Abstract: An isolation method of active area for semiconductor forms an isolated active area in a substrate. The substrate is a p-type silicon substrate. A pad oxide layer is formed on the substrate. A patterned sacrificial layer and an upper mask layer are formed on the pad oxide layer, where the upper mask layer is formed over the isolation region of the substrate. A gap is formed between the patterned sacrificial layer and the upper mask layer. An implantation process is performed to dope ions into the substrate through the gap, which forms an n-type barrier to surround the active areas. Lastly, the patterned sacrificial layer is stripped, and an anodization process is utilized to convert p-type bulk silicon into porous silicon. Then, an oxidation process is performed to oxidize the porous silicon to form a silicon dioxide isolation region for the active areas.

Abstract: An optical alignment method is for a light-emitting module that includes a housing unit, a light-emitting unit disposed in the housing unit, and a lens unit. The optical alignment method includes: (a) through image-capturing techniques, finding a light-emitting point of the light-emitting unit and a predetermined reference point, and determining a total optical path length between the light-emitting point and an imaging plane; (b) finding a first center line that divides the total optical path length in half; (c) through image-capturing techniques, finding opposite first and second edges of the lens unit, and determining a lens length between the first and second edges; (d) finding a second center line that divides the lens length in half; and (e) assembling the lens unit to the housing unit so that the first and second center lines overlap. A light-emitting module and an assembly method therefor are also disclosed.

Abstract: Capacitors and methods for fabricating the same are provided. An exemplary embodiment of a capacitor comprises a dielectric layer and a first conductive layer thereover. A supporting rib is embedded in the first conductive layer and extends along a first direction. A second conductive layer is embedded in the first conductive layer and extends along a second direction perpendicular with the first direction, wherein a portion of the second conductive layer forms across the supporting rib and is structurally supported by the supporting rib. A capacitor layer is formed between the first and second conductive layers to electrically insulate the first and second conductive layers.

Abstract: A method for centralized link power management control (CLMC), performed by a north-bridge of a processing unit, comprises the following steps. A data transmission status of a bus is monitored. CLMC is activated to configure devices corresponding to the bus in order to speed up data transmission of the bus when detecting that the data transmission status of the bus is continually busy. CLMC is activated to configure devices corresponding to the bus in order to slow down data transmission of the bus when detecting that the data transmission status of the bus is continually idle.

Abstract: A real-time system adapted to a PVD apparatus for monitoring and controlling film uniformity is described. The system includes a shielding plate, a monitoring device, and a data processing program. The shielding plate is disposed on an inner wall of a reaction chamber above a wafer stage. An opening in the center of the shielding plate exposes the wafer. The monitoring device including a scanner and a sensor respectively disposed on opposite sidewalls of the reaction chamber between the shielding plate and the wafer stage is used for measuring the flux of the particles on every portion of the wafer to acquire real-time uniformity data including a function of the wafer position and the flux. The data processing program compares the real-time uniformity data and reference uniformity data, and a feedback signal is outputted to the PVD apparatus to adjust the process parameter thereof for controlling film uniformity.

Abstract: An optical alignment method is for a light-emitting module that includes a housing unit, a light-emitting unit disposed in the housing unit, and a lens unit. The optical alignment method includes: (a) through image-capturing techniques, finding a light-emitting point of the light-emitting unit and a predetermined reference point, and determining a total optical path length between the light-emitting point and an imaging plane; (b) finding a first center line that divides the total optical path length in half; (c) through image-capturing techniques, finding opposite first and second edges of the lens unit, and determining a lens length between the first and second edges; (d) finding a second center line that divides the lens length in half; and (e) assembling the lens unit to the housing unit so that the first and second center lines overlap. A light-emitting module and an assembly method therefor are also disclosed.

Abstract: A method for activating video-audio data in an optical disc includes determining whether a first activation signal is received or not, a program in the optical disc allowing access to partially-featured contents of the video-audio data when the first activation signal is not received, and the program in the optical disc allowing access to fully-featured contents of the video-audio data when the first activation signal is received.

Abstract: The present invention disclosed a multiple display method. A media data is received and a first program corresponding to the media data is displayed on a first frame of a display device. The media data is analyzed to generate a second program according to a predetermined event. The second program is displayed on a second frame of the display device while displaying the first program on the first frame on a real time basis.

Abstract: A method for improving atomic layer deposition (ALD) performance and an apparatus thereof are disclosed. The apparatus alternates the process temperature of the different ALD steps rapidly, and the process temperature of each step is determined in accordance with the specific precursor and the substrate surface used. In case a higher process temperature is needed, a plurality of heating units of the apparatus increases and keeps the temperature of the deposited substrate to complete surface reaction. When the lower process temperature is needful for the next ALD step, the heating units are turned off to reduce the temperature of the deposited substrate and a gas flow puffed to the heater and the deposited substrate to assist in temperature cooling.

Abstract: A light-emitting module includes a base, a connecting unit disposed on the base, a light-emitting unit disposed on the base, and a drive unit electrically coupled to and bridging the connecting unit and the light-emitting unit for driving the light-emitting unit. The base includes a plurality of first bonding pads formed thereon. The connecting unit is electrically coupled to the first bonding pads, and the light-emitting unit is electrically coupled to the first bonding pads via the drive unit and the connecting unit. The connecting unit includes a plurality of connectors aligned in a first direction of the base, and the light-emitting unit includes a plurality of light-emitting elements aligned in the first direction and respectively spaced apart from and aligned with the connectors in a second direction perpendicular to the first direction.

Abstract: A memory initialization method for a plurality of memories. The memories are initialized according to predetermined initial parameters. A first quantity of the memories is detected. Optimum parameters are set according hardware information of the memories. The memories are re-initialized according to the optimum parameters. A second quantity of the memories is detected. The parameters for memory initialization are adjusted when the first quantity and the second quantity are different.

Abstract: An integrated circuit device comprises a substrate, a stack structure including circuit structure having conductive lines positioned on the substrate, a reinforcement structure including at least one supporting member positioned on the substrate and a roof covering the circuit structure and the supporting member and at least one bonding pad positioned on the roof and electrically connected to the conductive lines. A method for preparing an integrated circuit device comprises forming a stack structure including circuit structure having conductive lines on a substrate, forming a reinforcement structure including at least one supporting member on the substrate and a roof covering the supporting member and the circuit structure and forming at least one bonding pad on the roof and electrically connecting to the conductive lines.

Abstract: An integrated circuit device comprises a substrate, a stack structure including circuit structure having conductive lines positioned on the substrate, a reinforcement structure including at least one supporting member positioned on the substrate and a roof covering the circuit structure and the supporting member and at least one bonding pad positioned on the roof and electrically connected to the conductive lines. A method for preparing an integrated circuit device comprises forming a stack structure including circuit structure having conductive lines on a substrate, forming a reinforcement structure including at least one supporting member on the substrate and a roof covering the supporting member and the circuit structure and forming at least one bonding pad on the roof and electrically connecting to the conductive lines.

Abstract: A method for rapidly identifying a point mutation in porcine insulin-like-growth factor 2 intron 7 uses published primers to amplify the target DNA fragments by polymerase chain reaction. The DNA fragments are cloned and sequenced for confirmation and method validation. The key positions of the sequence are modified to generate three primers for amplifying different DNA fragments with different genotypes by PCR to avoid additional restriction enzyme digestion. A long primer is used to specifically amplify the lean muscle mass-enhancing allele, a short primer is used to specifically amplify the lean muscle mass-suppressing allele, and the third primer is shared and anneals to the complementary strand. After PCR and electrophoresis, samples with only the 92 bp band are identified as the CC genotype, samples with only the 72 bp band are identified as the GG genotype, and samples with both 92 bp and 72 bp bands are identified as heterozygotes.

Abstract: A real-time system adapted to a PVD apparatus for monitoring and controlling film uniformity is described. The system includes a shielding plate, a monitoring device, and a data processing program. The shielding plate is disposed on an inner wall of a reaction chamber above a wafer stage. An opening in the center of the shielding plate exposes the wafer. The monitoring device including a scanner and a sensor respectively disposed on opposite sidewalls of the reaction chamber between the shielding plate and the wafer stage is used for measuring the flux of the particles on every portion of the wafer to acquire real-time uniformity data including a function of the wafer position and the flux. The data processing program compares the real-time uniformity data and reference uniformity data, and a feedback signal is outputted to the PVD apparatus to adjust the process parameter thereof for controlling film uniformity.

Abstract: A capacitance structure of a semiconductor device and a method for manufacturing the structure are provided. The capacitance structure comprises a plurality of capacitance elements and a plurality of supports. Each of the capacitance elements has a column, and each of the supports is disposed between two adjacent columns by partially connecting onto the outer surface of each of the two adjacent columns. Thereby, the mechanical properties of the capacitance structure can be enhanced.

Abstract: A light emitting diode comprises a permanent substrate having a chip holding space formed on a first surface of the permanent substrate; an insulating layer and a metal layer sequentially formed on the first surface of the permanent substrate and the chip holding space, wherein the metal layer further comprises a first area and a second area not being contacted to each other; a chip having a first surface attached on a bottom of the chip holding space, contacted to the first area of the metal layer but not contacted to the second area of the metal layer; a filler structure filled between the chip holding space and the chip; and a first electrode formed on a second surface of the chip. The chip comprises a light-emitting region and an electrical connection between the first area of the metal layer and the light emitting region is realized by using a chip-bonding technology.

Abstract: A gas delivering system for an in situ thermal treatment, a thin film deposition and a use of the same are provided. The gas delivering system integrates a thermal treatment system therein so that a thin film deposition and a by rapid thermal annealing can be performed alternatively on a wafer in a reaction chamber. Accordingly, the density of the thin film can be improved and the thermal budget of the process can be reduced.

Abstract: The invention provides an image encoding/decoding device and method. An encoding/decoding architecture of the invention includes: encoders for encoding image data into data blocks; a reordering multiplexer for receiving the data blocks and determining an order by which the data blocks are written into a memory according to an order of an achieved percentage of an encoding progress for each encoder; a memory writing unit, a memory dispatcher, a memory controller, and a memory reading unit, for writing the data blocks into the memory and reading the data blocks from the memory; a request demultiplexer for receiving the read data blocks from the memory reading unit and outputting the received data blocks according to data request signals; and decoders for generating the data request signals, receiving the output data blocks from the request demultiplexer, decoding the received data blocks, and then outputting the decoded data blocks.