Abstract: A fan module including a first fan, a second fan and a actuator is provided. The first fan has a first pivot portion and a plurality of first fan blades. Each first fan blade has a first blade face. The second fan has a second pivot portion and a plurality of second fan blades corresponding to the first fan blades. Each second fan blade has a second blade face. The second pivot portion is slidably disposed at a containing cavity of the first pivot portion. The actuator is adapted to drive the first fan to rotate. The first fan is adapted to drive the second fan to rotate. When the second pivot portion protrudes out of the containing cavity, a part of each of the second blade faces does not overlap with the corresponding first blade face along a direction perpendicular to the corresponding first blade face.

Abstract: A gait analysis method is implemented by a gait analysis system including a sensing unit, a storing unit storing a plurality of computing programs, and a processing unit electrically connected to the sensing unit and the storing unit, and comprises steps of: sensing a gait by the sensing unit to output a sensing signal, wherein a gait cycle includes a stance phase, a push-off phase, a swing phase and a heel-strike phase; obtaining a signal vector magnitude (SVM) and a signal magnitude subtraction (SMS) by the processing unit according to the sensing signal; identifying the stance phase, push-off phase, swing phase and heel-strike phase according to the SVM and SMS, wherein the push-off phase, swing phase and heel-strike phase are determined according to a dynamic threshold; and implementing a classification of the gait according to the stance phase, push-off phase, swing phase and heel-strike phase.

Abstract: A solid-liquid interdiffusion bonding structure of a thermoelectric module and a fabricating method thereof are provided. The method includes coating a silver, nickel, or copper layer on surfaces of a thermoelectric component and an electrode plate, and then coating a tin layer. A thermocompression treatment is performed on the thermoelectric component and the electrode plate, such that the melted tin layer reacts with the silver, nickel, or copper layer to form a silver-tin intermetallic compound, a nickel-tin intermetallic compound, or a copper-tin intermetallic compound. After cooling, the thermoelectric component and the electrode plate are bonded together.

Abstract: A control circuit of universal serial bus (USB) port includes a charge control unit providing a first operating voltage and a second operating voltage to a first operating voltage end and a second operating voltage end of the USB port, and a first circuit unit coupled to the charge control unit. Furthermore, the first circuit includes a first output end and a second output end. When a external apparatus is inserted into the USB port, the charge control unit connects the first output end and the second output end to a differential positive end and a differential negative end of the USB port, respectively, to enter a rapid charging mode.

Abstract: A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.

Abstract: A maintenance apparatus and a maintenance method for a probe card are provided. The maintenance apparatus includes a first supporting member, a second supporting member, a first clamping member, a second clamping member, and a plurality of locking units. In the maintenance method, the first supporting member and the second supporting member are initially positioned underneath below the two sides of a positioning slice, respectively, and then the first clamping member and the second clamping member are each disposed on the first supporting member and the second supporting member, respectively. First clamping member and first supporting member, and second clamping member and second supporting member are secured together respectively by locking units. Thus two sides of positioning slice are secured tightly and the positioning slice is well fastened. A probe card is also provided. The probe card includes a guide slot having a size corresponding to that of maintenance apparatus.

Abstract: The present invention relates to a method for fabricating a heat dissipating apparatus. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

Abstract: A heat dissipating apparatus has a micro-structure layer. Two highly heat conductive members are provided, each having structured patterns. A highly heat conductive material is coated on the structured patterns by injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having a micro-structure layer. The heat dissipating apparatus includes a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

Abstract: A method for enhancing the mobility of a working fluid in a liquid/gas phase heat dissipating device improves the mobility of the working fluid therein, and further enhancing the heat dissipation capability of the heat dissipating device. The present invention coats a layer on the surface of a capillary structure inside the heat dissipating device to increase the material property on the surface and the coupling force between the working fluid and the capillary structure and decrease the contact angle between the working fluid and the capillary structure, and thus the working fluid has a higher mobility to solve the problem of the high heat flux density of the liquid/gas heat dissipating device and improve the heat dissipation effect. The present invention not only applies to the heat generating electronic components within a limited space, but also applies to other electronic components that require a constant temperature.

Abstract: A heat sink and heat spreader bonding structure includes a metal heat sink, a metal heat spreader, and an eutectic structure formed between the heat sink and the heat spreader by heating the heat sink and the heat spreader to a specific temperature of the eutectic temperature of the heat sink and the heat spreader but below the respective melting point of the heat sink and the heat spreader to cause the internal metal atoms of the heat sink and heat spreader to be rearranged. This bonding structure maintains the heat transfer efficiency of the bonding layer between the heat sink and the heat spreader, eliminates formation of crevice, heat resistance, and oxidation in the bonding layer.

Abstract: The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

Abstract: A method for enhancing the mobility of a working fluid in a liquid/gas phase heat dissipating device improves the mobility of the working fluid therein, and further enhancing the heat dissipation capability of the heat dissipating device. The present invention coats a layer on the surface of a capillary structure inside the heat dissipating device to increase the material property on the surface and the coupling force between the working fluid and the capillary structure and decrease the contact angle between the working fluid and the capillary structure, and thus the working fluid has a higher mobility to solve the problem of the high heat flux density of the liquid/gas heat dissipating device and improve the heat dissipation effect. The present invention not only applies to the heat generating electronic components within a limited space, but also applies to other electronic components that require a constant temperature.

Abstract: A heat-dissipation device adopted for a safety helmet which includes a heat-transfer unit that functions as a heat pipe, a heat-dissipation unit connecting to the heat-transfer unit, a vent formed in a front of the heat-dissipation unit that can be closed and opened alternatively by a shutter unit in order to adjust the capacity of heat-dissipation thereof, and a covering unit made of insulative materials and spreading over the heat-dissipation unit. Whereby the heat-transfer unit provides a kind of two-phase flow that is capable of conducting heat rapidly, so as to remove heat gathered in the helmet and improve the comfort level for the wearer.

Abstract: A heated shoe for generating heat by using hydrocarbon reaction with oxygen is disclosed. The heated shoe is capable to keep warm for long periods, giving out heat by itself, having a simple structure and low costs for parts. The heated shoe includes a shoe body defining a vent hole and a temperature control valve formed on the sole thereof. The sole defines a recess in which a partition defining a through hole is fixed. The partition divides the recess into two areas, one for receiving a fuel vessel of volatile fuel and the other for receiving an activated thermal conductor. Gas volatilized from the fuel penetrates through the through hole of the partition to contact the activated thermal conductor. The volatilized gas reacts with oxygen contained in air entering from the vent hole and generates heat with the catalysis caused by catalyst of the activated thermal conductor. The generated heat is transferred through a thermal pad to the whole shoe.