Abstract: A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar.

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract: A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar.

Abstract: A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract: A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.

Abstract: A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.

Abstract: The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.

Abstract: An electronic package structure including a first carrier, at least one first electronic element, and a second electronic element is provided. The first carrier has a first carrying surface and a second carrying surface opposite to each other. The first electronic element is disposed above the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The volume of the second electronic element is larger than that of the first electronic element.

Abstract: An electronic package structure including a first carrier, at least one first electronic element, at least one second electronic element, and an encapsulant is provided. The first carrier has a first carrying surface and a second carrying surface opposite to the first carrying surface. The first electronic element is disposed on the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The encapsulant at least covers the first electronic element, the second electronic element, and a part of the first carrier. The space utilization rate of the first carrier of the electronic package structure is higher.

Abstract: A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.

Abstract: A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.

Abstract: The present invention discloses forward power converter. The power converter includes a transformer for transferring an input voltage from a primary side to a secondary side. The secondary side includes a main output voltage loop and at least one auxiliary output loop connected with a magnetic amplifier. A pulse width modulation (PWM) controller controls a switch on the primary side of the transformer for turning on the switch and turning off the main output voltage loop and the auxiliary output voltage loop for storing a magnetizing energy on windings of the secondary side. The magnetic amplifier includes a first and a second magnetization windings controlled by a first and a second control circuits respectively for providing a positive and negative magnetization current to carrying out a bi-directional magnetization process to achieve expanded load range operable for the forward power converter.

Abstract: A flyback power converter includes a transformer for transferring an input voltage from a primary side to a secondary side. The secondary side includes a main output voltage loop and at least one auxiliary output loop connected with a magnetic amplifier. A pulse width modulation (PWM) controller controls a switch on the primary side of the transformer for turning on the switch and turning off the main output voltage loop and the auxiliary output voltage loop for storing a magnetizing energy on windings of the secondary side. The PWM controller further turns off the switch and turning on the main output voltage loop for providing a main voltage output and for magnetizing the magnetic amplifier connected to the auxiliary output voltage loop. The magnetic amplifier functioning as an auxiliary-loop switch for turning on the auxiliary output voltage loop when the magnetic amplifier is saturated with magnetization and turning off the main voltage output voltage loop for providing an auxiliary output voltage.

Abstract: The present invention discloses forward power converter. The power converter includes a transformer for transferring an input voltage from a primary side to a secondary side. The secondary side includes a main output voltage loop and at least one auxiliary output loop connected with a magnetic amplifier. A pulse width modulation (PWM) controller controls a switch on the primary side of the transformer for turning on the switch and turning off the main output voltage loop and the auxiliary output voltage loop for storing a magnetizing energy on windings of the secondary side. The magnetic amplifier includes a first and a second magnetization windings controlled by a first and a second control circuits respectively for providing a positive and negative magnetization current to carrying out a bi-directional magnetization process to achieve expanded load range operable for the forward power converter.

Abstract: The present invention discloses flyback power converter. The flyback power converter includes a transformer for transferring an input voltage from a primary side to a secondary side. The secondary side includes a main output voltage loop and at least one auxiliary output loop connected with a magnetic amplifier. A pulse width modulation (PWM) controller controls a switch on the primary side of the transformer for turning on the switch and turning off the main output voltage loop and the auxiliary output voltage loop for storing a magnetizing energy on windings of the secondary side. The PWM controller further turns off the switch and turning on the main output voltage loop for providing a main voltage output and for magnetizing the magnetic amplifier connected to the auxiliary output voltage loop.

Abstract: A DC-to-DC converter and a method thereof is provided. The DC-to-DC converter includes a power supply for providing a first direct current, a first capacitor, a first switch assembly for converting the first direct current into a first alternating current, a transformer for converting the first alternating current to a second alternating current, a rectifying circuit for converting and rectifying the second alternating current to a second direct current, a filtering circuit, and a range winding assembly for adjusting the output voltage of the second direct current in response to the voltage drop of the first direct current.

Abstract: A DC-to-DC converter and a method thereof is provided. The DC-to-DC converter includes a power supply for providing a first direct current, a first capacitor, a first switch assembly for converting the first direct current into a first alternating current, a transformer for converting the first alternating current to a second alternating current, a rectifying circuit for converting and rectifying the second alternating current to a second direct current, a filtering circuit, and a range winding assembly for adjusting the output voltage of the second direct current in response to the voltage drop of the first direct current.

Abstract: A power invertor system for converting a direct current (DC) input voltage to an alternate current (AC) output voltage with an output analog wave-shape. The power invertor system includes a digitized sequencing circuit for receiving a sequence of clock signals for generating a digitized up-down sequence as a function of the dock signals. The power invertor system further includes a digitized wave signal generating circuit employing the DC input voltage and the digitized up-down sequence to generate a digitized wave signal approximating the analog wave shape of the AC output voltage. The power invertor system further includes a filtering and smoothing circuit for filtering and smoothing the digitized wave signal to generate the AC output voltage with the analog wave shape.