Abstract: A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller (22) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head (50) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.

Abstract: A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles that fire droplets having a deposited width when deposited on the substrate. A positioning device moves the microdeposition head (50) relative to the substrate at a head speed. A controller (22) generates over-clocking signals at a rate that is substantially greater than the head speed divided by the droplet width to improve resolution. The controller (22) includes a positioning module that generates position control signals for the positioning device. The controller (22) includes a nozzle firing module (114) that generates nozzle firing commands based on the over-clocking rate to fire the nozzles to form droplets that define features on the substrate.

Abstract: A temperature controllable vacuum chuck includes a mounting bracket, a porous plate, a heating element, and a temperature sensor. The porous plate is mounted to the mounting bracket and is configured for securing a substrate to the vacuum chuck when air is suctioned out of the vacuum chuck. The heating element is attached to the bottom of the porous plate and uniformly heats the porous plate, thereby heating any substrate mounted on the vacuum chuck and enabling control over the cure rate of fluid materials deposited on the substrate. The temperature sensor measures the temperature of the porous plate so that it can be adjusted when desired with a user controllable temperature control component.

Abstract: A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller (22) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head (50) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.

Abstract: A temperature controllable vacuum chuck includes a mounting bracket, a porous plate, a heating element, and a temperature sensor. The porous plate is mounted to the mounting bracket and is configured for securing a substrate to the vacuum chuck when air is suctioned out of the vacuum chuck. The heating element is attached to the bottom of the porous plate and uniformly heats the porous plate, thereby heating any substrate mounted on the vacuum chuck and enabling control over the cure rate of fluid materials deposited on the substrate. The temperature sensor measures the temperature of the porous plate so that it can be adjusted when desired with a user controllable temperature control component.

Abstract: A belt having a region comprising a non-woven material region on a pulley engaging surface. The non-woven region is infused with an elastomeric compound. A predetermined amount of metal salt of carboxylic acid is included in the elastomeric compound during compounding. The metal salts of carboxylic acid significantly reduce or eliminate slip noise.

Abstract: A microdeposition apparatus and method according to the invention deposits a fluid manufacturing material on a substrate to form microstructures. The apparatus includes a microdeposition head mounted on a head support and held above a substrate, which is mounted on a stage in controlled alignment with the microdeposition head. A control system moves the stage, and thus the substrate, while the fluid manufacturing materials is discharged from the microdeposition head. A diagnostics assembly ensures the nozzles of the microdeposition head are firing correctly. A maintenance station cleans the nozzles of the microdeposition head when needed. A capping station and a docking station hold the microdeposition head during periods of nonuse. A mounting bracket and computer system enable various microdeposition heads to be interchangeably used with the microdeposition apparatus.

Abstract: A machine according to the invention deposits a fluid manufacturing material on a substrate. The machine includes a first and second microdeposition head, each mounted on a head support and held above a substrate. The first microdeposition head is operable to discharge droplets of a first fluid manufacturing material and the second microdeposition head is operable to discharge droplets of a second fluid manufacturing material. In one embodiment, a third microdeposition head is provided to discharge droplets of a third fluid manufacturing material. The control system is in electrical communication with said first, second and/or third microdeposition heads and the stage to coordinate the deposition of the first, second and/or third fluid manufacturing materials on the substrate.

Abstract: A method for manufacturing structure on a printed circuit board substrate according to the invention includes positioning a printed circuit board substrate in a machine capable of performing piezoelectric deposition of a fluid manufacturing material. The printed circuit board substrate is aligned with a piezoelectric deposition head of the machine. Computer numeric control of the relative motion of the printed circuit board substrate and the piezoelectric deposition head allows droplets of the fluid manufacturing material to be deposited at selected locations of the printed circuit board substrate. The printed circuit board substrate includes a conductive surface layer and a masking structure that exposes selected portions of the surface layer, thereby forming traces upon removal of selected portions of the surface layer. Further, the structure manufactured on the printed circuit board may be a resistor.

Abstract: A belt having a region comprising a non-woven material region on a pulley engaging surface. The non-woven region is infused with an elastomeric compound. A predetermined amount of metal salt of carboxylic acid is included in the elastomeric compound during compounding. The metal salts of carboxylic acid significantly reduce or eliminate slip noise.

Abstract: The invention comprises a multi-ribbed belt having a modified coefficient of friction at a belt side/pulley interface. The modified coefficient of friction causes the belt to operate more quietly. The modified coefficient of friction is the result of graphite and carbon black added to the elastomer. Graphite is added in the amount of approximately 40 to 100 parts by weight of graphite for each 100 parts by weight of polymer. Carbon black is added in the amount of approximately 20 to 100 parts for each 100 parts elastomer.

Abstract: A process to prepare a glass run channel composite of the type utilized in vehicle applications for sealing against window glass, includes a cured elastomeric substrate having one or more sealing surfaces, and a polyolefin compound having a low melt index and a high density, and optionally containing a softening compound and other additives. The polyolefin compound is solvent-free and substantially melted when contacted with the sealing surfaces of the elastomeric substrate prior to cure, and upon cure of the elastomeric substrate, the polyolefin compound adheres to the substrate and provides a solid, low-friction abrasion-resistant coating on the sealing surfaces of the substrate for sealing against a window introduced into the glass run channel.