract: A fastening device for heat slug includes a frame, two projections and a heat slug. The frame defines an accommodating space therein. The projections are formed on the frame. The heat slug has a plurality of shoulders and is located in the accommodating space. The frame abuts against the shoulders of the heat slug. Thereby the fastening device of the invention is compatible with different types of CPU such as Pentium IV and K7 types.

Abstract: A radiator with positioning and buckling structure includes multiple metal plates, each of which has a main body, and a folded side portion is connected to one or two sides of the main body. The positioning and buckling structure is disposed on each of the metal plates. The positioning and buckling structure includes a snapping piece extending from the folded side portion. The snapping piece has a cleaved groove thereon and at two sides of the snapping piece there is provided two hooking portions. A buckling slot is disposed on the folded side portion of the metal plate corresponding to the snapping piece. The buckling slot is connected to a rear opening having a smaller width than the width of the snapping piece so that the metal plates can be stacked together.

Abstract: A positioning structure for heat dissipating fins is provided. The heat dissipating fins is comprised of multiple metal plates, each of which comprising a main body, and a folded side portion connected to one or two sides of the main body. The positioning structure is disposed on each of the metal plates. The positioning structure comprises a protrusion located on the main body of the metal plate, an aperture being formed on the main body, the protrusion formed in the aperture; and a resilient snapping piece located on the folded side portion, the snapping piece corresponding to the protrusion and defining a buckling opening therein, the buckling opening being connected to a front opening having a width normally smaller than the width of the protrusion.

Abstract: A heat dissipation assembly includes a base with a ridge and multiple fins mounted on top of the base. Each of the fins has a plate with a cutout defined in a mediate portion of a bottom edge to correspond to the ridge of the base, two first bends respectively extending from opposite sides of the cutout in a same direction from the bottom edge and a second bend formed on a top edge of the cutout. The fins are able to be securely mounted on top of the base via the two first bends.

Abstract: A heat dissipation fin includes multiple unit each having a top, a first side and a second side and multiple bridges each connecting every two adjacent units together and connected to each one of the units at a fold. The bridge has a front side and a rear side and the top of the unit has a first side in parallel with the front side and a second side in parallel with the rear side of the bridge. Each front side has a width smaller than a width of each rear side and each first side has a width smaller than a width of each second side.

Abstract: A heat dissipating device has a conductor holder and a heat conductor. The conductor holder is securely attached to the CPU base and has a through hole. The heat conductor is securely connected to the through hole in the conductor holder and contacts with the CPU. The heat conductor comprises multiple heat conductive elements made of a material with good heat conductivity. One end of the heat conductive elements are twisted together to form a bound section on the first end of the heat conductor. The other end of each heat conductive element is far away from the other element so as to form an expansion section on a second end of the heat conductor. In such an arrangement, the heat generated by the CPU can be efficiently dissipated from the expansion section of the heat conductor.

Abstract: This invention provides a composition comprising an amount of a polypeptide effective to increase the life-span of cells wherein the polypeptide has the amino acid sequence of a cytosolic catalase and a suitable carrier. This invention also provides an isolated nucleic acid molecule encoding a cytosolic catalase. This invention also provides a host vector system for the production of a polypeptide having the biological activity of catalase which comprises the above-described vectors in a suitable host. This invention also provides a method for prolonging cell life, comprising: (a) linking the above-described nucleic acids to a regulatory element such that the expression of the above-described nucleic acids is under the control of the regulatory element; and (b) introducing the linked nucleic acid into cells for expression of the nucleic acid, thereby prolonging cell life.