Patents by Inventor Che-Wei Lin

Che-Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240118316
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Applicant: MPI Corporation
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • Patent number: 11955125
    Abstract: The present disclosure provides an operation method of a smart speaker. The method includes steps as follows. The linked settings among voiceprint registration data, user information and a cast setting of a user device are preloaded by the smart speaker. Wake-up words are received to set an operation mode of the smart speaker and to generate a voiceprint recognition result. In the operation mode, after receiving voice, the voice is converted into voice text and the voiceprint recognition result is compared to voiceprint registration data. When the voiceprint recognition result matches the voiceprint registration data, the user information and the voice text are transmitted to a cloud server, so that the cloud server returns the response message to the smart speaker. According to the cast setting, the response message is sent to the user device.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: April 9, 2024
    Assignee: AmTRAN Technology Co., Ltd.
    Inventors: Che-Chia Ho, Chia-Wei Lin
  • Patent number: 11946300
    Abstract: A lever-operated latch device includes an assembly of a case body, an actuation body mounted on the case body, a linking member and a slide body. The actuation body has a free end and a pivoted end pivotally connected with the case body in cooperation with elastic members. The free end of the actuation body is formed with two protruding arms and an opening section positioned between the protruding arms. An operation section is disposed in the opening section. The linking member has a first end pivotally connected with the free end of the actuation body (or the operation section) and a second end connected with the slide body. When an operator presses the operation section, the actuation body is permitted to move from a closed position to an opened position so as to drive the linking member and the slide body to move.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: April 2, 2024
    Assignee: Fositek Corporation
    Inventors: An Szu Hsu, Chun Han Lin, Che Wei Chang
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11922863
    Abstract: A display panel and a pixel circuit thereof are provided. The pixel circuit includes a driving current generator, a pulse width signal generator, a voltage provider, and a current enabler. The driving current generator provides a driving current. The pulse width signal generator includes an output switch. The output switch is controlled by a control signal, and provides a pulse width signal according to the control signal. The voltage provider adjusts the control signal according to a data write-in signal and a pulse width modulation enable signal. The current enabler provides the driving current to a lighting component according to the pulse width signal and an amplitude modulation enable signal.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: March 5, 2024
    Assignee: AUO Corporation
    Inventors: Che-Wei Tung, Mei-Yi Li, Che-Chia Chang, Yu-Chieh Kuo, Yu-Zuo Lin
  • Patent number: 11874313
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: January 16, 2024
    Assignee: MPI CORPORATION
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • Patent number: 11733267
    Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: August 22, 2023
    Assignee: MPI CORPORATION
    Inventors: Che-Wei Lin, Ting-Ju Wu, Keng-Min Su, Chin-Yi Lin
  • Publication number: 20230176638
    Abstract: An electronic device for switching a standby power of a motherboard includes a universal serial bus (USB) connector, electrically connected to the motherboard, configured to connect an external device; a device detecting module, coupled to the USB connector, configured to determine a power control signal according to a voltage level of the USB connector; and an output switching control module, coupled to the device detecting module and the USB connector, configured to determine whether to cut off the standby power provided by the motherboard to the USB connector or not according to the power control signal.
    Type: Application
    Filed: February 17, 2022
    Publication date: June 8, 2023
    Applicant: Wiwynn Corporation
    Inventors: Hao-Chuan Chu, Kuo-Hua Tsai, Che-Wei Lin, Wei-Chih Chen, Po-Lin Huang, Chia-Hui Chen
  • Publication number: 20230124249
    Abstract: A detection device adapted to a connector is provided herein. The connecter includes a first pin and a second pin, and the first pin and the second pin are physically separated and coupled to a first power respectively. The detection device includes a first transistor, a first resistor, a second transistor, and a bias circuit. The first transistor is coupled between the first pin and the first power. The first resistor is coupled between a gate terminal of the first transistor and the first power. A detection signal is generated at the gate terminal of the first transistor. The second transistor is coupled between the gate terminal of the first transistor and a second power. The bias circuit is coupled between a gate terminal of the second transistor and the first pin.
    Type: Application
    Filed: February 8, 2022
    Publication date: April 20, 2023
    Inventors: Che-Wei LIN, Kuo-Hua TSAI, Sheng-Ting TSAI
  • Patent number: 11625943
    Abstract: A fingerprint sensing apparatus including a first substrate, a light sensing structure, a second substrate, a lens layer, a filler, and a first light shielding layer is provided. The light sensing structure is disposed on a sensing area of the first substrate. The lens layer is disposed on the second substrate. The lens layer has multiple first convex portions and a first concave portion. The filler is disposed between the lens layer and the light sensing structure. The refractive index of the filler is greater than the refractive index of the lens layer. The first light shielding layer is disposed between the second substrate and the lens layer. A solid of the first light shielding layer overlaps the first convex portions of the lens layer. An opening of the first light shielding layer overlaps the first concave portion of the lens layer.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: April 11, 2023
    Assignee: Au Optronics Corporation
    Inventors: Jui-Ping Yu, Che-Wei Lin
  • Patent number: 11619656
    Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: April 4, 2023
    Assignee: MPI CORPORATION
    Inventors: Chin-Yi Lin, Keng-Min Su, Che-Wei Lin, Hsin-Cheng Hung
  • Patent number: 11612744
    Abstract: A head cap with channel identification includes a head cap, channel identification module, a controlling module, and electrical stimulation modules. The head cap includes the channels therein, and the head cap includes brain regions corresponding to the brain areas of the human being. The electrical stimulation modules disposed in the channels, and the channel identification modules disposed around the peripheral of the channels. The controlling module is electrically coupled to the channel identification modules. When the electrical stimulation modules disposed in some of the channels, the channel identification modules around the peripheral of the channels and the electrical stimulation module are constituted a circuit conduction status or a short circuit status, then the channel identification module transmits a signal to the controlling module to determine the desired sites of the electrical stimulation module where is corresponding to one of the brain areas of the human being according to the signal.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: March 28, 2023
    Assignees: TAIPEI MEDICAL UNIVERSITY, NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Shih-Ching Chen, Chih-Wei Peng, Che-Wei Lin, Jia-Jin Chen, Chun-Wei Wu, Samuel Wang, Chun-Ie Wu, Nguyen Van Truong
  • Publication number: 20230052247
    Abstract: A fingerprint sensing apparatus including a first substrate, a light sensing structure, a second substrate, a lens layer, a filler, and a first light shielding layer is provided. The light sensing structure is disposed on a sensing area of the first substrate. The lens layer is disposed on the second substrate. The lens layer has multiple first convex portions and a first concave portion. The filler is disposed between the lens layer and the light sensing structure. The refractive index of the filler is greater than the refractive index of the lens layer. The first light shielding layer is disposed between the second substrate and the lens layer. A solid of the first light shielding layer overlaps the first convex portions of the lens layer. An opening of the first light shielding layer overlaps the first concave portion of the lens layer.
    Type: Application
    Filed: November 4, 2021
    Publication date: February 16, 2023
    Applicant: Au Optronics Corporation
    Inventors: Jui-Ping Yu, Che-Wei Lin
  • Patent number: 11509092
    Abstract: An electron-device protection casing using magnetic connection includes a protection casing for receiving a tablet form electronic device; a device end connecting unit installed in the protection casing for being connected to the electronic device. The device end connecting unit further includes at least one device end magnetic unit which is positioned in the body; the device end magnetic unit serves to be magnetically connected to an external device so that the external connecting unit can be fixedly connected to the external device. The present invention further includes an intermediate connecting unit which further has at least one intermediate magnetic unit positioned for being magnetically connected to the device end magnetic unit; the positions of the device end magnetic units are corresponding to those of the intermediate magnetic units so that the device end magnetic units are attracted by the intermediate magnetic unit.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: November 22, 2022
    Assignee: The Joy Factory, Inc.
    Inventors: Sampson Yang, Yun-Chang Tsui, Che-Wei Lin
  • Publication number: 20220311180
    Abstract: An electron-device protection casing using magnetic connection includes a protection casing for receiving a tablet form electronic device; a device end connecting unit installed in the protection casing for being connected to the electronic device. The device end connecting unit further includes at least one device end magnetic unit which is positioned in the body; the device end magnetic unit serves to be magnetically connected to an external device so that the external connecting unit can be fixedly connected to the external device. The present invention further includes an intermediate connecting unit which further has at least one intermediate magnetic unit positioned for being magnetically connected to the device end magnetic unit; the positions of the device end magnetic units are corresponding to those of the intermediate magnetic units so that the device end magnetic units are attracted by the intermediate magnetic unit.
    Type: Application
    Filed: March 26, 2021
    Publication date: September 29, 2022
    Inventors: Sampson Yang, Yun-Chang Tsui, Che-Wei Lin
  • Patent number: 11402407
    Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: August 2, 2022
    Assignee: MPI Corporation
    Inventors: Zhi-Wei Su, Tzung-Je Tzeng, Wen-Chi Chen, Huo-Kang Hsu, Hsueh-Chih Wu, Sheng-Wei Lin, Chin-Yi Lin, Che-Wei Lin, Jian-Kai Hong, Shu-Jui Chang
  • Publication number: 20220214379
    Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.
    Type: Application
    Filed: December 29, 2021
    Publication date: July 7, 2022
    Applicant: MPI CORPORATION
    Inventors: CHIN-YI LIN, KENG-MIN SU, CHE-WEI LIN, HSIN-CHENG HUNG
  • Publication number: 20220214380
    Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.
    Type: Application
    Filed: January 5, 2022
    Publication date: July 7, 2022
    Applicant: MPI CORPORATION
    Inventors: CHIN-YI LIN, KENG-MIN SU, CHE-WEI LIN, KO-CHUN WU
  • Patent number: 11380090
    Abstract: A method for object recognition at an interactive information system (IIS) includes capturing, using an imaging device of the IIS, a first image of a first representative object which represents a first one or more object disposed about the IIS; analyzing, by a computer processor of the IIS and based on a category model, the first image to determine a first representative category of the first one or more object; retrieving, by the computer processor and based on the first representative category, a first representative object model of a plurality of object models that are stored on a remote server; and analyzing, by the computer processor and based on the first representative object model, the first image to determine a first representative inventory identifier of the first representative object, which represents a first one or more inventory identifier corresponding to the first one or more object respectively.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: July 5, 2022
    Assignee: Flytech Technology Co., Ltd.
    Inventors: Tung-Ying Lee, Yi-Heng Tseng, Tzu-Wei Huang, Che-Wei Lin
  • Patent number: D983681
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: April 18, 2023
    Assignee: MPI CORPORATION
    Inventors: Tzu-Yang Chen, Che-Wei Lin, Chen-Rui Wu