Patents by Inventor Chee Hak Teh
Chee Hak Teh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12199884Abstract: A method comprises the steps of receiving input from a user via user interface and selecting a plurality of flits from a plurality of ingress into a plurality of virtual channels followed by selecting the flits from the virtual channels into a plurality of egress based on the input from the user. The selection of the flits into the virtual channels and the egress characterized by the steps of computing default and elevated bandwidths of the virtual channels, computing default and elevated weights of the virtual channels based on the default and elevated bandwidths and generating a weightage lookup table using the default and elevated weights to perform arbitration weightage lookup for the flits with default and elevated priority levels for selecting the flits into the virtual channels and the egress, wherein the flits from the different ingress comprise different default and elevated weight.Type: GrantFiled: December 13, 2022Date of Patent: January 14, 2025Assignee: SKYECHIP SDN BHDInventors: Yeong Tat Liew, Yu Ying Ong, Soon Chieh Lim, Weng Li Leow, Chee Hak Teh
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Patent number: 12164462Abstract: Systems and methods described herein may relate to data transactions involving a microsector architecture. Control circuitry may organize transactions to and from the microsector architecture to, for example, enable direct addressing transactions as well as batch transactions across multiple microsectors. A data path disposed between programmable logic circuitry of a column of microsectors and a column of row controllers may form a micro-network-on-chip used by a network-on-chip to interface with the programmable logic circuitry.Type: GrantFiled: December 23, 2020Date of Patent: December 10, 2024Assignee: ALTERA CORPORATIONInventors: Ilya K. Ganusov, Ashish Gupta, Chee Hak Teh, Sean R. Atsatt, Scott Jeremy Weber, Parivallal Kannan, Aman Gupta, Gary Brian Wallichs
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Patent number: 12153866Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.Type: GrantFiled: May 31, 2023Date of Patent: November 26, 2024Assignee: Altera CorporationInventors: Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang
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Patent number: 12149407Abstract: The present invention relates to a system and method for transferring configuration, management, debug information and asynchronous events between network-on-chip (NOC) and external interface, wherein said system, referred to as secondary network (101), comprises of a plurality of configuration bus (CBUS) network elements such as a master network element (103) and a plurality of basic network elements (105); whereby said secondary network (101) is capable to convey events such as request, acknowledge assertions or de-assertions, saving the need for numerous wires connecting between main NOC elements such as nodes or routers.Type: GrantFiled: December 7, 2022Date of Patent: November 19, 2024Assignee: SKYECHIP SDN BHDInventors: Soon Chieh Lim, Chuen Heong Khuan, Chee Hak Teh
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Patent number: 12125518Abstract: The present invention relates to a method and apparatus of calibrating memory interface, wherein said method and apparatus is able to periodically re-adjust the placement of the receive enable signal in order to have said receive enable signal to be in an optimum position in relation to the DQS signal from an external memory device to achieve maximum timing margin regardless of voltage or temperature drift and/or process aging to the integrated circuit.Type: GrantFiled: April 19, 2022Date of Patent: October 22, 2024Assignee: SkyeChip Sdn BhdInventors: Soon Chieh Lim, Hoong Chin Ng, Ching Liang Ooi, Chee Hak Teh
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Publication number: 20240312909Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.Type: ApplicationFiled: May 21, 2024Publication date: September 19, 2024Inventors: Chee Hak Teh, Chee Seng Leong, Lai Guan Tang, Han Wooi Lim, Hee Kong Phoon
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Publication number: 20240297846Abstract: The present invention discloses a computer-implemented method of data transmission for a Network-on-Chip to allow high performance routing through dynamic allocated buffer. The method comprises the steps of transferring command or data in a form of plurality of flits from a source node to a router and further to a destination node, and transmitting the flits from the destination node back to the router, wherein the flits are packetized for transmission according to channel width and transaction width, sequence, and priority routing through physical and virtual channels.Type: ApplicationFiled: June 14, 2023Publication date: September 5, 2024Applicant: SKYECHIP SDN BHDInventors: Chee Hak TEH, Yu Ying ONG, Soon Chieh LIM, Weng Li LEOW, Yeong Tat LIEW, Chuen Heong KHUAN, Manobindra GANDHI, Muhamad Aidil Bin JAZMI
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Publication number: 20240296140Abstract: Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.Type: ApplicationFiled: May 13, 2024Publication date: September 5, 2024Inventors: Chee Hak Teh, Yu Ying Ong, George Chong Hean Ooi
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Patent number: 12026008Abstract: An integrated circuit die includes input buffer circuits that are enabled during an input mode of operation in response to first control signals to transmit input signals into the integrated circuit die from conductive bumps. Each of the input buffer circuits is coupled to one of the conductive bumps. The integrated circuit die also includes output buffer circuits that are each coupled to one of the conductive bumps. The output buffer circuits are enabled during an output mode of operation in response to second control signals to transmit output signals from the integrated circuit die to the conductive bumps. The input buffer circuits are disabled from transmitting signals during the output mode of operation in response to the first control signals. The output buffer circuits are disabled from transmitting signals during the input mode of operation in response to the second control signals.Type: GrantFiled: October 25, 2022Date of Patent: July 2, 2024Assignee: Altera CorporationInventors: Jeffrey Chromczak, Chooi Pei Lim, Lai Guan Tang, Chee Hak Teh, MD Altaf Hossain, Dheeraj Subbareddy, Ankireddy Nalamalpu
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Publication number: 20240192721Abstract: The present invention relates to a system (100 or 200) for aligning a programmable clock or strobe. The system (100 or 200) comprises a first programmable delay unit (1a) for receiving the programmable clock or strobe, characterized by a second programmable delay unit (1b) connected in parallel to the first programmable delay unit (1a) for receiving the programmable clock or strobe, a switch (2) for switching one of the two programmable delay units (1a or 1b) to service the programmable clock or strobe so as to allow the other programmable delay unit (1a or 1b) to adjust the other programmable clock or strobe, and a control logic component (3) for handling the switching of the switch (2), in which the switch (2) swaps in the adjusted programmable clock or strobe to service a downstream clocktree or strobe path after the programmable clock or strobe is adjusted. The present invention also relates to a method for aligning a programmable clock or strobe.Type: ApplicationFiled: February 17, 2023Publication date: June 13, 2024Applicant: SKYECHIP SDN BHDInventors: TAT HIN TAN, SOON CHIEH LIM, ZHEN PENG CHOK, CHEE HAK TEH, CHEAU NIH TAN
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Patent number: 12009298Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.Type: GrantFiled: April 20, 2023Date of Patent: June 11, 2024Assignee: Intel CorporationInventors: Chee Hak Teh, Chee Seng Leong, Lai Guan Tang, Han Wooi Lim, Hee Kong Phoon
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Patent number: 11995028Abstract: Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.Type: GrantFiled: December 27, 2022Date of Patent: May 28, 2024Assignee: Intel CorporationInventors: Chee Hak Teh, Yu Ying Ong, George Chong Hean Ooi
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Publication number: 20240163223Abstract: The present invention relates to a method (100) for network-on-chip arbitration. The method (100) comprises the steps of receiving input from a user via user interface and selecting a plurality of flits from a plurality of ingress into a plurality of virtual channels followed by selecting the flits from the virtual channels into a plurality of egress based on the input from the user. The selection of the flits into the virtual channels and the egress characterized by the steps of computing default and elevated bandwidths of the virtual channels, computing default and elevated weights of the virtual channels based on the default and elevated bandwidths and generating a weightage lookup table using the default and elevated weights to perform arbitration weightage lookup for the flits with default and elevated priority levels for selecting the flits into the virtual channels and the egress, wherein the flits from the different ingress comprise different default and elevated weight.Type: ApplicationFiled: December 13, 2022Publication date: May 16, 2024Applicant: SKYECHIP SDN BHDInventors: YEONG TAT LIEW, YU YING ONG, SOON CHIEH LIM, WENG LI LEOW, CHEE HAK TEH
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Patent number: 11979152Abstract: An integrated circuit may include integrated memory that is formed from a chain of memory blocks. Each memory block may have configurable input and output circuits. The configurable input and output circuits may be interposed between memory circuitry such as a memory array from circuitry external to the memory circuitry. The configurable input and output circuits may have upstream and downstream memory block connection ports. In such a way, configurable input and output circuits in a first memory block may pass control and address signals and data to configurable input and output circuits in a second memory block. By using the configurable input and output circuits, the integrated memory in the integrated circuit may operate to accommodate large bandwidth flows without using the general routing fabric of the integrated circuit.Type: GrantFiled: February 22, 2021Date of Patent: May 7, 2024Assignee: Intel CorporationInventors: Chang Kian Tan, Chee Hak Teh
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Publication number: 20240129183Abstract: The present invention relates to a system and method for transferring configuration, management, debug information and asynchronous events between network-on-chip (NOC) and external interface, wherein said system, referred to as secondary network (101), comprises of a plurality of configuration bus (CBUS) network elements such as a master network element (103) and a plurality of basic network elements (105); whereby said secondary network (101) is capable to convey events such as request, acknowledge assertions or de-assertions, saving the need for numerous wires connecting between main NOC elements such as nodes or routers.Type: ApplicationFiled: December 7, 2022Publication date: April 18, 2024Inventors: Soon Chieh LIM, Chuen Heong KHUAN, Chee Hak TEH
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Publication number: 20240070039Abstract: The present invention relates to a method of debugging a targeted area or the whole network-on-chip (NOC) (101), whereby said targeted area or the whole NOC is triggered to enter into a freeze state before capturing of the state of the targeted area or the whole NOC (101) and unloading of the debug information, before finally said targeted area or the whole NOC is triggered to enter into an unfreeze state to allow forward progress to resume, using existing buffer storage, thus allowing user to debug and identify the source of issue without requiring a significant amount of extra storage.Type: ApplicationFiled: October 7, 2022Publication date: February 29, 2024Inventors: Yu Ying ONG, Chee Hak TEH, Soon Chieh LIM, Weng Li LEOW, Muhamad Aidil BIN JAZMI, Yeong Tat LIEW
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Publication number: 20230409515Abstract: A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing logic to perform interface initialization and margining operations. Each UIB may perform simultaneous accesses to a daughter die across one or more channels. Each UIB may also include multiple phase-locked loop circuits for providing different clock signals to different portions of the UIB and a 2× clock phase generation logic. Each UIB may include multiple IO modules, each of which may optionally include its own duty cycle correction circuit. Each IO module may include buffer circuits, each of which may have a de-emphasis control logic for adjusting buffer drive strength.Type: ApplicationFiled: August 28, 2023Publication date: December 21, 2023Inventors: Chee Hak Teh, Arifur Rahman
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Patent number: 11829643Abstract: A memory controller system (and method of pre-scheduling memory transaction) for a storage device comprising a linked-list controller; a plurality of command buffers to store read commands or write commands, and an arbiter to issue command. Each command buffer containing variables set by the linked-list controller. The linked-list controller is configured to execute commands in sequence independent of logical command buffer sequence. The command buffer is configured to support read commands with maximum number of write commands. The linked-list controller is configured to merge multiple write commands that are going to the same address and snarfs read commands from write commands if both commands are going to the same address and the read commands that are snarfed are loaded into a separate command buffer. The variables contained in each of the command buffer indicates status and dependency of the command buffer to create a link forming a command sequence.Type: GrantFiled: December 27, 2021Date of Patent: November 28, 2023Assignee: SKYECHIP SDN BHDInventors: Chee Hak Teh, Yu Ying Ong, Weng Li Leow, Muhamad Aidil Bin Jazmi
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Publication number: 20230378061Abstract: The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.Type: ApplicationFiled: April 20, 2023Publication date: November 23, 2023Inventors: Chee Hak Teh, Chee Seng Leong, Lai Guan Tang, Han Wooi Lim, Hee Kong Phoon
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Publication number: 20230306173Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.Type: ApplicationFiled: May 31, 2023Publication date: September 28, 2023Inventors: Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang