Abstract: Provided is a core structure of an inductor element. The manufacturing method thereof is to embed a magnetic conductor including at least one magnetic conductive layer in a core body and to from a plurality of apertures for passing coils around the magnetic conductor in the core body. Accordingly, the magnetic conductor is designed in the core body by using the integrated circuit carrier board manufacturing process, such that the overall size and thickness of the inductor element can be greatly reduced, thereby facilitating product miniaturization using the inductor element.

Abstract: The present invention provides for an improved method of determining a water out condition in a humidified gases supply apparatus. The method includes a two step process including a primary determination of a water out condition and a secondary determination of a water out condition. This primary determination is made during observation of the normal operation of the apparatus. During the secondary determination the method takes temporary control over the humidifying part of the apparatus. The secondary determination confirms or contradicts the primary determination.

Abstract: A driving mechanism for an optical element is provided, having an optical axis, including a movable part, a fixed part and a driving assembly. The fixed part includes a sidewall parallel to the optical axis. The driving assembly drives the movable part to move relative to the fixed part. The sidewall is not in contact with the driving assembly.

Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An integrated fan-out (InFO) package includes a die, an encapsulant, a redistribution structure, a slot antenna, an insulating layer, a plurality of conductive structures, and an antenna confinement structure. The encapsulant laterally encapsulates the die. The redistribution structure is disposed on the die and the encapsulant. The slot antenna is disposed above the redistribution structure. The insulating layer is sandwiched between the redistribution structure and the slot antenna. The conductive structures and the antenna confinement structure extend from the slot antenna to the redistribution structure.

Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: The present invention provides a semiconductor package structure including a first dielectric layer, an integrated chip, a second power chip, a first patterned conductive layer, a second patterned conductive layer, a first conductive adhesive part, a second conductive adhesive part, a plurality of first conductive connecting elements and a plurality of second conductive connecting elements, and including a build-up circuit structure below, wherein the integrated chip includes a control chip and a first power chip. By means of integrating the control chip and the first power chip into a single chip, volume of semiconductor package structure can be further reduced. In addition, a manufacturing method of a semiconductor package structure is also provided.

Abstract: Systems, devices and methods of manufacturing a system on silicon wafer (SoSW) device and package are described herein. A plurality of functional dies is formed in a silicon wafer. Different sets of masks are used to form different types of the functional dies in the silicon wafer. A first redistribution structure is formed over the silicon wafer and provides local interconnects between adjacent dies of the same type and/or of different types. A second redistribution structure may be formed over the first redistribution layer and provides semi-global and/or global interconnects between non-adjacent dies of the same type and/or of different types. An optional backside redistribution structure may be formed over a second side of the silicon wafer opposite the first redistribution layer. The optional backside redistribution structure may provide backside interconnects between functional dies of different types.

Abstract: A torque sensor includes a sleeve member configured to be mounted on a center shaft, and a tubular sensor body arranged coaxially with the sleeve member. At least one outer surface of the sleeve member includes one or more magnetostrictive elements. The tubular sensor body includes a bobbin for mounting a sensor coil. An induced current in the sensor coil is detected in response to pedaling by a user. The tubular sensor body includes one or more inclined surfaces inclined with respect to a radial direction of the torque sensor, the one or more inclined surfaces being coupled with the sleeve member or the center shaft.

Abstract: The present invention provides a semiconductor package structure including a first dielectric layer, an integrated chip, a second power chip, a first patterned conductive layer, a second patterned conductive layer, a first conductive adhesive part, a second conductive adhesive part, a plurality of first conductive connecting elements and a plurality of second conductive connecting elements, and including a build-up circuit structure below, wherein the integrated chip includes a control chip and a first power chip. By means of integrating the control chip and the first power chip into a single chip, volume of semiconductor package structure can be further reduced. In addition, a manufacturing method of a semiconductor package structure is also provided.

Abstract: The present invention provides for an improved method of determining a water out condition in a humidified gases supply apparatus. The method includes a two step process including a primary determination of a water out condition and a secondary determination of a water out condition. This primary determination is made during observation of the normal operation of the apparatus. During the secondary determination the method takes temporary control over the humidifying part of the apparatus. The secondary determination confirms or contradicts the primary determination.

Abstract: A breathing assistance apparatus is configured with features that improve serviceability of the apparatus. The apparatus can include animations to provide instruction regarding correcting easily-identified fault conditions and to provide instruction regarding routine maintenance routines. The apparatus also can be configured with top level control menus that are obscured in a manner to limit manipulation of the top level control elements by unauthorized users.

Abstract: A surface acoustic wave (SAW) filter package structure includes a dielectric substrate having a dielectric layer, a first patterned conductive layer, a second patterned conductive layer, and a conductive connection layer. The conductive connection layer is electrically connected between the first patterned conductive layer and the second patterned conductive layer, which are disposed at opposite sides of the dielectric layer. The second patterned conductive layer has a finger electrode portion. An active surface of a chip is faced toward the finger electrode portion. A polymer sealing frame is disposed between the chip and the dielectric substrate and surrounds the periphery of the chip to form a chamber together with the chip and the dielectric substrate. The mold sealing layer is disposed on the dielectric substrate and covers the chip and the polymer sealing frame. A manufacturing method of the SAW filter package structure is also disclosed.

Abstract: An integrated fan-out package includes a first redistribution structure, a die, an insulation encapsulation, and at least one first through interlayer via. The first redistribution structure includes a dielectric layer, a feed line at least partially disposed on the dielectric layer and a signal enhancement layer covering the feed line, wherein the signal enhancement layer has a lower dissipation factor (Df) and/or a lower permittivity (Dk) than the dielectric layer. The die is disposed on the first redistribution structure. The insulation encapsulation encapsulates the die. The at least one first TIV is embedded in the insulation encapsulation and the signal enhancement layer.

Abstract: A method for updating access technology information for a Multi-Access (MA) Protocol Data Unit (PDU) session is provided. A User Equipment (UE) establishes an MA PDU session with a mobile communication network over a 3rd Generation Partnership Project (3GPP) access and a non-3GPP access. The UE provides first access technology information indicating to the mobile communication network that the UE is using one of the 3GPP access and the non-3GPP access to get an Internet Protocol (IP) connectivity. The UE detects that the IP connectivity over the one of the 3GPP access and the non-3GPP access is deactivated. The UE provides second access technology information indicating to the mobile communication network that the UE is using the other of the 3GPP access and the non-3GPP access to get another IP connectivity.

Abstract: An audio amplifier with duty ratio control is provided. The audio amplifier comprises a pulse width modulation modulator, a power stage, and a voltage converter. The pulse width modulation modulator is configured to receive an input signal for generating a pulse width modulation signal. The power stage is configured to output an output signal according to a supply voltage and the pulse width modulation signal. The voltage converter is configured to adjust voltage level of the supply voltage according to the pulse width modulation signal. The audio amplifier is configured to adjust the voltage level of the supply voltage when duty ratio of the pulse width modulation signal is greater than a duty ratio threshold.

Abstract: A driving circuit of a loudspeaker includes a periodic signal generation circuit, a signal processing circuit, a class-D amplifier circuit, a current sensing circuit, and a sample and hold circuit. The periodic signal generation circuit is arranged to generate a periodic signal and a control signal. The signal processing circuit is coupled to the periodic signal generation circuit, and is arranged to generate a pre-driving signal. The class-D amplifier circuit is coupled to the signal processing circuit, and is arranged to drive the loudspeaker according to the pre-driving signal. The current sensing circuit is coupled to the class-D amplifier circuit, and is arranged to generate a current sensing signal. The sample and hold circuit is coupled to the periodic signal generation circuit and the current sensing circuit, and is arranged to sample and hold the current sensing signal according to the control signal, to generate a current sampling signal.

Abstract: A respiratory assistance apparatus is configured to provide a heated and humidified glow of gases and has a control system that is configured to detect a fault in the flow path. A flow path is provided for a gases stream through the apparatus from a gas inlet through a blower unit and humidification unit to a gases outlet. A flow rate sensor is provided in the flow path and is configured to sense the flow rate and generate an flow rate signal and/or a motor speed sensor is provided that is configured to sense the motor speed of the blower unit and generate an indicative motor speed signal.