Patents by Inventor Charles Thomas Rettner
Charles Thomas Rettner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240112056Abstract: A method of constructing a superconducting switch includes providing a substrate. A first superconducting metal line is fabricated on the substrate, wherein the superconducting metal line has a left portion, a right portion, and a center portion patterned along a first crystalline direction of the substrate. One or more etch release holes are provided in the center portion of the first superconducting metal line.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Inventors: Vivekananda P. Adiga, Russell A. Budd, Charles Thomas Rettner, Stephen M. Gates
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Publication number: 20240113015Abstract: A method of constructing a superconducting switch includes depositing a thin sacrificial layer on top of a substrate. The sacrificial layer is patterned to remove portions of the sacrificial layer except at a first portion of the substrate. A superconducting metal layer is patterned on top of the substrate and on top of the sacrificial layer. The superconducting metal layer is patterned to form a superconducting metal line over the sacrificial layer. The patterned sacrificial layer is etched from under the superconducting metal line to release the metal line from the substrate.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Inventors: Vivekananda P. Adiga, Russell A. Budd, Charles Thomas Rettner, Stephen M. Gates
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Patent number: 11882770Abstract: Embodiments are provided for fabrication of superconducting devices using area-selective deposition of a metal nitride. In some embodiments, a method can include providing a thermally treated carbon layer, and selectively depositing a metal nitride using the thermally treated carbon layer for formation of a superconducting device.Type: GrantFiled: December 10, 2020Date of Patent: January 23, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Rudy J. Wojtecki, Damon Brooks Farmer, Charles Thomas Rettner, Noel Arellano, Alexander Friz, Matthew W. Copel
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Publication number: 20230401476Abstract: A device comprises a first superconducting quantum bit, a second superconducting quantum bit, and a coupler circuit. The first superconducting quantum bit comprises a superconducting tunnel junction and a shunt inductor which form a first superconducting loop. The second superconducting quantum bit comprises a superconducting tunnel junction and a shunt inductor which form a second superconducting loop. The coupler circuit is coupled between the first and second superconducting quantum bits. The coupler circuit is configured to implement an entanglement gate operation between the first and second superconducting quantum bits through exchange interactions between the coupler circuit and the first superconducting quantum bit and the second superconducting quantum bit, when the coupler circuit is driven by a control signal.Type: ApplicationFiled: June 9, 2022Publication date: December 14, 2023Inventors: Aaron Finck, Cihan Kurter, Sarunya Bangsaruntip, Harry Jonathon Mamin, Charles Thomas Rettner, John Blair, George Andrew Keefe
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Publication number: 20230334354Abstract: A superconducting connecting system includes an anti-fuse structure. There is a first superconducting trace having a first segment that is cantilevered over a cavity a substrate. A second superconducting trace having a second segment is cantilevered over the cavity in the substrate. A first auxiliary segment is coupled to the first segment and suspended over the cavity. A second auxiliary segment is coupled to the second segment and suspended over the cavity. The first segment and the second segment face each other and have a predetermined gap therebetween. The first segment and the second segment are configured to receive an output of a laser. An amount of material of the first and second auxiliary segment is based on creating a fuse ball joint that provides an electrical short between the first superconducting trace and the second superconducting trace, upon receiving the output of the laser.Type: ApplicationFiled: April 15, 2022Publication date: October 19, 2023Inventors: Vivekananda P. Adiga, Russell A. Budd, Charles Thomas Rettner, Stephen M. Gates
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Patent number: 11750189Abstract: Devices and/or computer-implemented methods to facilitate a programmable and/or reprogrammable quantum circuit are provided. According to an embodiment, a device can comprise a superconducting coupler device having a superconducting fuse device that is used to alter the coupling of a first quantum computing element and a second quantum computing element.Type: GrantFiled: December 24, 2020Date of Patent: September 5, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Elbert Emin Huang, Charles Thomas Rettner, Michael Justin Beckley, Russell A. Budd, Vivekananda P. Adiga, David C. Mckay, Sarah Elizabeth Sheldon
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Patent number: 11683995Abstract: Techniques regarding lithographic processes for fabricating Josephson junctions are provided. For example, one or more embodiments described herein can comprise a method that can include depositing a first resist layer onto a second resist layer. The first resist layer can include a bridge portion that defines an opening for forming a Josephson junction. The method can also comprise depositing a third resist layer onto the bridge portion. The third resist layer can shield the opening from an angled deposition of a superconducting material during fabrication of the Josephson junction.Type: GrantFiled: August 3, 2020Date of Patent: June 20, 2023Assignee: International Business Machines CorporationInventors: Kenneth P. Rodbell, Leonidas Ernesto Ocola, Charles Thomas Rettner, Mary E Rothwell, Elbert Emin Huang
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Publication number: 20230056913Abstract: An embodiment of the invention may include a spliced stripline structure. The structure may include a first stripline including a signal line located between a top dielectric and a bottom dielectric. The top dielectric is in contact with a top ground plane. The bottom dielectric is in contact with a bottom ground plane. The structure may include a second stripline including a signal line located between a top dielectric and a bottom dielectric. The top dielectric is in contact with a top ground plane. The bottom dielectric is in contact with a bottom ground plane. The structure may include a joined portion connecting the first stripline to the second stripline. The joined portion the first stripline includes the bottom ground plane, the bottom dielectric, and at least one signal line. The joined portion the first stripline includes the bottom ground plane, the bottom dielectric, and at least one signal line.Type: ApplicationFiled: August 17, 2021Publication date: February 23, 2023Inventors: Donald Stimson Bethune, Charles Thomas Rettner
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Publication number: 20230053890Abstract: A structure that includes a signal trace embedded in a dielectric layer, the signal trace including a first contact pad at one end of the signal trace and a second contact pad at the other end of the signal trace. The dielectric layer has a first ground plane on a first surface and a second ground plane on a second opposing surface. A first conducting ground shield wall on a first side of the signal trace connects the first ground plane to the second ground plane. A second conducting ground shield wall on a second side of the signal trace connects the first ground plane to the second ground plane. The first ground plane, the second ground plane, the first conducting ground shield wall, and the second conducting ground shield wall enclose the signal trace.Type: ApplicationFiled: August 17, 2021Publication date: February 23, 2023Inventors: Donald Stimson Bethune, Charles Thomas Rettner
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Publication number: 20220293845Abstract: Systems and techniques that facilitate trimmable inductors for qubit frequency tuning are provided. In various embodiments, a device can comprise a Josephson junction. In various aspects, the Josephson junction can be shunted by a capacitor, and a trimmable inductor can couple the Josephson junction to a pad of the capacitor. In various cases, the trimmable inductor can comprise a first conductive path that includes a severable and/or weldable superconducting bridge and a second conductive path that is in parallel with the first conductive path. In various aspects, severing and/or welding the severable and/or weldable superconducting bridge can controllably change an inductance of the trimmable inductor, which can commensurately change a resonant frequency of a qubit formed by the Josephson junction and the capacitor.Type: ApplicationFiled: March 12, 2021Publication date: September 15, 2022Inventors: Timothy Phung, Charles Thomas Rettner, Harry Jonathon Mamin, Vivekananda P. Adiga, Russell A. Budd
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Publication number: 20220209770Abstract: Devices and/or computer-implemented methods to facilitate a programmable and/or reprogrammable quantum circuit are provided. According to an embodiment, a device can comprise a superconducting coupler device having a superconducting fuse device that is used to alter the coupling of a first quantum computing element and a second quantum computing element.Type: ApplicationFiled: December 24, 2020Publication date: June 30, 2022Inventors: Elbert Emin Huang, Charles Thomas Rettner, Michael Justin Beckley, Russell A. Budd, Vivekananda P. Adiga, David C. Mckay, Sarah Elizabeth Sheldon
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Publication number: 20220190229Abstract: Embodiments are provided for fabrication of superconducting devices using area-selective deposition of a metal nitride. In some embodiments, a method can include providing a thermally treated carbon layer, and selectively depositing a metal nitride using the thermally treated carbon layer for formation of a superconducting device.Type: ApplicationFiled: December 10, 2020Publication date: June 16, 2022Inventors: Rudy J. Wojtecki, Damon Brooks Farmer, Charles Thomas Rettner, Noel Arellano, Alexander Friz, Matthew W. Copel
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Patent number: 11273357Abstract: Embodiments relate to a system, program product, and method for use and an artificial intelligence (AI) platform to identify and analyze physical forces related to sensory input. A sensor operatively coupled to an inertial measurement unit (IMU) is activated. An initial position of the IMU responsive to the sensor activation is captured and movement of the IMU from the initial position is recognized. A comparison is preformed, where the captured initial position is compared to a second position which is correlated with the recognized movement. A score based on the performed comparison is determined and a diagnostic assessment based on the performed comparison and determined score is created. The diagnostic assessment is converted to feedback, where the conversion utilizes real-time communication of an instruction of a second movement position of the IMU. Receipt of the feedback physically conveys a manifestation of the feedback to the apparatus.Type: GrantFiled: August 30, 2018Date of Patent: March 15, 2022Assignee: International Business Machines CorporationInventors: Pawan Chowdhary, Kumar R. Virwani, Charles Thomas Rettner, Bulent N. Kurdi
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Publication number: 20220037578Abstract: Techniques regarding lithographic processes for fabricating Josephson junctions are provided. For example, one or more embodiments described herein can comprise a method that can include depositing a first resist layer onto a second resist layer. The first resist layer can include a bridge portion that defines an opening for forming a Josephson junction. The method can also comprise depositing a third resist layer onto the bridge portion. The third resist layer can shield the opening from an angled deposition of a superconducting material during fabrication of the Josephson junction.Type: ApplicationFiled: August 3, 2020Publication date: February 3, 2022Inventors: Kenneth P. Rodbell, Leonidas Ernesto Ocola, Charles Thomas Rettner, Mary E. Rothwell, Elbert Emin Huang
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Publication number: 20200070033Abstract: Embodiments relate to a system, program product, and method for use and an artificial intelligence (AI) platform to identify and analyze physical forces related to sensory input. A sensor operatively coupled to an inertial measurement unit (IMU) is activated. An initial position of the IMU responsive to the sensor activation is captured and movement of the IMU from the initial position is recognized. A comparison is preformed, where the captured initial position is compared to a second position which is correlated with the recognized movement. A score based on the performed comparison is determined and a diagnostic assessment based on the performed comparison and determined score is created. The diagnostic assessment is converted to feedback, where the conversion utilizes real-time communication of an instruction of a second movement position of the IMU. Receipt of the feedback physically conveys a manifestation of the feedback to the apparatus.Type: ApplicationFiled: August 30, 2018Publication date: March 5, 2020Applicant: International Business Machines CorporationInventors: Pawan Chowdhary, Kumar R. Virwani, Charles Thomas Rettner, Bulent N. Kurdi
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Patent number: 8856693Abstract: A method and a computer system for designing an optical photomask for forming a prepattern opening in a photoresist layer on a substrate wherein the photoresist layer and the prepattern opening are coated with a self-assembly material that undergoes directed self-assembly to form a directed self-assembly pattern. The methods includes: generating a mask design shape from a target design shape; generating a sub-resolution assist feature design shape based on the mask design shape; using a computer to generate a prepattern shape based on the sub-resolution assist feature design shape; and using a computer to evaluate if a directed self-assembly pattern of the self-assembly material based on the prepattern shape is within specified ranges of dimensional and positional targets of the target design shape on the substrate.Type: GrantFiled: September 7, 2012Date of Patent: October 7, 2014Assignee: International Business Machines CorporationInventors: Joy Cheng, Kafai Lai, Wai-Kin Li, Young-Hye Na, Jed Walter Pitera, Charles Thomas Rettner, Daniel Paul Sanders, Da Yang
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Patent number: 8828493Abstract: Methods are disclosed for forming a layered structure comprising a self-assembled material. An initial patterned photoresist layer is treated photochemically, thermally, and/or chemically to form a treated patterned photoresist layer comprising a non-crosslinked treated photoresist. The treated photoresist is insoluble in an organic solvent suitable for casting a material capable of self-assembly. A solution comprising the material capable of self-assembly dissolved in the organic solvent is casted on the treated layer, and the organic solvent is removed. The casted material is allowed to self-assemble with optional heating and/or annealing, thereby forming the layered structure comprising the self-assembled material. The treated photoresist can be removed using an aqueous base and/or a second organic solvent.Type: GrantFiled: December 18, 2009Date of Patent: September 9, 2014Assignee: International Business Machines CorporationInventors: Joy Cheng, William D. Hinsberg, Charles Thomas Rettner, Daniel Paul Sanders
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Patent number: 8734904Abstract: Methods are disclosed for forming topographical features. In one method, a pre-patterned structure is provided which comprises i) a support member having a surface and ii) an element for topographically guiding segregation of a polymer mixture including a first polymer and a second polymer, the element comprising a feature having a sidewall adjoined to the surface. The polymer mixture is disposed on the pre-patterned structure, wherein the disposed polymer mixture has contact with the sidewall and the surface. The first polymer and the second polymer are segregated in a plane parallel to the surface, thereby forming a segregated structure comprising a first polymer domain and a second polymer domain.Type: GrantFiled: November 30, 2010Date of Patent: May 27, 2014Assignees: International Business Machines Corporation, JSR CorporationInventors: Joy Cheng, Hayato Namai, Charles Thomas Rettner, Daniel Paul Sanders, Ratnam Sooriyakumaran
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Patent number: 8343578Abstract: A method and associated structure. A substrate is provided. The substrate has an energetically neutral corrugated surface layer. A film is formed on the corrugated surface layer. The film includes a combination of a di-block copolymer and a stiffening compound. The di-block copolymer includes lamellar microdomains of a first polymer block and lamellar microdomains of a second polymer block. The stiffening compound is dissolved within the first polymer block. At least one lamellar microdomain is removed from the film such that an oriented structure remains on the surface layer.Type: GrantFiled: October 30, 2006Date of Patent: January 1, 2013Assignee: International Business Machines CorporationInventors: Ho-Cheol Kim, Charles Thomas Rettner
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Publication number: 20120331428Abstract: A method and a computer system for designing an optical photomask for forming a prepattern opening in a photoresist layer on a substrate wherein the photoresist layer and the prepattern opening are coated with a self-assembly material that undergoes directed self-assembly to form a directed self-assembly pattern. The methods includes: generating a mask design shape from a target design shape; generating a sub-resolution assist feature design shape based on the mask design shape; using a computer to generate a prepattern shape based on the sub-resolution assist feature design shape; and using a computer to evaluate if a directed self-assembly pattern of the self-assembly material based on the prepattern shape is within specified ranges of dimensional and positional targets of the target design shape on the substrate.Type: ApplicationFiled: September 7, 2012Publication date: December 27, 2012Applicant: International Business Machines CorporationInventors: Joy Cheng, Kafai Lai, Wai-Kin Li, Young-Hye Na, Jed Walter Pitera, Charles Thomas Rettner, Daniel Paul Sanders, Da Yang